JPS6439698U - - Google Patents
Info
- Publication number
- JPS6439698U JPS6439698U JP13338987U JP13338987U JPS6439698U JP S6439698 U JPS6439698 U JP S6439698U JP 13338987 U JP13338987 U JP 13338987U JP 13338987 U JP13338987 U JP 13338987U JP S6439698 U JPS6439698 U JP S6439698U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- wiring board
- printed wiring
- heat
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 6
- 230000005855 radiation Effects 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案実施例の斜視図、第２図は実施
例概略側面断面図、第３図は実施例概略正面図、
第４図は従来例側面断面図である。
１０……プリント配線板、１２……電子部品、
１４……電子回路パツケージ、１６，１８……コ
ネクタ、２０……バツクボード、２２……プリン
ト配線板ユニツト、２４……ヒートパイプ、２６
……放熱フイン、３０……熱遮蔽板、３８……熱
遮蔽部、４０……放熱部。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a schematic side sectional view of the embodiment, and FIG. 3 is a schematic front view of the embodiment.
FIG. 4 is a side sectional view of a conventional example. 10...Printed wiring board, 12...Electronic component,
14... Electronic circuit package, 16, 18... Connector, 20... Back board, 22... Printed wiring board unit, 24... Heat pipe, 26
... Heat radiation fin, 30 ... Heat shield plate, 38 ... Heat shield part, 40 ... Heat radiation part.
Claims (1)
て構成された電子回路パツケージ１４をバツクボ
ード２０上に縦置実装したプリント配線板ユニツ
ト２２の放熱実装構造において、 該プリント配線板ユニツト２２の上部に設けら
れた熱遮蔽部３８の前面側に放熱部４０を設け、 電子回路パツケージ１４の電子部品１２にヒー
トパイプ２４を垂直方向に取付けてその上端部を
放熱部４０まで伸長させ、 該放熱部４０中に伸長したヒートパイプ２４の
上端部に放熱フイン２６を取付けたことを特徴と
するプリント配線板ユニツトの放熱実装構造。[Scope of Claim for Utility Model Registration] A heat dissipation mounting structure of a printed wiring board unit 22 in which an electronic circuit package 14 configured by mounting electronic components 12 on a printed wiring board 10 is vertically mounted on a back board 20, A heat dissipation section 40 is provided on the front side of the heat shield section 38 provided on the upper part of the wiring board unit 22, and a heat pipe 24 is vertically attached to the electronic component 12 of the electronic circuit package 14, and its upper end reaches the heat dissipation section 40. A heat dissipation mounting structure for a printed wiring board unit, characterized in that a heat dissipation fin 26 is attached to the upper end of a heat pipe 24 extended into the heat dissipation section 40.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13338987U JPS6439698U (en) | 1987-09-01 | 1987-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13338987U JPS6439698U (en) | 1987-09-01 | 1987-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6439698U true JPS6439698U (en) | 1989-03-09 |
Family
ID=31391202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13338987U Pending JPS6439698U (en) | 1987-09-01 | 1987-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6439698U (en) |
-
1987
- 1987-09-01 JP JP13338987U patent/JPS6439698U/ja active Pending
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