JPS61183590U

JPS61183590U -

Info

Publication number: JPS61183590U
Application number: JP6748185U
Authority: JP
Priority date: 1985-05-08
Filing date: 1985-05-08
Publication date: 1986-11-15

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例による電子機器シ
ヤーシを示す断面図、第２図はこの考案の変形例
を示す電子機器シヤーシの断面図、第３図は従来
の電子機器シヤーシを示す断面図である。図において、１は底板、２は側板、３は上蓋、
４は基板、５は高発熱電子部品、６は低発熱電子
部品、７ａは内板、７ｂは外板、８，８ａ，８ｂ
，９，９ａ，９ｂはブロツク、１０はコルゲート
フインである。なお、図中、同一符号は同一、又
は相当部分を示す。 FIG. 1 is a cross-sectional view showing an electronic device chassis according to an embodiment of this invention, FIG. 2 is a cross-sectional view of an electronic device chassis showing a modification of this invention, and FIG. 3 is a cross-sectional view showing a conventional electronic device chassis. It is. In the figure, 1 is the bottom plate, 2 is the side plate, 3 is the top cover,
4 is a board, 5 is a high heat generation electronic component, 6 is a low heat generation electronic component, 7a is an inner plate, 7b is an outer plate, 8, 8a, 8b
, 9, 9a, 9b are blocks, and 10 is a corrugated fin. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims

[Scope of claim for utility model registration] (1) In contact with a board on which heat-generating electronic components are mounted,
An inner plate that receives heat from the board, a block that contacts a part of this inner plate at one end, an outer plate that contacts the other end of this block and transmits heat to the outside, and a space between this outer plate and the inner plate. An electronic equipment chassis comprising a corrugated fin provided at a position where the block is not present. (2) The electronic device chassis according to claim 1, wherein the block is provided at a position corresponding to an electronic component that generates a relatively large amount of heat.