JPS6054396U - Heat dissipation structure of electronic equipment - Google Patents
Heat dissipation structure of electronic equipmentInfo
- Publication number
- JPS6054396U JPS6054396U JP14626183U JP14626183U JPS6054396U JP S6054396 U JPS6054396 U JP S6054396U JP 14626183 U JP14626183 U JP 14626183U JP 14626183 U JP14626183 U JP 14626183U JP S6054396 U JPS6054396 U JP S6054396U
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- dissipation structure
- heat dissipation
- heat
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の放熱構造を用いたユニットの断面図、第
２図は同じ〈従来構造のプリント板の斜視図、第３図ａ
は本考案の実施例によるユニットの平面断面図、第３図
すは本考案の実施例に係る放熱構造を組立て順に分解し
て示した概略図、第４図および第５図はそれぞれ本考案
に係るユニット筐体の各種実施例を示した斜視図である
。
１・・・ユニット、２・・・プリント板、３・・・半導
体素子、５．１１・・・ヒートシック、８．１２・・・
ヒート ゛パイプ、１０・・・筐体、８ｂ・・
・テーパ凸部、１３・・・テーパ凹部。Figure 1 is a cross-sectional view of a unit using a conventional heat dissipation structure, Figure 2 is a perspective view of a printed circuit board with the same conventional structure, Figure 3 a
1 is a plan sectional view of a unit according to an embodiment of the present invention, FIG. 3 is a schematic diagram showing the heat dissipation structure according to an embodiment of the present invention disassembled in the order of assembly, and FIGS. 4 and 5 are respectively according to the present invention. FIG. 3 is a perspective view showing various embodiments of such a unit housing. 1... Unit, 2... Printed board, 3... Semiconductor element, 5.11... Heat sick, 8.12...
Heat pipe, 10... housing, 8b...
- Tapered convex portion, 13... Tapered concave portion.
Claims (1)
ライド式に機器筐体に挿脱されるようになった電子機器
において、前記筐体に設けられた放熱器と、前記ユニッ
トまたはプリント板に固定されかつ発生した熱を前記筐
体側の放熱器へ移送するヒートパイプと、前記ヒートパ
イプの端部と前記放熱器との接合部に形成されたテーパ
嵌合部とを有することを特徴とする電子機器の放熱構造
。In an electronic device in which a unit or a printed circuit board equipped with a heat-generating electric component is slidably inserted into and removed from a device housing, a radiator provided in the housing and a radiator fixed to the unit or printed circuit board are provided. An electronic device comprising: a heat pipe that transfers generated heat to the radiator on the housing side; and a tapered fitting portion formed at a joint between an end of the heat pipe and the radiator. Heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14626183U JPS6054396U (en) | 1983-09-21 | 1983-09-21 | Heat dissipation structure of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14626183U JPS6054396U (en) | 1983-09-21 | 1983-09-21 | Heat dissipation structure of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6054396U true JPS6054396U (en) | 1985-04-16 |
Family
ID=30325615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14626183U Pending JPS6054396U (en) | 1983-09-21 | 1983-09-21 | Heat dissipation structure of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6054396U (en) |
-
1983
- 1983-09-21 JP JP14626183U patent/JPS6054396U/en active Pending
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