JPH032658U - - Google Patents
Info
- Publication number
- JPH032658U JPH032658U JP6260489U JP6260489U JPH032658U JP H032658 U JPH032658 U JP H032658U JP 6260489 U JP6260489 U JP 6260489U JP 6260489 U JP6260489 U JP 6260489U JP H032658 U JPH032658 U JP H032658U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- terminal
- view
- hole
- bulge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図はこの考案の一実施例である
半導体パツケージの外観斜視図及び部分側面図、
第３図は本実施例の半導体パツケージの実装状態
を示す部分断面図、第４図は他の実施例の半導体
パツケージの部分側面図、第５図及び第６図は従
来の外観斜視図及び部分側面図、第７図及び第８
図は従来の半導体パツケージの実装状態を示す部
分断面図及び外観斜視図である。
１……半導体パツケージ、４……プリント基板
、４ａ……スルーホール、６……端子、７……膨
出部。なお、図中同一符号は同一、又は相当部分
を示す。
1 and 2 are an external perspective view and a partial side view of a semiconductor package which is an embodiment of this invention,
FIG. 3 is a partial sectional view showing the mounting state of the semiconductor package of this embodiment, FIG. 4 is a partial side view of the semiconductor package of another embodiment, and FIGS. 5 and 6 are a perspective view and a portion of the conventional external appearance. Side view, Figures 7 and 8
The figures are a partial sectional view and an external perspective view showing the mounting state of a conventional semiconductor package. 1...Semiconductor package, 4...Printed circuit board, 4a...Through hole, 6...Terminal, 7...Bulging portion. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
半導体パツケージにおいて、上記端子は弾性を有
するパイプ状部材からなり、当該端子における基
板側スルーホールに対応する個所に、膨出部を形
成したことを特徴とする半導体パツケージ。 A semiconductor package equipped with a terminal protruding downward from the bottom or side surface, wherein the terminal is made of an elastic pipe-like member, and a bulge is formed at a location corresponding to the through hole on the substrate side of the terminal. Semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6260489U JPH032658U (en) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6260489U JPH032658U (en) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032658U true JPH032658U (en) | 1991-01-11 |
Family
ID=31591906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6260489U Pending JPH032658U (en) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032658U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49145833U (en) * | 1973-04-18 | 1974-12-17 | ||
| JP2007246094A (en) * | 2006-03-13 | 2007-09-27 | Gunze Ltd | Workpiece guide device for flexible workpiece |
| JP2014045070A (en) * | 2012-08-27 | 2014-03-13 | Fujitsu Ltd | Electronic device, method for manufacturing electronic device, and method for unit test of electronic component |
-
1989
- 1989-05-30 JP JP6260489U patent/JPH032658U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49145833U (en) * | 1973-04-18 | 1974-12-17 | ||
| JP2007246094A (en) * | 2006-03-13 | 2007-09-27 | Gunze Ltd | Workpiece guide device for flexible workpiece |
| JP2014045070A (en) * | 2012-08-27 | 2014-03-13 | Fujitsu Ltd | Electronic device, method for manufacturing electronic device, and method for unit test of electronic component |