JPS59152744U - Heat dissipation device for semiconductor devices - Google Patents
Heat dissipation device for semiconductor devicesInfo
- Publication number
- JPS59152744U JPS59152744U JP4588483U JP4588483U JPS59152744U JP S59152744 U JPS59152744 U JP S59152744U JP 4588483 U JP4588483 U JP 4588483U JP 4588483 U JP4588483 U JP 4588483U JP S59152744 U JPS59152744 U JP S59152744U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- attached
- semiconductor devices
- dissipation device
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の第１の実施例を示す斜視図、第２図は
同じくそのブラケットの平面図、第３図は同じく半導体
素子の取付は部の断面図、第４図は同じく固定具の平面
図、第５図は同じくその固定具の正面図、第６図は同じ
くブラケットに対する電気基板の取付は固定部の側断面
図、第７図は本考案の第２の実施例を示す斜視図、第８
図は半導体素子の取付は部の側断面図、第９図は同じく
その実施例の平面図である。
１・・・放熱用ブラケット、２・・・中央板部、３・・
・半導体素子、４・・・素子取付は部、５・・・取付は
用孔、１１・・・電気基板、１４・・・電気部品、２１
・・・本体部、２２・・・足部、３１・・・取付は板部
、３２・・・素子取付は板部。Fig. 1 is a perspective view showing the first embodiment of the present invention, Fig. 2 is a plan view of the bracket, Fig. 3 is a sectional view of the mounting portion of the semiconductor element, and Fig. 4 is the same as the fixing device. 5 is a front view of the fixing device, FIG. 6 is a side sectional view of the fixing part for mounting the electric board to the bracket, and FIG. 7 is a perspective view showing the second embodiment of the present invention. Figure, 8th
The figure is a side sectional view of the mounting section of the semiconductor element, and FIG. 9 is a plan view of the same embodiment. 1...Bracket for heat radiation, 2...Central plate part, 3...
- Semiconductor element, 4... Element mounting part, 5... Mounting hole, 11... Electrical board, 14... Electrical component, 21
...Body part, 22... Leg part, 31... Mounting is on the plate part, 32... Element is mounting on the plate part.
Claims (1)
ト□と、この放熱用ブラケットに取着固定される電気基
板と、上記放熱用ブラケットに本体部が取着され上記電
気基板に足部を取着した半導体素子とを具備してなる半
導体素子の放熱装置。A thermally conductive heat dissipation bracket □ that is attached to the frame of the device, an electrical board that is attached and fixed to this heat dissipation bracket, and a main body that is attached to the heat dissipation bracket and whose feet are attached to the electrical board. 1. A heat dissipation device for a semiconductor device, comprising: a semiconductor device attached to the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4588483U JPS59152744U (en) | 1983-03-31 | 1983-03-31 | Heat dissipation device for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4588483U JPS59152744U (en) | 1983-03-31 | 1983-03-31 | Heat dissipation device for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59152744U true JPS59152744U (en) | 1984-10-13 |
Family
ID=30176429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4588483U Pending JPS59152744U (en) | 1983-03-31 | 1983-03-31 | Heat dissipation device for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59152744U (en) |
-
1983
- 1983-03-31 JP JP4588483U patent/JPS59152744U/en active Pending
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