JPH0183390U - - Google Patents
Info
- Publication number
- JPH0183390U JPH0183390U JP1987178168U JP17816887U JPH0183390U JP H0183390 U JPH0183390 U JP H0183390U JP 1987178168 U JP1987178168 U JP 1987178168U JP 17816887 U JP17816887 U JP 17816887U JP H0183390 U JPH0183390 U JP H0183390U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- board
- generating component
- heat radiation
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図〜第４図はこの考案の一実施例を示し、
第１図は分解斜視図、第２図は分解断面図、第３
図は第２図の組み付け完了状態を示す断面図、第
４図は第３図のＡ―Ａ線断面図、第５図はこの考
案の第２実施例を示す一部を切り欠いた要部の分
解斜視図、第６図は第５図の分解断面図、第７図
は従来例を示す側面図である。
１，６…回路基板、２，７…電子部品、３，８
…発熱部品、４，１３…放熱部材、６Ａ，１３Ａ
…側縁部、１５…ケース、１６，１７，２６，２
７…ガイド部、Ｓ…空間。
Figures 1 to 4 show an embodiment of this invention,
Figure 1 is an exploded perspective view, Figure 2 is an exploded sectional view, and Figure 3 is an exploded perspective view.
The figure is a sectional view showing the assembled state in Fig. 2, Fig. 4 is a sectional view taken along line AA in Fig. 3, and Fig. 5 is a partially cutaway main part showing the second embodiment of this invention. 6 is an exploded sectional view of FIG. 5, and FIG. 7 is a side view of a conventional example. 1, 6... Circuit board, 2, 7... Electronic component, 3, 8
... Heat generating component, 4, 13... Heat dissipation member, 6A, 13A
...Side edge, 15...Case, 16, 17, 26, 2
7...Guide section, S...Space.
Claims (1)
熱部品と、前記空間内で前記基板に配設する電子
部品と、熱伝導性を有し前記発熱部品に当接する
放熱部材と、前記基板及び前記放熱部材を収納す
るケースと、このケースの内面に設けられ前記基
板及び前記放熱部材のそれぞれ側縁部を保持する
ガイド部とを有することを特徴とする発熱部品の
放熱構造。 a heat-generating component that has a space on the board and is attached to the board; an electronic component that is disposed on the board within the space; a heat-radiating member that has thermal conductivity and comes into contact with the heat-generating component; 1. A heat radiation structure for a heat generating component, comprising: a case for housing a heat radiation member; and a guide portion provided on the inner surface of the case to hold side edges of the substrate and the heat radiation member, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178168U JPH0183390U (en) | 1987-11-21 | 1987-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178168U JPH0183390U (en) | 1987-11-21 | 1987-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183390U true JPH0183390U (en) | 1989-06-02 |
Family
ID=31469795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987178168U Pending JPH0183390U (en) | 1987-11-21 | 1987-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183390U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023181792A1 (en) * | 2022-03-25 | 2023-09-28 | 日立Astemo株式会社 | Electronic control device and method for producing electronic control device |
-
1987
- 1987-11-21 JP JP1987178168U patent/JPH0183390U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023181792A1 (en) * | 2022-03-25 | 2023-09-28 | 日立Astemo株式会社 | Electronic control device and method for producing electronic control device |