JPS63157992U - - Google Patents

Info

Publication number
JPS63157992U
JPS63157992U JP5063287U JP5063287U JPS63157992U JP S63157992 U JPS63157992 U JP S63157992U JP 5063287 U JP5063287 U JP 5063287U JP 5063287 U JP5063287 U JP 5063287U JP S63157992 U JPS63157992 U JP S63157992U
Authority
JP
Japan
Prior art keywords
electronic device
heating element
utility
attached
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5063287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5063287U priority Critical patent/JPS63157992U/ja
Publication of JPS63157992U publication Critical patent/JPS63157992U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を用いた携帯用電話
機の斜視図、第２図は第１図における放熱器の部
分断面図、第３図は従来の電子機器の筐体構造の
一例を用いた携帯用電話機の斜視図である。 １……携帯用電話機、２……発熱素子、３……
放熱器、４……半球状突起、５……携帯用電話機
、６……放熱部、７……プロテクタ。 Fig. 1 is a perspective view of a mobile phone using an embodiment of the present invention, Fig. 2 is a partial cross-sectional view of the heat sink in Fig. 1, and Fig. 3 is an example of the housing structure of a conventional electronic device. FIG. 2 is a perspective view of the mobile phone used. 1...Mobile phone, 2...Heating element, 3...
radiator, 4... hemispherical protrusion, 5... mobile phone, 6... heat radiator, 7... protector.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発熱素子を取付ける部分の外表面一帯に複数の
半球状突起を設けたことを特徴とする電子機器の
筐体構造。 A casing structure for an electronic device characterized by a plurality of hemispherical protrusions provided on the entire outer surface of the part where a heating element is attached.
JP5063287U 1987-04-02 1987-04-02 Pending JPS63157992U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5063287U JPS63157992U (en) 1987-04-02 1987-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5063287U JPS63157992U (en) 1987-04-02 1987-04-02

Publications (1)

Publication Number Publication Date
JPS63157992U true JPS63157992U (en) 1988-10-17

Family

ID=30874166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5063287U Pending JPS63157992U (en) 1987-04-02 1987-04-02

Country Status (1)

Country Link
JP (1) JPS63157992U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110947U (en) * 1989-02-16 1990-09-05
JPH0638254U (en) * 1992-10-22 1994-05-20 ダイヤモンド電機株式会社 Heat dissipation device for portable electronic devices
WO2015050048A1 (en) * 2013-10-01 2015-04-09 古河電気工業株式会社 Mobile electronic device case
KR101991621B1 (en) * 2018-02-22 2019-06-20 주식회사 선익시스템 Combination structure of signal contact part using nut by deposition film thickness measuring module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110947U (en) * 1989-02-16 1990-09-05
JPH0638254U (en) * 1992-10-22 1994-05-20 ダイヤモンド電機株式会社 Heat dissipation device for portable electronic devices
WO2015050048A1 (en) * 2013-10-01 2015-04-09 古河電気工業株式会社 Mobile electronic device case
JP2016201580A (en) * 2013-10-01 2016-12-01 古河電気工業株式会社 Mobile electronic device case
KR101991621B1 (en) * 2018-02-22 2019-06-20 주식회사 선익시스템 Combination structure of signal contact part using nut by deposition film thickness measuring module

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