JPS61157395U - - Google Patents
Info
- Publication number
- JPS61157395U JPS61157395U JP4186985U JP4186985U JPS61157395U JP S61157395 U JPS61157395 U JP S61157395U JP 4186985 U JP4186985 U JP 4186985U JP 4186985 U JP4186985 U JP 4186985U JP S61157395 U JPS61157395 U JP S61157395U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- heat
- metal material
- generating component
- board units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007769 metal material Substances 0.000 claims 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の実施例を一部破断して示す斜
視図、第２図は本考案の異なる実施例を一部破断
して示す斜視図、第３図は従来方法を一部破断し
て示す斜視図である。
図において、１，１０はケース、１ａ，１０ａ
は側板、２は切り又欠き、３はプリント板ユニツ
ト、４は電子部品、４ａ，４ｂは半導体部品、５
ａ，５ｂは放熱板、６〜９はコネクタ、１１はバ
ツクパネル、１２，１４はフレームを示す。
Fig. 1 is a partially cutaway perspective view of an embodiment of the present invention, Fig. 2 is a partially cutaway perspective view of a different embodiment of the present invention, and Fig. 3 is a partially cutaway perspective view of a conventional method. FIG. In the figure, 1 and 10 are cases, 1a and 10a
is a side plate, 2 is a notch or notch, 3 is a printed board unit, 4 is an electronic component, 4a and 4b are semiconductor components, 5
A and 5b are heat sinks, 6 to 9 are connectors, 11 is a back panel, and 12 and 14 are frames.
Claims (1)
トと、該プリント板ユニツトが収容される金属材
より成るケースと、該ケースが取り付けられる金
属材より成るフレームとで構成される装置におい
て、前記ケースまたはフレームの内側面に発熱部
品を装着することを特徴とする発熱部品の実装機
構。 In an apparatus comprising a plurality of printed board units on which electronic components are mounted, a case made of a metal material in which the printed board units are housed, and a frame made of a metal material to which the cases are attached, the case or the frame A heat-generating component mounting mechanism characterized by mounting a heat-generating component on the inner surface of the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4186985U JPS61157395U (en) | 1985-03-22 | 1985-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4186985U JPS61157395U (en) | 1985-03-22 | 1985-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61157395U true JPS61157395U (en) | 1986-09-30 |
Family
ID=30552093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4186985U Pending JPS61157395U (en) | 1985-03-22 | 1985-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61157395U (en) |
-
1985
- 1985-03-22 JP JP4186985U patent/JPS61157395U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61157395U (en) | ||
| JPS6422093U (en) | ||
| JPH0252393U (en) | ||
| JPH02789U (en) | ||
| JPS587396U (en) | Circuit board for heat generating parts | |
| JPH0197593U (en) | ||
| JPS606347U (en) | time switch device | |
| JPH0197594U (en) | ||
| JPS63149544U (en) | ||
| JPS6411549U (en) | ||
| JPS5967993U (en) | electronic equipment housing | |
| JPH0465493U (en) | ||
| JPH0341993U (en) | ||
| JPS6157533U (en) | ||
| JPS58188509U (en) | heater | |
| JPH0415246U (en) | ||
| JPH0241490U (en) | ||
| JPS6310596U (en) | ||
| JPS6073295U (en) | Mounting device for heat generating parts | |
| JPS62170696U (en) | ||
| JPH0227759U (en) | ||
| JPS62192693U (en) | ||
| JPS61192495U (en) | ||
| JPS60121696U (en) | Heat dissipation structure of printed circuit board mounting case | |
| JPH02110392U (en) |