JPH01130594U - - Google Patents
Info
- Publication number
- JPH01130594U JPH01130594U JP2771788U JP2771788U JPH01130594U JP H01130594 U JPH01130594 U JP H01130594U JP 2771788 U JP2771788 U JP 2771788U JP 2771788 U JP2771788 U JP 2771788U JP H01130594 U JPH01130594 U JP H01130594U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting plate
- heat sink
- engaging portion
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案に係る電子部品の取付構造を示
す分離状態の斜視図、第２図は同ヒートシンクの
要部断面図、第３図は同取付状態の断面図、第４
図は従来例を示し、プリント回路基板へ電子部品
を固着した取付板の装着状態を示す斜視図、第５
図は同取付状態の断面図である。
１……プリント回路基板、３……集積回路、３
ｂ……貫通孔、６……ネジ、１０……取付板、１
０ｃ……係合片、１０ｂ……ネジ孔、１１……ヒ
ートシンク、１１ａ……受溝、１１ｂ……ネジ孔
。
FIG. 1 is a perspective view of the electronic component mounting structure according to the present invention in a separated state, FIG.
The figure shows a conventional example;
The figure is a sectional view of the same installed state. 1...Printed circuit board, 3...Integrated circuit, 3
b...Through hole, 6...Screw, 10...Mounting plate, 1
0c... Engagement piece, 10b... Screw hole, 11... Heat sink, 11a... Receiving groove, 11b... Screw hole.
Claims (1)
もにプリント回路基板に装着し、かつ、前記電子
部品に穿設された貫通孔を介して取付板をヒート
シンクにネジ止めしてある電子部品の取付構造に
おいて、前記取付板の縁に係合部を形成し、その
係合部をヒートシンクに形成された受溝に嵌め合
わせてあることを特徴とする電子部品の取付構造
。 A mounting structure for an electronic component, in which a mounting plate to which an electronic component is fixed is attached to a printed circuit board together with the electronic component, and the mounting plate is screwed to a heat sink through a through hole drilled in the electronic component. A mounting structure for an electronic component, characterized in that an engaging portion is formed on the edge of the mounting plate, and the engaging portion is fitted into a receiving groove formed in a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2771788U JPH01130594U (en) | 1988-03-02 | 1988-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2771788U JPH01130594U (en) | 1988-03-02 | 1988-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130594U true JPH01130594U (en) | 1989-09-05 |
Family
ID=31250451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2771788U Pending JPH01130594U (en) | 1988-03-02 | 1988-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130594U (en) |
-
1988
- 1988-03-02 JP JP2771788U patent/JPH01130594U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01130594U (en) | ||
| JPH0291391U (en) | ||
| JPH02131395U (en) | ||
| JPS6262446U (en) | ||
| JPH01104785U (en) | ||
| JPH01163390U (en) | ||
| JPH0227787U (en) | ||
| JPH0332490U (en) | ||
| JPH02136332U (en) | ||
| JPH0341992U (en) | ||
| JPS58138394U (en) | Mounting structure of heat sink on printed circuit board | |
| JPH0330479U (en) | ||
| JPS6377375U (en) | ||
| JPS5937016U (en) | rice cooker | |
| JPS622255U (en) | ||
| JPS631398U (en) | ||
| JPH0275795U (en) | ||
| JPH01153697U (en) | ||
| JPH01154689U (en) | ||
| JPS61164010U (en) | ||
| JPS6161803U (en) | ||
| JPS63170996U (en) | ||
| JPH0227784U (en) | ||
| JPS61127688U (en) | ||
| JPS6186946U (en) |