JPS5926260U - Electronic component lead structure - Google Patents

Electronic component lead structure

Info

Publication number
JPS5926260U
JPS5926260U JP11961182U JP11961182U JPS5926260U JP S5926260 U JPS5926260 U JP S5926260U JP 11961182 U JP11961182 U JP 11961182U JP 11961182 U JP11961182 U JP 11961182U JP S5926260 U JPS5926260 U JP S5926260U
Authority
JP
Japan
Prior art keywords
electronic component
lead structure
component lead
lead
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11961182U
Other languages
Japanese (ja)
Inventor
石渡　良晴
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP11961182U priority Critical patent/JPS5926260U/en
Publication of JPS5926260U publication Critical patent/JPS5926260U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例の斜視図、第２図は本考案を実
施したリード構造を有する電子部品の実装例を示す。 図において、１・・・・・・電子部品本体、２・・・・
・・リード、３・・・・・・変形部、４・・・・・・半
田、５・・・・・・スルーホール、６・・・・・・プリ
ントイタ、７・・曲ヒートシンク、８・・・・・・ネジ
、９・・・・・・ワッシャー、１１・・・・・・ナツト
、である。FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 shows an example of mounting an electronic component having a lead structure according to the present invention. In the figure, 1... electronic component body, 2...
... Lead, 3 ... Deformed part, 4 ... Solder, 5 ... Through hole, 6 ... Print pattern, 7 ... Curved heat sink, 8 ...screw, 9 ... washer, 11 ... nut.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品固定用のねじ穴と、前記電子部品に接続される
リードと、前記リードの軸方向の歪を吸収するようこの
リードに設けられた変形部とを有する電子部品のリード
構造。A lead structure for an electronic component including a screw hole for fixing an electronic component, a lead connected to the electronic component, and a deformable portion provided in the lead to absorb strain in the axial direction of the lead.
JP11961182U 1982-08-06 1982-08-06 Electronic component lead structure Pending JPS5926260U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11961182U JPS5926260U (en) 1982-08-06 1982-08-06 Electronic component lead structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11961182U JPS5926260U (en) 1982-08-06 1982-08-06 Electronic component lead structure

Publications (1)

Publication Number Publication Date
JPS5926260U true JPS5926260U (en) 1984-02-18

Family

ID=30274441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11961182U Pending JPS5926260U (en) 1982-08-06 1982-08-06 Electronic component lead structure

Country Status (1)

Country Link
JP (1) JPS5926260U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63197347U (en) * 1987-06-08 1988-12-19
JPH067254U (en) * 1991-12-25 1994-01-28 政洋 西尾 Lead terminal structure of semiconductor element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63197347U (en) * 1987-06-08 1988-12-19
JPH067254U (en) * 1991-12-25 1994-01-28 政洋 西尾 Lead terminal structure of semiconductor element

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