JPH02136332U - - Google Patents
Info
- Publication number
- JPH02136332U JPH02136332U JP4638089U JP4638089U JPH02136332U JP H02136332 U JPH02136332 U JP H02136332U JP 4638089 U JP4638089 U JP 4638089U JP 4638089 U JP4638089 U JP 4638089U JP H02136332 U JPH02136332 U JP H02136332U
- Authority
- JP
- Japan
- Prior art keywords
- stud
- integrated circuit
- screw hole
- fits
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す図、第２図は
第１図の拡大詳細図である。
１……プリント配線板、２……集積回路ケース
、３，４……スタツド、５……ネジ穴、６……ネ
ジ。
FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is an enlarged detailed view of FIG. 1. 1...Printed wiring board, 2...Integrated circuit case, 3, 4...Stud, 5...Screw hole, 6...Screw.
Claims (1)
に取り付けられたネジ穴を有するスタツドと、前
記スタツドのネジ穴に嵌合するネジ部を有するス
タツドとを含むことを特徴とするヒートシンク構
造。 A heat sink structure comprising: a stud having a screw hole attached to a heat emitting surface of an integrated circuit case in which an integrated circuit is mounted; and a stud having a threaded portion that fits into the screw hole of the stud.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4638089U JPH02136332U (en) | 1989-04-20 | 1989-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4638089U JPH02136332U (en) | 1989-04-20 | 1989-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02136332U true JPH02136332U (en) | 1990-11-14 |
Family
ID=31561415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4638089U Pending JPH02136332U (en) | 1989-04-20 | 1989-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02136332U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6108026B1 (en) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | Pressure contact type semiconductor module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115179A (en) * | 1977-03-18 | 1978-10-07 | Mitsubishi Electric Corp | Cooling method of circuit parts |
-
1989
- 1989-04-20 JP JP4638089U patent/JPH02136332U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115179A (en) * | 1977-03-18 | 1978-10-07 | Mitsubishi Electric Corp | Cooling method of circuit parts |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6108026B1 (en) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | Pressure contact type semiconductor module |