JPS6142880B2 - - Google Patents
Info
- Publication number
- JPS6142880B2 JPS6142880B2 JP13503277A JP13503277A JPS6142880B2 JP S6142880 B2 JPS6142880 B2 JP S6142880B2 JP 13503277 A JP13503277 A JP 13503277A JP 13503277 A JP13503277 A JP 13503277A JP S6142880 B2 JPS6142880 B2 JP S6142880B2
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- metal
- insulating layer
- metal plate
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 31
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
本発明は金属板に絶縁層を介して成るプリント
配線基板（以下プリント板）を用いて放熱機能を
備えるようにしたプリント板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board that has a heat dissipation function using a printed circuit board (hereinafter referred to as a printed circuit board) formed by interposing an insulating layer on a metal plate.
近年通信機等のプリント板にはIC、LSI等の部
品が高密度で実装されて来ており、そのような部
品からの発熱を円滑に放熱することが重要な問題
になつている。一方、部品が搭載される場合には
半田付け部から部品をできるだけ離して、半田付
けの際の熱が部品側に及ばないように、部品自体
がプリント板の基板から浮いている。放熱設計の
際、この部品と基板との間に放熱板を敷いて熱伝
導効果を上げる事等が提案されているが、部品数
が増えたり、取付作業性が困難である等の問題が
ある。 In recent years, components such as ICs and LSIs have been mounted at high density on printed circuit boards for communication devices, and the smooth dissipation of heat generated from such components has become an important issue. On the other hand, when a component is mounted, the component is placed as far away from the soldering part as possible, and the component itself is suspended from the printed circuit board so that the heat during soldering does not reach the component side. When designing heat radiation, it has been proposed to increase the heat conduction effect by placing a heat radiation plate between this component and the board, but there are problems such as an increase in the number of components and difficulty in mounting. .
本発明はこのような点に鑑み、放熱効果の高い
プリント板を提供することを目的とするもので、
プリント板の基板に金属板を用い、この金属板に
絶縁層を介して配線パターンを描くと共に、金属
の凸部、及び金属凸部両側のスルーホールを設け
て、この凸部に部品を直接接して搭載し、スルー
ホールに部品のリード線を貫通させはんだ付けす
ることにより放熱効果を高めるものである。 In view of these points, the present invention aims to provide a printed board with high heat dissipation effect.
A metal plate is used as the substrate of the printed circuit board, a wiring pattern is drawn on this metal plate through an insulating layer, and a metal protrusion and through holes are provided on both sides of the metal protrusion so that parts can be directly connected to the protrusion. The heat dissipation effect is enhanced by mounting the lead wires of the components through the through holes and soldering them.
以下に本発明を図面の実施例により具体的に説
明すると、第１図に示されるように鉄、銅、アル
ミ等の金属板１に、アルマイト処理や、絶縁塗装
等に依る絶縁層２を作りその表面にフレキシブル
プリント板を貼り付け、あるいは絶縁層２の表面
に配線パターン４を描く事に依り金属板を母材に
したプリント基板３が出来る。ここに第２図の様
に基板３の部品搭載部には金属の凸部５が金属板
１に一体的に設けられており、この凸部５の上に
第３図の様にIC、LSI等の発熱部品６が直接接し
た状態で載置され、且つ部品６のリード線７が基
板穴（スルーホール）８を貫通し、基板３のはん
だ付けランドにはんだ付けされて、電気的に接続
すると共に外れないように固定される。そこで部
品６から発生した熱は空冷されると共に凸部５を
介して金属板１に熱抵抗が小さい状態で伝導さ
れ、更に金属板１の全域の広い面から効果的に放
熱されるようになる。 The present invention will be explained in detail below with reference to the embodiments shown in the drawings. As shown in FIG. By attaching a flexible printed board to the surface thereof or by drawing a wiring pattern 4 on the surface of the insulating layer 2, a printed circuit board 3 using a metal plate as a base material can be obtained. Here, as shown in FIG. 2, a metal protrusion 5 is integrally provided on the metal plate 1 at the component mounting portion of the board 3, and ICs and LSIs are mounted on this protrusion 5 as shown in FIG. The heat-generating components 6 such as the following are placed in direct contact with each other, and the lead wires 7 of the components 6 pass through the board holes (through holes) 8 and are soldered to the soldering lands of the board 3 for electrical connection. At the same time, it is fixed so that it does not come off. Therefore, the heat generated from the component 6 is air-cooled and conducted to the metal plate 1 through the convex portion 5 with low thermal resistance, and is further effectively radiated from a wide surface over the entire area of the metal plate 1. .
次いで前述の凸部を形成する方法について第４
図及び第５図を参照して説明する。まず第４図に
よると、最初ａのように金属板１の上に金属シー
ト９がねじ１０、ピン１１、半田１２等の種々の
方法で一体的に固定され、次いでｂのように金属
板１の上に絶縁皮膜２が形成されるもので、この
とき金属シート９の上は絶縁層が出来ないように
するなりまたは絶縁層構成後機械加工して除かれ
る。また第５図によると、最初ａのようにマスキ
ングにより金属板１の部品搭載部１３以外にのみ
絶縁層２が構成され、次いでｂのようにその絶縁
層２及び配線パターン４が作成され、そして最後
にｃのように絶縁層の付いていない部品搭載部１
３に金属シート９が一体的に固着されるものであ
り、こうして金属の凸部は容易に形成される。 Next, the fourth method for forming the above-mentioned convex portions is explained.
This will be explained with reference to the drawings and FIG. First, according to FIG. 4, the metal sheet 9 is first integrally fixed onto the metal plate 1 as shown in a, using various methods such as screws 10, pins 11, solder 12, etc., and then the metal sheet 9 is fixed on the metal plate 1 as shown in b. An insulating film 2 is formed on the metal sheet 9. At this time, the top of the metal sheet 9 is removed by machining to prevent the formation of an insulating layer or after forming the insulating layer. Also, according to FIG. 5, the insulating layer 2 is first formed only in areas other than the component mounting portion 13 of the metal plate 1 by masking as shown in a, then the insulating layer 2 and the wiring pattern 4 are created as shown in b, and then Finally, as shown in c, the component mounting area 1 does not have an insulating layer.
The metal sheet 9 is integrally fixed to the metal sheet 3, and thus the metal protrusion can be easily formed.
このように本発明によると、プリント板基板３
の芯の部分に金属板１が用いられ、この金属板１
を利用して、発熱部品６の放熱が行われるので、
その放熱作用が非常に効果的に行われる。 Thus, according to the present invention, the printed circuit board 3
A metal plate 1 is used for the core of the metal plate 1.
Since the heat dissipation of the heat generating component 6 is performed using
Its heat dissipation effect is very effective.
第１図は金属板を母板としたプリント板の構造
例、第２図ａ，ｂは本発明による放熱機能を備え
たプリント板の一実施例を示す斜視図、第３図は
部品搭載状態を示す正面図、第４図と第５図はそ
れぞれ金属の凸部形成方法を示す図である。
１……金属板、２…絶縁層、３……基板、４…
…配線パターン、５……凸部、６……発熱部品、
７……リード線、８……基板穴、９……金属シー
ト、１０……ねじ、１１……ピン、１２……半
田、１３……部品搭載部、１４……フレキシブル
プリント板。
Figure 1 is an example of the structure of a printed board using a metal plate as a base plate, Figures 2a and b are perspective views showing an embodiment of the printed board with a heat dissipation function according to the present invention, and Figure 3 is a state in which components are mounted. FIGS. 4 and 5 are front views showing a method for forming metal protrusions, respectively. 1...Metal plate, 2...Insulating layer, 3...Substrate, 4...
...Wiring pattern, 5...Protrusion, 6...Heat-generating component,
7...Lead wire, 8...Board hole, 9...Metal sheet, 10...Screw, 11...Pin, 12...Solder, 13...Component mounting section, 14...Flexible printed board.
Claims (1)
層の上に配線パターンが描かれ、前記基板の部品
搭載部に前記絶縁層の無い金属の凸部が前記金属
板と一体に設けられ、且つ該金属の凸部両側にス
ルーホールが設けられており、該凸部の金属露出
部分に部品が直接接して搭載され、該凸部両側の
スルーホールに部品のリード線を貫通させはんだ
付けすることを特徴とする放熱機能を備えたプリ
ント配線基板。1. A wiring pattern is drawn on the insulating layer of a substrate formed by interposing an insulating layer on a metal plate, and a metal protrusion without the insulating layer is provided integrally with the metal plate in a component mounting area of the substrate, In addition, through holes are provided on both sides of the metal protrusion, and components are mounted in direct contact with the exposed metal portion of the protrusion, and lead wires of the component are passed through the through holes on both sides of the protrusion and soldered. A printed wiring board with a heat dissipation function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13503277A JPS5467675A (en) | 1977-11-10 | 1977-11-10 | Printed circuit substrate provided with radiation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13503277A JPS5467675A (en) | 1977-11-10 | 1977-11-10 | Printed circuit substrate provided with radiation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5467675A JPS5467675A (en) | 1979-05-31 |
| JPS6142880B2 true JPS6142880B2 (en) | 1986-09-24 |
Family
ID=15142339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13503277A Granted JPS5467675A (en) | 1977-11-10 | 1977-11-10 | Printed circuit substrate provided with radiation function |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5467675A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6391577A (en) * | 1986-10-06 | 1988-04-22 | Saamotetsuku:Kk | Cooler-heater for temperature test |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61140593U (en) * | 1985-02-21 | 1986-08-30 |
-
1977
- 1977-11-10 JP JP13503277A patent/JPS5467675A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6391577A (en) * | 1986-10-06 | 1988-04-22 | Saamotetsuku:Kk | Cooler-heater for temperature test |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5467675A (en) | 1979-05-31 |
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