JPH031489U - - Google Patents
Info
- Publication number
- JPH031489U JPH031489U JP5901689U JP5901689U JPH031489U JP H031489 U JPH031489 U JP H031489U JP 5901689 U JP5901689 U JP 5901689U JP 5901689 U JP5901689 U JP 5901689U JP H031489 U JPH031489 U JP H031489U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- wiring board
- generating electronic
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
Landscapes
- Coils Or Transformers For Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図はこの考案に係る発熱性電子部品の保持
構造の一例を示す断面図、第2図は従来の発熱性
電子部品の保持構造を示す断面図である。
1……金属シヤーシ、2……プリント配線基板
、3……発熱性電子部品、4,5……リード部、
6……金属柱体、9……熱伝導性絶縁弾性体。
FIG. 1 is a cross-sectional view showing an example of a holding structure for a heat-generating electronic component according to this invention, and FIG. 2 is a cross-sectional view showing a conventional holding structure for a heat-generating electronic component. 1... Metal chassis, 2... Printed wiring board, 3... Heat generating electronic component, 4, 5... Lead part,
6...metal column, 9...thermally conductive insulating elastic body.
Claims (1)
板に発熱性電子部品を配置するとともに、そのリ
ード部を上記プリント配線基板に接続・固定した
発熱性電子部品の保持構造において、上記金属シ
ヤーシに、上記プリント配線基板を貫通する金属
柱体を固定し、この金属柱体の先端と上記発熱性
電子部品との間に熱伝導性絶縁弾性体を介在した
ことを特徴とする発熱性電子部品の保持構造。 In a holding structure for a heat-generating electronic component, in which a heat-generating electronic component is arranged on a printed wiring board disposed opposite to a metal chassis, and its lead portion is connected and fixed to the printed wiring board, the printed wiring board is placed on the metal chassis. A holding structure for a heat-generating electronic component, characterized in that a metal column passing through a wiring board is fixed, and a thermally conductive insulating elastic body is interposed between the tip of the metal column and the heat-generating electronic component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5901689U JPH031489U (en) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5901689U JPH031489U (en) | 1989-05-22 | 1989-05-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH031489U true JPH031489U (en) | 1991-01-09 |
Family
ID=31585143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5901689U Pending JPH031489U (en) | 1989-05-22 | 1989-05-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH031489U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017073351A (en) * | 2015-10-09 | 2017-04-13 | 岩崎電気株式会社 | Circuit device and lighting device |
-
1989
- 1989-05-22 JP JP5901689U patent/JPH031489U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017073351A (en) * | 2015-10-09 | 2017-04-13 | 岩崎電気株式会社 | Circuit device and lighting device |
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