JPS6157533U - - Google Patents

Info

Publication number
JPS6157533U
JPS6157533U JP14155784U JP14155784U JPS6157533U JP S6157533 U JPS6157533 U JP S6157533U JP 14155784 U JP14155784 U JP 14155784U JP 14155784 U JP14155784 U JP 14155784U JP S6157533 U JPS6157533 U JP S6157533U
Authority
JP
Japan
Prior art keywords
integrated circuit
metal case
circuit element
heat
housed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14155784U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14155784U priority Critical patent/JPS6157533U/ja
Publication of JPS6157533U publication Critical patent/JPS6157533U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す斜視図、第2図
はその要部を抽出・拡大して示す分解斜視図、第
3図は従来技術を示す斜視図、第4図は従来の放
熱手段を説明するための説明図である。 図面中、10は金属ケース、12a,12b,
12cはプリント基板、13a,13bは集積回
路素子、14は放熱板アダプタである。
Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is an exploded perspective view showing the main parts extracted and enlarged, Fig. 3 is a perspective view showing the prior art, and Fig. 4 is a conventional heat dissipation method. It is an explanatory diagram for explaining a means. In the drawing, 10 is a metal case, 12a, 12b,
12c is a printed circuit board, 13a and 13b are integrated circuit elements, and 14 is a heat sink adapter.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路素子が搭載されたプリンチ基板が金属
ケース内に納められる装置において、伝熱材でな
る放熱板アダプタの一端を前記集積回路素子にそ
の他端を前記金属ケースにそれぞれ接触させて取
り付けたことを特徴とする集積回路素子の放熱構
造。
In a device in which a printed circuit board on which an integrated circuit element is mounted is housed in a metal case, one end of a heat sink adapter made of a heat transfer material is attached to the integrated circuit element with the other end in contact with the metal case. Features a heat dissipation structure for integrated circuit elements.
JP14155784U 1984-09-20 1984-09-20 Pending JPS6157533U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14155784U JPS6157533U (en) 1984-09-20 1984-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14155784U JPS6157533U (en) 1984-09-20 1984-09-20

Publications (1)

Publication Number Publication Date
JPS6157533U true JPS6157533U (en) 1986-04-17

Family

ID=30699894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14155784U Pending JPS6157533U (en) 1984-09-20 1984-09-20

Country Status (1)

Country Link
JP (1) JPS6157533U (en)

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