JPH0416045U - - Google Patents
Info
- Publication number
- JPH0416045U JPH0416045U JP5767090U JP5767090U JPH0416045U JP H0416045 U JPH0416045 U JP H0416045U JP 5767090 U JP5767090 U JP 5767090U JP 5767090 U JP5767090 U JP 5767090U JP H0416045 U JPH0416045 U JP H0416045U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heat
- circuit board
- printed circuit
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 7
Landscapes
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
は部分断面図、第２図はその分解斜視図、第３図
は従来構造の部分断面図である。
１……ハウジング、３……プリント基板、５…
…放熱口、６……放熱板、８……発熱部品、１５
……パツキン。
The drawings show one embodiment of the present invention; FIG. 1 is a partial sectional view, FIG. 2 is an exploded perspective view thereof, and FIG. 3 is a partial sectional view of a conventional structure. 1...Housing, 3...Printed circuit board, 5...
... Heat sink, 6... Heat sink, 8... Heat generating component, 15
...Patsukin.
Claims (1)
ジングに放熱口を形成し、該放熱口に放熱板を配
設し、該放熱板にプリント基板に電気的に接続さ
れる発熱部品を取付けたものにおいて、上記放熱
板を〓状に形成し、該放熱板を上記プリント基板
に取付け、該プリント基板に上記発熱部品を取付
け固定するとともに該発熱部品を放熱板の少なく
とも一部に対向配設し、上記放熱口の内側周縁に
該放熱板に当接可能なパツキンを配設して構成し
たことを特徴とする放熱装置。 A printed circuit board is disposed within a housing, a heat dissipation port is formed in the housing, a heat dissipation plate is disposed in the heat dissipation port, and a heat generating component electrically connected to the printed circuit board is attached to the heat dissipation plate. , forming the heat sink into a square shape, attaching the heat sink to the printed circuit board, attaching and fixing the heat generating component to the printed circuit board, and disposing the heat generating component facing at least a portion of the heat sink; 1. A heat dissipation device characterized in that a gasket that can come into contact with the heat dissipation plate is disposed on the inner periphery of the heat dissipation port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5767090U JPH0416045U (en) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5767090U JPH0416045U (en) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0416045U true JPH0416045U (en) | 1992-02-10 |
Family
ID=31582592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5767090U Pending JPH0416045U (en) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416045U (en) |
-
1990
- 1990-05-31 JP JP5767090U patent/JPH0416045U/ja active Pending