JPH0341992U - - Google Patents
Info
- Publication number
- JPH0341992U JPH0341992U JP10204589U JP10204589U JPH0341992U JP H0341992 U JPH0341992 U JP H0341992U JP 10204589 U JP10204589 U JP 10204589U JP 10204589 U JP10204589 U JP 10204589U JP H0341992 U JPH0341992 U JP H0341992U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- hole
- screw hole
- generating electronic
- mounting arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図は本案の実施例を示すもので、第１図は各部
材の斜視図、第２図は放熱板の一部裁断した正面
図、第３図は放熱板の基板への取り付け過程を示
す断面図、第４図及び第５図は組み込み状態の断
面図である。
１……放熱板、１１……取付腕、１２……螺孔
、２……回路基板、２１……透孔、２２……ビス
用孔、２３……リード用穴、３……発熱電子部品
、３１……リード、３２……ビス孔、４……止着
用ビス。
The figures show an example of the present invention. Figure 1 is a perspective view of each member, Figure 2 is a partially cutaway front view of the heat sink, and Figure 3 is a cross section showing the process of attaching the heat sink to the board. 4 and 5 are cross-sectional views of the assembled state. 1... Heat sink, 11... Mounting arm, 12... Screw hole, 2... Circuit board, 21... Through hole, 22... Hole for screw, 23... Hole for lead, 3... Heat generating electronic component , 31...Lead, 32...Screw hole, 4...Fixing screw.
Claims (1)
放熱部材を前記発熱電子部品に付設する組み込み
構造に於て、放熱部材に前記基板の厚さと対応せ
しめた鉤状の取付腕を押し抜き形成すると共に、
該取付腕先部にバーリング加工による螺孔を設け
、別に前記基板に取付腕が貫通し得る大きさの透
孔を設けると共に、透孔近傍にビス用穴を設け、
放熱板の取付腕を前記透孔を貫通せしめると共に
横方に移動させビス用穴と螺孔を一致せしめ、発
熱電子部品を螺孔に螺合せしめる止着用ビスで放
熱板に装着してなることを特徴とする発熱電子部
品の組み込み構造。 When mounting heat generating electronic components on a circuit board,
In the built-in structure in which a heat dissipation member is attached to the heat-generating electronic component, a hook-shaped mounting arm corresponding to the thickness of the board is punched and formed on the heat dissipation member, and
A screw hole is provided at the tip of the mounting arm by burring, a through hole of a size that the mounting arm can pass through is separately provided in the substrate, and a screw hole is provided near the through hole,
The mounting arm of the heat sink is passed through the through hole and moved laterally to align the screw hole with the screw hole, and the heat generating electronic component is attached to the heat sink with a fixing screw that screws into the screw hole. A built-in structure of heat-generating electronic components featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10204589U JPH0341992U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10204589U JPH0341992U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341992U true JPH0341992U (en) | 1991-04-22 |
Family
ID=31650965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10204589U Pending JPH0341992U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341992U (en) |
-
1989
- 1989-08-31 JP JP10204589U patent/JPH0341992U/ja active Pending