JPH02113386U - - Google Patents
Info
- Publication number
- JPH02113386U JPH02113386U JP2090489U JP2090489U JPH02113386U JP H02113386 U JPH02113386 U JP H02113386U JP 2090489 U JP2090489 U JP 2090489U JP 2090489 U JP2090489 U JP 2090489U JP H02113386 U JPH02113386 U JP H02113386U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- printed circuit
- heat sink
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
は同じく側面図、第３図は同じく構成部品の側面
図、第４図は本考案の第２の実施例を示す斜視図
、第５図ａは本考案の第３の実施例を示す平面図
、第５図ｂは同じく側面図、第６図ａは従来例を
示す斜視図、第６図ｂは同じく側面図である。
１……プリント基板、２……半導体素子、３…
…放熱板、４……開口、６……外殻体、９……切
起し、１０……突起。
FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a side view, FIG. 3 is a side view of the components, and FIG. 4 is a perspective view showing a second embodiment of the invention. FIG. 5a is a plan view showing a third embodiment of the present invention, FIG. 5b is a side view, FIG. 6a is a perspective view of a conventional example, and FIG. 6b is a side view. 1... Printed circuit board, 2... Semiconductor element, 3...
...Radiation plate, 4...Opening, 6...Outer shell, 9...Cut and raised, 10...Protrusion.
Claims (1)
と、この半導体素子と器具の外殻体との双方に固
定される放熱板とよりなり、前記半導体素子は前
記プリント基板に穿けた開口を橋絡して前記プリ
ント基板の上面に配され、前記放熱板の前記半導
体素子とは前記開口内に密着され、半導体素子と
放熱板との緊縮固定時に前記半導体素子橋絡部と
放熱板に設けた凸部との間にて前記プリント基板
を挾持してなることを特徴とする半導体素子の取
付け構造。 It consists of a printed circuit board, a semiconductor element mounted thereon, and a heat sink fixed to both the semiconductor element and the outer shell of the device, and the semiconductor element bridges an opening made in the printed circuit board. is arranged on the upper surface of the printed circuit board, and the semiconductor element of the heat sink is in close contact with the inside of the opening, and when the semiconductor element and the heat sink are tightened and fixed, the semiconductor element bridging portion and the convex portion provided on the heat sink are A mounting structure for a semiconductor element, characterized in that the printed circuit board is sandwiched between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2090489U JPH02113386U (en) | 1989-02-22 | 1989-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2090489U JPH02113386U (en) | 1989-02-22 | 1989-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113386U true JPH02113386U (en) | 1990-09-11 |
Family
ID=31237664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2090489U Pending JPH02113386U (en) | 1989-02-22 | 1989-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113386U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217574A (en) * | 2001-01-12 | 2002-08-02 | Matsushita Electric Works Ltd | Power converter |
| JP2008091423A (en) * | 2006-09-29 | 2008-04-17 | Saxa Inc | Electronic apparatus |
-
1989
- 1989-02-22 JP JP2090489U patent/JPH02113386U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217574A (en) * | 2001-01-12 | 2002-08-02 | Matsushita Electric Works Ltd | Power converter |
| JP2008091423A (en) * | 2006-09-29 | 2008-04-17 | Saxa Inc | Electronic apparatus |
| JP4702558B2 (en) * | 2006-09-29 | 2011-06-15 | サクサ株式会社 | Electronic equipment |