JPH0479490U - - Google Patents
Info
- Publication number
- JPH0479490U JPH0479490U JP12245090U JP12245090U JPH0479490U JP H0479490 U JPH0479490 U JP H0479490U JP 12245090 U JP12245090 U JP 12245090U JP 12245090 U JP12245090 U JP 12245090U JP H0479490 U JPH0479490 U JP H0479490U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electromagnetic shielding
- heating element
- shielding cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図Ａ，Ｂおよび第２図は、本考案の発熱素
子の放熱構造の一実施例を示すもので、第１図Ａ
は、電磁シールドカバーを印刷配線基板に取着す
る前の全体断面図、第１図Ｂは、電磁シールドカ
バーを印刷配線基板に取着した状態の全体断面図
、第２図は熱伝導板の斜視図であり、第３図は、
従来の発熱素子の放熱構造の全体断面図である。
１……発熱素子、２……印刷配線基板、３……
電磁シールドカバー、４……熱伝導板。
1A, B and 2 show an embodiment of the heat dissipation structure of the heating element of the present invention.
is an overall cross-sectional view of the electromagnetic shielding cover before it is attached to the printed wiring board, Figure 1B is an overall cross-sectional view of the electromagnetic shielding cover that is attached to the printed wiring board, and Figure 2 is a cross-sectional view of the electromagnetic shielding cover before it is attached to the printed wiring board. FIG. 3 is a perspective view, and FIG.
FIG. 2 is an overall sectional view of a heat dissipation structure of a conventional heating element. 1... Heat generating element, 2... Printed wiring board, 3...
Electromagnetic shield cover, 4...heat conduction plate.
Claims (1)
熱素子と、この発熱素子を覆うように前記印刷配
線基板に設けられた電磁シールドカバーと、この
電磁シールドカバーの内壁面に一端が固定され、
他端が前記発熱素子に圧接される弾性を有した熱
伝導板とを具備したことを特徴とする発熱素子の
放熱構造。 a heating element electrically connected and mounted on a printed wiring board; an electromagnetic shielding cover provided on the printed wiring board to cover the heating element; one end fixed to an inner wall surface of the electromagnetic shielding cover;
1. A heat dissipation structure for a heat generating element, comprising: a heat conductive plate having elasticity, the other end of which is pressed against the heat generating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12245090U JPH0479490U (en) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12245090U JPH0479490U (en) | 1990-11-26 | 1990-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479490U true JPH0479490U (en) | 1992-07-10 |
Family
ID=31870231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12245090U Pending JPH0479490U (en) | 1990-11-26 | 1990-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479490U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027277A (en) * | 2005-07-13 | 2007-02-01 | Fujitsu Ltd | Semiconductor package |
| WO2014049898A1 (en) * | 2012-09-26 | 2014-04-03 | パナソニック株式会社 | Electronic device |
-
1990
- 1990-11-26 JP JP12245090U patent/JPH0479490U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027277A (en) * | 2005-07-13 | 2007-02-01 | Fujitsu Ltd | Semiconductor package |
| JP4630746B2 (en) * | 2005-07-13 | 2011-02-09 | 富士通株式会社 | Semiconductor package |
| WO2014049898A1 (en) * | 2012-09-26 | 2014-04-03 | パナソニック株式会社 | Electronic device |
| JP5834175B2 (en) * | 2012-09-26 | 2015-12-16 | パナソニックＩｐマネジメント株式会社 | Electronics |
| JPWO2014049898A1 (en) * | 2012-09-26 | 2016-08-22 | パナソニックＩｐマネジメント株式会社 | Electronics |