JPS63137949U - - Google Patents
Info
- Publication number
- JPS63137949U JPS63137949U JP2887287U JP2887287U JPS63137949U JP S63137949 U JPS63137949 U JP S63137949U JP 2887287 U JP2887287 U JP 2887287U JP 2887287 U JP2887287 U JP 2887287U JP S63137949 U JPS63137949 U JP S63137949U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- heat dissipation
- printed board
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 3
Description
第１図は本考案の一実施例を示す集積回路素子
の放熱構造の要部断面図、第２図は第１図に示す
集積回路素子の放熱構造の要部分解斜視図、第３
図は第１図に示す集積回路素子の放熱構造の全体
斜視図、第４図は第１図に示す放熱構造に使用さ
れる放熱ブロツクの斜視図、第５図は従来の集積
回路素子の放熱構造例を示す図である。
図において、１１はプリント板、１１ａは部品
実装面、１１ｂは裏面、１１ｄは貫通穴、１２は
集積回路素子、１８は放熱ブロツク、１８ｄはね
じ穴、２０は熱伝導用ねじをそれぞれ示す。
FIG. 1 is a sectional view of a main part of a heat dissipation structure for an integrated circuit device showing an embodiment of the present invention, FIG. 2 is an exploded perspective view of a main part of a heat dissipation structure for an integrated circuit device shown in FIG. 1, and FIG.
The figure is an overall perspective view of the heat dissipation structure of the integrated circuit element shown in Fig. 1, Fig. 4 is a perspective view of a heat dissipation block used in the heat dissipation structure shown in Fig. 1, and Fig. 5 is a conventional heat dissipation structure of the integrated circuit element. It is a figure showing an example of a structure. In the figure, 11 is a printed board, 11a is a component mounting surface, 11b is a back surface, 11d is a through hole, 12 is an integrated circuit element, 18 is a heat radiation block, 18d is a screw hole, and 20 is a heat conduction screw.
Claims (1)
れる集積回路素子１２の放熱構造において、 プリント板１１の部品実装面と反対側の裏面１
１ｂに放熱ブロツク１８を取り付け、 集積回路素子１２の搭載位置に対応させてプリ
ント板１１には熱伝導用ねじ２０を通す貫通穴１
１ｄを設けるとともに放熱ブロツク１８には熱伝
導用ねじ２０が螺合するねじ穴１８ｄを設け、 放熱ブロツク１８のねじ穴１８ｄに螺合させた
熱伝導用ねじ２０をプリント板１１の貫通穴１１
ｄに通して集積回路素子１２に当接させたことを
特徴とする集積回路素子の放熱構造。[Claims for Utility Model Registration] In the heat dissipation structure of the integrated circuit element 12 mounted on the component mounting surface 11a of the printed board 11, the back surface 1 of the printed board 11 opposite to the component mounting surface
A heat dissipation block 18 is attached to 1b, and a through hole 1 for passing a heat conduction screw 20 is formed in the printed board 11 corresponding to the mounting position of the integrated circuit element 12.
1d, the heat radiation block 18 is provided with a screw hole 18d into which the heat conduction screw 20 is screwed, and the heat conduction screw 20 screwed into the screw hole 18d of the heat radiation block 18 is inserted into the through hole 11 of the printed board 11
A heat dissipation structure for an integrated circuit element, characterized in that the integrated circuit element 12 is brought into contact with the integrated circuit element 12 through the heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2887287U JPS63137949U (en) | 1987-03-02 | 1987-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2887287U JPS63137949U (en) | 1987-03-02 | 1987-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63137949U true JPS63137949U (en) | 1988-09-12 |
Family
ID=30832234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2887287U Pending JPS63137949U (en) | 1987-03-02 | 1987-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137949U (en) |
-
1987
- 1987-03-02 JP JP2887287U patent/JPS63137949U/ja active Pending