JPH02789U - - Google Patents
Info
- Publication number
- JPH02789U JPH02789U JP7775388U JP7775388U JPH02789U JP H02789 U JPH02789 U JP H02789U JP 7775388 U JP7775388 U JP 7775388U JP 7775388 U JP7775388 U JP 7775388U JP H02789 U JPH02789 U JP H02789U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- holder
- engaging portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の放熱板取付装置の一実施例を
示すもので、Ａは斜視図、Ｂは断面図、第２図は
本考案の放熱板取付装置の取付け工程を示すもの
で、Ａは斜視図、Ｂ，Ｃは断面図、第３図は従来
の放熱板取付装置の構成を示す斜視図である。
１……ＩＣ、２……ＩＣホルダー、３……放熱
板、４……固定ネジ、５……固定ネジ、６……プ
リント基板、１０……ＩＣホルダー、１１……突
起部、１１ａ……テーパ部、１２……放熱板、１
３……係合部、１３ａ……テーパ部、１４……プ
リント基板、１５……固定ネジ貫通用の孔、１６
……ネジ取付け部、１７……固定ネジ、１８……
ネジ取付け部。
FIG. 1 shows an embodiment of the heat sink mounting device of the present invention, A is a perspective view, B is a sectional view, and FIG. 2 is a diagram showing the installation process of the heat sink mounting device of the present invention. 3 is a perspective view, B and C are sectional views, and FIG. 3 is a perspective view showing the configuration of a conventional heat sink mounting device. 1...IC, 2...IC holder, 3...heat sink, 4...fixing screw, 5...fixing screw, 6...printed circuit board, 10...IC holder, 11...protrusion, 11a... Tapered part, 12... Heat sink, 1
3... Engaging portion, 13a... Tapered portion, 14... Printed circuit board, 15... Fixing screw penetration hole, 16
...Screw attachment part, 17...Fixing screw, 18...
Screw mounting part.
Claims (1)
ホルダーと放熱板によつて挟持して支持するもの
において、 前記放熱板に、プリント基板に対向する傾斜面
を有する係合部を設け、また、前記ホルダーに、
この係合部と係合する傾斜部を形成した突起部を
設けたことを特徴とする放熱板取付装置。[Claims for Utility Model Registration] A heat generating component mounted on a printed circuit board is sandwiched and supported by a supporting holder and a heat sink, wherein the heat sink has an inclined surface facing the printed circuit board. an engaging portion is provided, and the holder is provided with an engaging portion;
A heat dissipation plate mounting device characterized in that a protrusion having an inclined portion that engages with the engagement portion is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7775388U JPH0537507Y2 (en) | 1988-06-14 | 1988-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7775388U JPH0537507Y2 (en) | 1988-06-14 | 1988-06-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02789U true JPH02789U (en) | 1990-01-05 |
| JPH0537507Y2 JPH0537507Y2 (en) | 1993-09-22 |
Family
ID=31302717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7775388U Expired - Lifetime JPH0537507Y2 (en) | 1988-06-14 | 1988-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537507Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013062455A (en) * | 2011-09-15 | 2013-04-04 | Hitachi Automotive Systems Ltd | Motor drive device |
| WO2014020806A1 (en) * | 2012-08-03 | 2014-02-06 | 富士電機株式会社 | Cooling structure and power converter |
-
1988
- 1988-06-14 JP JP7775388U patent/JPH0537507Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013062455A (en) * | 2011-09-15 | 2013-04-04 | Hitachi Automotive Systems Ltd | Motor drive device |
| WO2014020806A1 (en) * | 2012-08-03 | 2014-02-06 | 富士電機株式会社 | Cooling structure and power converter |
| JPWO2014020806A1 (en) * | 2012-08-03 | 2016-07-21 | 富士電機株式会社 | Cooling structure and power conversion device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537507Y2 (en) | 1993-09-22 |
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