JPH0160596U - - Google Patents

Info

Publication number
JPH0160596U
JPH0160596U JP15780587U JP15780587U JPH0160596U JP H0160596 U JPH0160596 U JP H0160596U JP 15780587 U JP15780587 U JP 15780587U JP 15780587 U JP15780587 U JP 15780587U JP H0160596 U JPH0160596 U JP H0160596U
Authority
JP
Japan
Prior art keywords
printed board
heat
electronic component
generating electronic
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15780587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15780587U priority Critical patent/JPH0160596U/ja
Publication of JPH0160596U publication Critical patent/JPH0160596U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例によるプリント板
を示す平面図、第2図はこのプリント板の側面図
、第3図はプリント基板の平面図である。第4図
は従来のプリント板を示す平面図、第5図はこの
プリント板の側面図、第6図はプリント基板の平
面図である。 図中、5は発熱性電子部品、6は放熱フイン、
12はプリント板、13はプリント基板、14は
導体、15はラバー状の熱伝導性絶縁シートであ
る。尚、図中同一符号は同一又は相当部分を示す
FIG. 1 is a plan view showing a printed board according to an embodiment of the invention, FIG. 2 is a side view of the printed board, and FIG. 3 is a plan view of the printed board. FIG. 4 is a plan view showing a conventional printed board, FIG. 5 is a side view of this printed board, and FIG. 6 is a plan view of the printed board. In the figure, 5 is a heat generating electronic component, 6 is a heat dissipation fin,
12 is a printed board, 13 is a printed circuit board, 14 is a conductor, and 15 is a rubber-like thermally conductive insulating sheet. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】 (1) プリント基板上に発熱性電子部品を実装す
るプリント板において、前記発熱性電子部品とプ
リント基板との間にラバー状の熱伝導性絶縁シー
トを介装したことを特徴とするプリント板。 (2) ラバー状の熱伝導性絶縁シートは、発熱性
電子部品に設けられた放熱フインとプリント基板
との間に介装されている実用新案登録請求の範囲
第1項記載のプリント板。
[Scope of Claim for Utility Model Registration] (1) In a printed board on which a heat-generating electronic component is mounted, a rubber-like thermally conductive insulating sheet is interposed between the heat-generating electronic component and the printed circuit board. A printed board characterized by: (2) The printed board according to claim 1, wherein the rubber-like thermally conductive insulating sheet is interposed between the heat dissipating fin provided on the heat-generating electronic component and the printed board.
JP15780587U 1987-10-14 1987-10-14 Pending JPH0160596U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15780587U JPH0160596U (en) 1987-10-14 1987-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15780587U JPH0160596U (en) 1987-10-14 1987-10-14

Publications (1)

Publication Number Publication Date
JPH0160596U true JPH0160596U (en) 1989-04-17

Family

ID=31437568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15780587U Pending JPH0160596U (en) 1987-10-14 1987-10-14

Country Status (1)

Country Link
JP (1) JPH0160596U (en)

Similar Documents

Publication Publication Date Title
JPH0160596U (en)
JPS5847718Y2 (en) heat dissipation printed circuit board
JPS6280340U (en)
JPH0227759U (en)
JPS646085U (en)
JPS6138996U (en) Heat dissipation structure of printed circuit board
JPS6439648U (en)
JPS6127297U (en) Heat dissipation structure of printed circuit board
JPH0359689U (en)
JPS61183590U (en)
JPH0415892U (en)
JPS59177955U (en) Heatsink used for printed wiring boards
JPH0160545U (en)
JPS587396U (en) Circuit board for heat generating parts
JPS6022841U (en) radiator
JPS6071195U (en) Heat dissipation device in printed circuit board
JPH01154689U (en)
JPS58135994U (en) Auxiliary heat sink
JPH0245668U (en)
JPS5996841U (en) Heat dissipation structure of hybrid integrated circuit
JPS63105349U (en)
JPS6387862U (en)
JPS6364097U (en)
JPS58175643U (en) Heat dissipation structure for printed wiring board components
JPH031498U (en)