JPH0341993U - - Google Patents
Info
- Publication number
- JPH0341993U JPH0341993U JP10120189U JP10120189U JPH0341993U JP H0341993 U JPH0341993 U JP H0341993U JP 10120189 U JP10120189 U JP 10120189U JP 10120189 U JP10120189 U JP 10120189U JP H0341993 U JPH0341993 U JP H0341993U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- comes
- support plate
- electronic component
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の第１実施例における放熱構造
を示す断面図、第２図は本考案の第２実施例にお
ける放熱構造を示す断面図、第３図は本考案の第
３実施例における放熱構造を示す断面図、第４図
は従来における電子部品の放熱構造の一例を示す
図である。
１０，５０……放熱部材、１４……支持板、１６
，３３，４０……押圧部材、１８……プリント板
、１９……電子部品。
Fig. 1 is a sectional view showing a heat dissipation structure in a first embodiment of the present invention, Fig. 2 is a sectional view showing a heat dissipation structure in a second embodiment of the present invention, and Fig. 3 is a sectional view showing a heat dissipation structure in a third embodiment of the present invention. FIG. 4 is a cross-sectional view showing a heat dissipation structure. FIG. 4 is a diagram showing an example of a conventional heat dissipation structure for an electronic component. 10, 50... Heat radiation member, 14... Support plate, 16
, 33, 40...pressing member, 18...printed board, 19...electronic component.
Claims (1)
押圧部材１６，３３と、前記押圧部材に押圧され
てプリント板上の電子部品１９に接触する放熱部
材１０とを具備することを特徴とする電子部品の
放熱構造。 ２ 支持板１４に当接する押圧部材４０と、前記
押圧部材に移動自在に螺合して支持板の下方にあ
るプリント板上の電子部品１９に当接する放熱部
材５０とを具備することを特徴とする電子部品の
放熱構造。[Claims for Utility Model Registration] 1 Pressing members 16 and 33 movably screwed onto the support plate 14, and a heat dissipating member 10 that is pressed by the pressing members and comes into contact with the electronic component 19 on the printed board. A heat dissipation structure for an electronic component, characterized by comprising: 2. It is characterized by comprising a pressing member 40 that comes into contact with the support plate 14, and a heat dissipation member 50 that is movably screwed onto the pressing member and comes into contact with the electronic component 19 on the printed board located below the support plate. heat dissipation structure for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10120189U JPH0341993U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10120189U JPH0341993U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341993U true JPH0341993U (en) | 1991-04-22 |
Family
ID=31650164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10120189U Pending JPH0341993U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341993U (en) |
-
1989
- 1989-08-31 JP JP10120189U patent/JPH0341993U/ja active Pending