JPH036893U - - Google Patents
Info
- Publication number
- JPH036893U JPH036893U JP6572889U JP6572889U JPH036893U JP H036893 U JPH036893 U JP H036893U JP 6572889 U JP6572889 U JP 6572889U JP 6572889 U JP6572889 U JP 6572889U JP H036893 U JPH036893 U JP H036893U
- Authority
- JP
- Japan
- Prior art keywords
- generating electronic
- electronic component
- heat
- split part
- metal block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図および第２図はそれぞれこの考案に係る
発熱性電子部品の放熱構造の一例を示す側面図お
よび平面図、第３図は同発熱性電子部品が装着さ
れるプリント配線基板の割り部周辺を示す斜視図
、第４図はこの考案の他の実施例を示す斜視図、
第５図および第６図はそれぞれ従来の発熱性電子
部品の放熱構造を示す側面図および斜視図である
。
１……発熱性電子部品、１ａ……リード部、２
……金属ブロツク、３，５……ねじ体、４，４１
……接地用金具、４ａ……脚部、６……金属シヤ
ーシ、７……プリント配線基板、１０……割り部
、１３……開口。
Figures 1 and 2 are a side view and a plan view, respectively, showing an example of the heat dissipation structure of the heat-generating electronic component according to this invention, and Figure 3 is the vicinity of the split portion of the printed wiring board on which the heat-generating electronic component is mounted. FIG. 4 is a perspective view showing another embodiment of this invention.
FIG. 5 and FIG. 6 are a side view and a perspective view, respectively, showing a heat radiation structure of a conventional heat generating electronic component. 1... Heat generating electronic component, 1a... Lead part, 2
...Metal block, 3,5...Screw body, 4,41
. . . Grounding metal fittings, 4a . . . Legs, 6 . . . Metal chassis, 7 .
Claims (1)
板の所定位置に割り部を形成し、この割り部に対
向して発熱性電子部品および接地用金具を配設す
るとともに、割り部近傍に位置してプリント配線
基板の裏面側に発熱性電子部品のリード部および
接地用金具の脚部を半田付けでそれぞれ接続・固
定して、上記金属シヤーシに固定された金属ブロ
ツクの上面を、上記割り部を除去して形成された
開口を通して上記発熱性電子部品に接触させた状
態で該発熱性電子部品および接地用金具をねじ体
により上記金属ブロツクの上面に圧接・固定した
ことを特徴とする発熱性電子部品の放熱構造。 A split part is formed at a predetermined position on a printed wiring board placed facing the metal chassis, and heat-generating electronic components and grounding fittings are arranged opposite to this split part, and printed circuit boards are placed near the split part. Connect and fix the lead part of the heat-generating electronic component and the leg part of the grounding fitting to the back side of the wiring board by soldering, and remove the split part from the top surface of the metal block fixed to the metal chassis. The heat generating electronic component and the grounding fitting are pressed and fixed to the upper surface of the metal block using a screw body while the heat generating electronic component and the grounding fitting are brought into contact with the heat generating electronic component through the opening formed by the metal block. Heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6572889U JPH036893U (en) | 1989-06-05 | 1989-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6572889U JPH036893U (en) | 1989-06-05 | 1989-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH036893U true JPH036893U (en) | 1991-01-23 |
Family
ID=31597812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6572889U Pending JPH036893U (en) | 1989-06-05 | 1989-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036893U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196515A (en) * | 2000-01-11 | 2001-07-19 | Matsushita Electric Works Ltd | Heat dissipation structure and method of manufacture |
-
1989
- 1989-06-05 JP JP6572889U patent/JPH036893U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196515A (en) * | 2000-01-11 | 2001-07-19 | Matsushita Electric Works Ltd | Heat dissipation structure and method of manufacture |