JPS6240888U - - Google Patents
Info
- Publication number
- JPS6240888U JPS6240888U JP13081585U JP13081585U JPS6240888U JP S6240888 U JPS6240888 U JP S6240888U JP 13081585 U JP13081585 U JP 13081585U JP 13081585 U JP13081585 U JP 13081585U JP S6240888 U JPS6240888 U JP S6240888U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- shield body
- circuit board
- heat radiating
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案にかかる放熱装置の一実施例を
示す斜視図、第２図は同上装置の断面図、第３図
は従来の放熱装置の一例を示す斜視図である。
１１…底シールド板、１２…回路基板、１３，
１４…回路要素、１５…放熱金具。
FIG. 1 is a perspective view showing an embodiment of a heat radiating device according to the present invention, FIG. 2 is a sectional view of the same device, and FIG. 3 is a perspective view showing an example of a conventional heat radiating device. 11...Bottom shield plate, 12...Circuit board, 13,
14... Circuit element, 15... Heat dissipation fitting.
Claims (1)
板と、少なくとも前記筐体の底面に対面する底シ
ールド部を有し、前記回路基板をシールドするた
めのシールド体と、回路要素のうちの発熱要素が
取り付けられ、これら発熱要素が前記シールド体
の底シールド部上に位置するように前記シールド
体に固定された放熱用金具とから構成された放熱
装置。 A casing of an electrical device, a circuit board provided in the casing, a shield body having at least a bottom shield portion facing the bottom surface of the casing, for shielding the circuit board, and one of the circuit elements. A heat radiating device comprising a heat radiating metal fitting to which heat generating elements are attached and fixed to the shield body such that the heat generating elements are positioned on the bottom shield portion of the shield body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13081585U JPS6240888U (en) | 1985-08-29 | 1985-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13081585U JPS6240888U (en) | 1985-08-29 | 1985-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240888U true JPS6240888U (en) | 1987-03-11 |
Family
ID=31028679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13081585U Pending JPS6240888U (en) | 1985-08-29 | 1985-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240888U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323002U (en) * | 1989-07-14 | 1991-03-11 |
-
1985
- 1985-08-29 JP JP13081585U patent/JPS6240888U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323002U (en) * | 1989-07-14 | 1991-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6232596U (en) | ||
| JPS6240888U (en) | ||
| JPH0479490U (en) | ||
| JPH02142599U (en) | ||
| JPH0451192U (en) | ||
| JPS61144678U (en) | ||
| JPS63102292U (en) | ||
| JPH0334292U (en) | ||
| JPH02136386U (en) | ||
| JPS63159893U (en) | ||
| JPS62104497U (en) | ||
| JPS63170996U (en) | ||
| JPH0170393U (en) | ||
| JPH02110392U (en) | ||
| JPS6133479U (en) | Printed circuit board storage metal enclosure | |
| JPS61166597U (en) | ||
| JPS58127780U (en) | speaker holder | |
| JPS61111197U (en) | ||
| JPH03127774U (en) | ||
| JPH0183390U (en) | ||
| JPS5819491U (en) | heating element unit | |
| JPH01104787U (en) | ||
| JPH0416045U (en) | ||
| JPS59152744U (en) | Heat dissipation device for semiconductor devices | |
| JPH0197593U (en) |