JPH0330479U - - Google Patents

Info

Publication number
JPH0330479U
JPH0330479U JP8924289U JP8924289U JPH0330479U JP H0330479 U JPH0330479 U JP H0330479U JP 8924289 U JP8924289 U JP 8924289U JP 8924289 U JP8924289 U JP 8924289U JP H0330479 U JPH0330479 U JP H0330479U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
semiconductor device
mounting flange
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8924289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8924289U priority Critical patent/JPH0330479U/ja
Publication of JPH0330479U publication Critical patent/JPH0330479U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Waveguide Connection Structure (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の部分分解斜視図、
第2図は従来の実装構造の部分分解斜視図である
。 1……MIC、2……プリント回路基板、3…
…ケース、4……取付フランジ、5……取付穴、
6……搭載穴、7……ねじ、8……ねじ穴、9…
…固定穴、10……ねじ、11……スタツドボル
ト、12……穴、13……ナツト。
FIG. 1 is a partially exploded perspective view of an embodiment of the present invention;
FIG. 2 is a partially exploded perspective view of a conventional mounting structure. 1...MIC, 2...Printed circuit board, 3...
...Case, 4...Mounting flange, 5...Mounting hole,
6...Mounting hole, 7...Screw, 8...Screw hole, 9...
...fixing hole, 10...screw, 11...stud bolt, 12...hole, 13...nut.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント回路基板にマイクロ波半導体装置を搭
載し、かつこのプリント回路基板をケースに固定
する実装構造において、前記マイクロ波半導体装
置には取付フランジを一体に設け、この取付フラ
ンジ及び前記プリント回路基板にそれぞれ設けた
穴を挿通させたねじでマイクロ波半導体装置及び
プリント回路基板をケースに共締めしたことを特
徴とする半導体装置の実装構造。
In a mounting structure in which a microwave semiconductor device is mounted on a printed circuit board and this printed circuit board is fixed to a case, a mounting flange is integrally provided on the microwave semiconductor device, and a mounting flange is provided on the mounting flange and the printed circuit board, respectively. A mounting structure for a semiconductor device, characterized in that a microwave semiconductor device and a printed circuit board are fastened together to a case using a screw inserted through a provided hole.
JP8924289U 1989-07-31 1989-07-31 Pending JPH0330479U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8924289U JPH0330479U (en) 1989-07-31 1989-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8924289U JPH0330479U (en) 1989-07-31 1989-07-31

Publications (1)

Publication Number Publication Date
JPH0330479U true JPH0330479U (en) 1991-03-26

Family

ID=31638833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8924289U Pending JPH0330479U (en) 1989-07-31 1989-07-31

Country Status (1)

Country Link
JP (1) JPH0330479U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011239602A (en) * 2010-05-12 2011-11-24 Nissan Motor Co Ltd Power conversion device and vibration suppression structure for circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011239602A (en) * 2010-05-12 2011-11-24 Nissan Motor Co Ltd Power conversion device and vibration suppression structure for circuit board

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