JPH0359689U - - Google Patents
Info
- Publication number
- JPH0359689U JPH0359689U JP12082089U JP12082089U JPH0359689U JP H0359689 U JPH0359689 U JP H0359689U JP 12082089 U JP12082089 U JP 12082089U JP 12082089 U JP12082089 U JP 12082089U JP H0359689 U JPH0359689 U JP H0359689U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat
- electronic component
- generating electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第２図は本考案品を示すもので、第
１図は半抜き部分を有する放熱板の取付態様を示
す縦断正面図、第２図は切起こし部分を有する放
熱板の取付態様を示す縦断正面図である。第３図
乃至第４図は従来技術を示すものである。
１……発熱電子部品、２……放熱板、５……プ
リント基板、Ｓ……空間部分。
Figures 1 and 2 show the product of the present invention, where Figure 1 is a longitudinal sectional front view showing how a heat sink having a half-cut portion is attached, and Figure 2 is a front view showing how a heat sink having a cut-and-raised portion is attached. FIG. 3 and 4 show the prior art. 1... heat generating electronic component, 2... heat sink, 5... printed circuit board, S... space part.
Claims (1)
ント基板５上に、空間部分Ｓを構成して取付けた
発熱電子部品の放熱板。 (2) 発熱電子部品１とプリント基板５との間に
介在せしめる放熱板２に該プリント基板５側へ向
けて半抜き部分３又は切り起こし部分４を突設せ
しめて、該プリント基板５と放熱板２とを離反し
た状態で固定して成る発熱電子部品の放熱板。[Claims for Utility Model Registration] (1) A heat sink for a heat generating electronic component, in which a heat sink 2 to which a heat generating electronic component 1 is attached is attached on a printed circuit board 5 to form a space S. (2) A heat dissipation plate 2 interposed between the heat-generating electronic component 1 and the printed circuit board 5 is provided with a half-opened portion 3 or a cut-up portion 4 protruding toward the printed circuit board 5 side, so that the heat dissipation between the printed circuit board 5 and the printed circuit board 5 is achieved. A heat dissipation plate for a heat generating electronic component, which is formed by fixing a plate 2 in a separated state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12082089U JPH0359689U (en) | 1989-10-16 | 1989-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12082089U JPH0359689U (en) | 1989-10-16 | 1989-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359689U true JPH0359689U (en) | 1991-06-12 |
Family
ID=31668876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12082089U Pending JPH0359689U (en) | 1989-10-16 | 1989-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359689U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110258A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Structure and method for preventing warpage of circuit board |
| JP2013074003A (en) * | 2011-09-27 | 2013-04-22 | Panasonic Corp | Fixing structure |
-
1989
- 1989-10-16 JP JP12082089U patent/JPH0359689U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110258A (en) * | 2001-09-28 | 2003-04-11 | Nec Corp | Structure and method for preventing warpage of circuit board |
| JP2013074003A (en) * | 2011-09-27 | 2013-04-22 | Panasonic Corp | Fixing structure |