JPH0476092U - - Google Patents
Info
- Publication number
- JPH0476092U JPH0476092U JP11962190U JP11962190U JPH0476092U JP H0476092 U JPH0476092 U JP H0476092U JP 11962190 U JP11962190 U JP 11962190U JP 11962190 U JP11962190 U JP 11962190U JP H0476092 U JPH0476092 U JP H0476092U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- copper foil
- wiring board
- printed wiring
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例による発熱する電
気部品の放熱装置を示す平面図、第２図は同上実
施例の断面図、第３図は従来の発熱する電気部品
の放熱装置を示す平面図、第４図は従来の発熱す
る電気部品の放熱装置の正面図である。
１……印刷配線板、２……半田付け銅箔、３…
…発熱する電気部品、４……固定具、５……銅箔
、６……半田。なお、図中、同一は同一、又は相
当部分を示す。
Fig. 1 is a plan view showing a heat dissipation device for heat-generating electrical components according to an embodiment of the invention, Fig. 2 is a cross-sectional view of the same embodiment, and Fig. 3 is a plan view showing a conventional heat dissipation device for heat-generating electrical components. FIG. 4 is a front view of a conventional heat dissipating device for electrical parts that generate heat. 1...Printed wiring board, 2...Soldering copper foil, 3...
...Electrical parts that generate heat, 4...Fixing tools, 5...Copper foil, 6...Solder. In addition, in the figures, the same means the same or equivalent parts.
Claims (1)
田付けした印刷配線板と、固定具により上記印刷
配線板に固定されて上記銅箔と半田とにより放熱
される発熱する電気部品とを備えた発熱する電気
部品の放熱装置。 A printed wiring board provided with copper foil in a predetermined pattern and soldered to the entire surface of the copper foil, and an electrical component that generates heat and is fixed to the printed wiring board with a fixture and heat is radiated by the copper foil and the solder. Heat dissipation device for electrical parts that generate heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962190U JPH0476092U (en) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962190U JPH0476092U (en) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476092U true JPH0476092U (en) | 1992-07-02 |
Family
ID=31867566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11962190U Pending JPH0476092U (en) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476092U (en) |
-
1990
- 1990-11-14 JP JP11962190U patent/JPH0476092U/ja active Pending
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