JPH08125379A - Shield device - Google Patents

Shield device

Info

Publication number
JPH08125379A
JPH08125379A JP26081394A JP26081394A JPH08125379A JP H08125379 A JPH08125379 A JP H08125379A JP 26081394 A JP26081394 A JP 26081394A JP 26081394 A JP26081394 A JP 26081394A JP H08125379 A JPH08125379 A JP H08125379A
Authority
JP
Japan
Prior art keywords
bga
ceramic substrate
substrate
shield
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26081394A
Other languages
Japanese (ja)
Other versions
JP3228841B2 (en
Inventor
Akio Nakatani
Kazunori Yamate
昭男 中谷
万典 山手
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP26081394A priority Critical patent/JP3228841B2/en
Publication of JPH08125379A publication Critical patent/JPH08125379A/en
Application granted granted Critical
Publication of JP3228841B2 publication Critical patent/JP3228841B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Abstract

PURPOSE: To provide a compact shield device capable of obtaining a specific shield which dispenses with a shield case.
CONSTITUTION: An LSI chip pattern 2 is formed on a BGA ceramic substrate 1 and a shield plate 5 is provided on the LSI chip pattern 2. Next, through holes 3 are formed on the peripheral part of the BGA ceramic substrate 1 so as to provide solder balls 6 beneath the through holes 3. Next, the BGA ceramic substrate 1 is packaged on a multilayer substrate 7 while an earth foil encircling the BGA ceramic substrate 1 is formed on an outer layer 8 of the multilayer substrate 7.
COPYRIGHT: (C)1996,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明はセラミックBGA(Ball FIELD OF THE INVENTION The present invention relates to a ceramic BGA (Ball
grid array )を用いて高密度実装した基板におけるシールド装置に関する。 It relates shield apparatus in a substrate which is high-density mounting by using a grid array).

【0002】 [0002]

【従来の技術】近来、電子機器のプリント基板はデジタル回路化され、当然のことながら高密度実装が施され、 BACKGROUND ART Recently, printed circuit board of the electronic apparatus is digitally circuitized, high-density mounting is subjected course,
そのため他の回路との妨害が生じないようにシールドについて配慮しなければならない。 Therefore interference with other circuits must consider the shield so as not to cause.

【0003】従来のシールド装置について説明する。 [0003] The related art will be described of the shield apparatus. 図4に示すように、枠状をした金属製のシールドケース本体15に四角形状のプリント基板16を挿入し、前記シールドケース本体15の周板に形成した複数の固定爪2 Figure 4 As shown in, insert the rectangular printed circuit board 16 to the metal shield case body 15 in which the frame-shaped, the shield case main body 15 a plurality of fixing claws formed on the peripheral board 2
4を折り曲げてプリント基板16を仮固定する。 4 by folding a temporarily fixing the printed circuit board 16. さらにプリント基板16の表裏の周縁に形成した半田付け部2 Soldering part 2 is further formed on both sides of the peripheral edge of the printed circuit board 16
2をシールドケース本体15の固定爪24のいくつかに半田付けして、プリント基板16とシールドケース15 2 and soldered to some fixed claws 24 of the shield case body 15, the printed circuit board 16 and the shield case 15
を固定する。 It is fixed. さらにプリント基板16の面に実装した複数のIC23の表面に放熱板17を当接し、また、プリント基板16の反対側のIC部にも放熱板18を当接し、これらを固定用ビス19で締め付ける。 Further a plurality of the heat radiating plate 17 to the surface of the IC23 mounted on the surface of the printed circuit board 16 abuts, also the IC portion of the opposite side of the printed circuit board 16 of the heat radiating plate 18 abuts tighten them with fixing screw 19 . さらにシールドケース蓋20,21でシールドケース本体15の両側を覆い、シールドケース蓋20,21の下部の半田付け部25とプリント基板16とを半田付けするという構成としている。 Further covers the sides of the shield case body 15 in the shield case lid 20 and 21, has a configuration that a soldering portion 25 and the printed circuit board 16 of the lower portion of the shielding case lid 20 and 21 are soldered.

【0004】 [0004]

【発明が解決しようとする課題】ところで上述の従来のシールド装置の構成では、シールドケースを用いるために構成部が大型化する。 In the [0005] Meanwhile the above conventional shielded device configuration, configuration unit is increased in size in order to use the shield case. また、その組立てにおいても半田付け箇所が多く、組立て工数が多くなる。 Further, even soldering places often becomes large number of assembly steps in its assembly.

【0005】本発明は前記従来の問題に留意し、シールドケースを不要にし、小型で、しかも所期のシールドが得られるシールド装置を提供することを目的とする。 The present invention noted the above-described conventional problems, eliminates the need for the shield case, small size, yet an object to provide a shield device intended shield is obtained.

【0006】 [0006]

【課題を解決するための手段】前記目的を達成するために本発明は、BGAセラミック基板にLSIチップとB Means for Solving the Problems The present invention to achieve the object, LSI chip and B BGA ceramic substrate
GAセラミック基板を接続するパターンを形成するとともに、LSIチップの回路形成面をBGAセラミック基板の接続パターンと接続し、その上にシールド板を設け、前記BGAセラミック基板の周辺部にBGAのピンピッチもしくはピンピッチの整数倍の間隔でスルーホールを形成し、スルーホールの下部に電極端子となる半田ボールを設け、前記BGAセラミック基板を実装した多層基板にBGAセラミック基板の電極端子を囲むアース箔を形成し、多層基板の内層に配線パターンを設けたシールド装置の構成とする。 And forming a pattern for connecting GA ceramic substrate, a circuit forming surface of the LSI chip connected to the connection pattern of BGA ceramic substrate, a shield plate provided thereon, the BGA to the perimeter of the BGA ceramic substrate pin pitch or pin pitch of a through hole is formed in an integral multiple of the interval, the solder balls serving as an electrode terminal at the bottom of the through hole is provided, forming a ground foil surrounding the electrode terminals of the BGA ceramic substrate in a multilayer board on which the BGA ceramic substrate, the configuration of the shielding device having a wiring pattern on the inner layer of the multilayer substrate.

【0007】 [0007]

【作用】上記構成のシールド装置において、BGAセラミック基板の周辺の半田ボールのうちアース端子となるものは多層基板側で前記半田ボール群を囲むアース箔に接続されるので、上部のシールド板とともにシールドし、他に別個のシールドケースを不要とすることとなる。 [Action] The shield device configured as described above, since made to the earth terminal of the solder balls near the BGA ceramic substrate is connected to the ground foil surrounding the solder ball group in the multilayer substrate, with the upper portion of the shield plate shields and, so that eliminates the need for separate shield case to the other.

【0008】 [0008]

【実施例】以下に本発明の一実施例を図1および図2を参照して説明する。 An embodiment of the present invention THE PREFERRED EMBODIMENTS Hereinafter will be described with reference to FIGS. 図において1はBGAセラミック基板であり、その上面のモールド樹脂4で装着されたLS 1 is a BGA ceramic substrate in FIG, LS mounted in the mold resin 4 of the upper surface
Iチップパターン2にはLSIを実装しており、さらに前記LSIチップパターン2を含むBGAセラミック基板1の上面はシールド板5で覆われている。 I is the chip pattern 2 implements the LSI, further the upper surface of the BGA ceramic substrate 1 including the LSI chip pattern 2 is covered with the shield plate 5.

【0009】前記BGAセラミック基板1の周辺部には、ピンピッチもしくはピンピッチの整数倍の間隔でスルーホール3を形成してあり、この各スルーホール3の下部にそれぞれ電極端子となる半田ボール6を設けている。 [0009] periphery of the BGA ceramic substrate 1, Yes forms a through-hole 3 in the pin pitch or an integral multiple of the spacing of the pin pitch, provided the solder balls 6 serving as the respective electrode terminals at the bottom of each through-hole 3 ing. そして前記半田ボール6を備えたBGAセラミック基板1は回路端子をもつ多層基板7の表面側の外層8に前記半田ボール6を溶かして接合して実装される。 The BGA ceramic substrate 1 provided with the solder balls 6 are mounted by bonding by dissolving the solder balls 6 to the outer layer 8 on the surface side of the multilayer substrate 7 with circuit terminals. 前記外層8におけるBGAセラミック基板1の周辺にはアース箔を設けてアースされており、また、多層基板7の裏面側の外層10にはほぼ全面にわたりアース箔11が形成されている。 Wherein the periphery of the BGA ceramic substrate 1 in the outer layer 8 are grounded to provide a ground foil, also formed ground foil 11 substantially over the entire surface of the backside layer 10 of the multilayer substrate 7. なお配線パターンは多層基板7の内層9 Note wiring pattern layer of the multilayer substrate 7 9
において配線する。 Wired in.

【0010】上記構成においては、半田ボール6が電極端子となり、所要の接続が行なわれるとともに、半田ボール、すなわち電極端子が多層基板7の外層8のアース箔で囲まれそして、そのアース箔とシールド板5とでシールドすることができる。 [0010] In the above configuration, the solder ball 6 is an electrode terminal, together with the required connections are made, the solder balls, that is, the electrode terminal surrounded by ground foil of the outer layer 8 of the multilayer substrate 7 And the earth foil and shield it can be shielded by the plate 5. また、多層基板7の外層10 In addition, the outer layer 10 of the multi-layer substrate 7
に施したアース箔11とともに十分なシールド効果が得られ、シールドケースを不要とし、組立の自動化を可能にする。 Sufficient shielding effect is obtained with the ground foil 11 subjected to the shield case is not required, to allow the automation of assembly.

【0011】図3は本発明の他の実施例を示す。 [0011] Figure 3 shows another embodiment of the present invention. この実施例はEMIフィルターのシールドに係るものであり、 This Example is according to shield EMI filter,
EMIフィルター本体12の側面下部および裏面の周辺には全てアース箔13を設けている。 All are provided with grounding foil 13 around lower side and the back surface of the EMI filter body 12. 前記EMIフィルター本体12の裏面にはアース電極14、入力端子部1 The EMI filter on the back surface of the main body 12 ground electrode 14, the input terminal unit 1
5、出力端子部16が設けられ、アース電極14は前記アース箔13に接続され、入力端子部15と出力端子部16はアース箔13によって囲まれている。 5, the output terminal portion 16 is provided, the ground electrode 14 is connected to the ground foil 13, an input terminal 15 and output terminal portion 16 is surrounded by a ground foil 13.

【0012】上記構成のEMIフィルタ本体12は、図示しない基板のパターンにその下面を接続するが、スルーホールを用いてEMIフィルターの下側でパターン設計することにより上部に配線箔が露出することなく実装できることから、シールドケースを用いなくてもシールドされ、他の回路よりの妨害の影響を受けにくい。 [0012] EMI filter body 12 having the above structure is connected to the lower surface pattern of a substrate (not shown) without the wiring foil on top by pattern design on the lower side of the EMI filter is exposed with a through hole because it can implement, without using the shield case is shielded, less susceptible to interference than other circuits.

【0013】前記のように各実施例においては、シールドケースを用いることなくシールドされ、構成部を小型にでき、しかも組立てを容易にする。 [0013] In each embodiment as described above, is shielded without using a shield case, can the components in a small, yet to facilitate assembly.

【0014】 [0014]

【発明の効果】前記実施例の説明より明らかなように、 [Effect of the Invention] As apparent from the description of the embodiments,
本発明のシールド装置は下記の効果を得ることができる。 Shield apparatus of the present invention can obtain the following effects. (1)BGAセラミック基板の周辺に半田ボール端子を設けているため、多層基板側でこれを囲むアース箔を設けることにより、シールドケースを用いなくてもシールドできる基板実装ができる。 (1) Since the the periphery of the BGA ceramic substrate provided with the solder ball terminals, by providing a grounded foil surrounding it with multi-layer substrate side, it is board mounted to be shielded without using the shield case. (2)BGAセラミック基板を用いているため実装が容易であり、実装面積の縮小を図ることができる。 (2) it is easy to implement due to the use of BGA ceramic substrate, thus reducing the mounting area. さらにEMIフィルターの入力電極、出力電極をアース部材で囲む電極構造とすることで、シールドケースを用いなくてもシールド可能なシールド装置を実現する。 Further input electrode of the EMI filter, an output electrode by an electrode structure enclosed by grounding member, to realize a shieldable shield apparatus without using the shield case.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】(a)は本発明の一実施例のシールド装置の断面図 (b)は同シールド装置の要部断面図 (c)は同シールド装置の要部斜視図 1 (a) is a fragmentary perspective view of a cross-sectional view of a shield apparatus in an embodiment (b) is a fragmentary sectional view of the shielding device (c) is the shielding device of the present invention

【図2】同シールド装置の下面を示す斜視図 Figure 2 is a perspective view showing a lower surface of the shield device

【図3】(a)は本発明の他の実施例のシールド装置の斜視図 (b)は同シールド装置の下面を示す斜視図 3 (a) is a perspective view of the shield device of another embodiment of the present invention (b) is a perspective view showing a lower surface of the shield device

【図4】従来のシールド装置の分解斜視図 Figure 4 is an exploded perspective view of a conventional shield apparatus

【符号の説明】 DESCRIPTION OF SYMBOLS

1 BGAセラミック基板 2 LSIチップパターン 3 スルーホール 4 モールド樹脂 5 シールド板 6 半田ボール 7 多層基板 8 外層 9 内層 10 外層 11 アース箔 1 BGA ceramic substrate 2 LSI chip patterns 3 through holes 4 mold resin 5 shield plate 6 solder balls 7 multilayer substrate 8 the outer layer 9 inner 10 outer layer 11 grounded foil

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 BGAセラミック基板上にLSIチップとBGAセラミック基板を接続するパターンを形成するとともに、LSIチップの回路形成面をBGAセラミック基板の接続パターンと接続し、その上にシールド板を設け、前記BGAセラミック基板の周辺にBGAのピンピッチもしくはピンピッチの整数倍の間隔でスルーホールを形成し、スルーホールの下部に電極端子となる半田ボールを設け、前記BGAセラミック基板を実装した多層基板にBGAセラミック基板の電極端子部を囲むアース箔を形成し、多層基板の内層に配線パターンを設けてなるシールド装置。 With 1. A forming a pattern for connecting the LSI chip and BGA ceramic substrate BGA ceramic substrate, a circuit forming surface of the LSI chip connected to the connection pattern of BGA ceramic substrate, a shield plate provided thereon, the BGA through holes were formed around the the BGA ceramic substrate pin pitch or an integral multiple of the spacing of the pin pitch, solder balls to serve as an electrode terminal at the bottom of the through hole is provided, BGA ceramic multilayer board on which the BGA ceramic substrate forming a ground foil surrounding the electrode terminal portions of the substrate, the shielding device formed by providing a wiring pattern on the inner layer of the multilayer substrate.
  2. 【請求項2】 EMIフィルターの外側面下部および実装面にアース箔を設け、前記実装面におけるアース電極をアース箔に接続し、入力端子部と出力端子部を前記アース電極で囲み、前記EMIフィルターを基板に実装したシールド装置。 2. A ground foil provided on the outer surface bottom and the mounting surface of the EMI filter, the ground connection electrode on the mounting surface to the ground foil, surrounds the output terminal portion and the input terminals with the ground electrode, wherein the EMI filter shield apparatus mounted on the substrate.
JP26081394A 1994-10-26 1994-10-26 Shield apparatus Expired - Fee Related JP3228841B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26081394A JP3228841B2 (en) 1994-10-26 1994-10-26 Shield apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26081394A JP3228841B2 (en) 1994-10-26 1994-10-26 Shield apparatus

Publications (2)

Publication Number Publication Date
JPH08125379A true JPH08125379A (en) 1996-05-17
JP3228841B2 JP3228841B2 (en) 2001-11-12

Family

ID=17353118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26081394A Expired - Fee Related JP3228841B2 (en) 1994-10-26 1994-10-26 Shield apparatus

Country Status (1)

Country Link
JP (1) JP3228841B2 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955789A (en) * 1997-04-16 1999-09-21 International Business Machines Corporation Ball grid array module
EP1094547A3 (en) * 1999-10-19 2001-10-04 Berg Electronics Manufacturing B.V. Electrical connector with strain relief
US6791845B2 (en) 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components
US6805278B1 (en) 1999-10-19 2004-10-19 Fci America Technology, Inc. Self-centering connector with hold down
US6900389B2 (en) 2003-01-10 2005-05-31 Fci Americas Technology, Inc. Cover for ball-grid array connector
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US8905651B2 (en) 2012-01-31 2014-12-09 Fci Dismountable optical coupling device
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US9048583B2 (en) 2009-03-19 2015-06-02 Fci Americas Technology Llc Electrical connector having ribbed ground plate
USD733662S1 (en) 2013-01-25 2015-07-07 Fci Americas Technology Llc Connector housing for electrical connector
USD746236S1 (en) 2012-07-11 2015-12-29 Fci Americas Technology Llc Electrical connector housing
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955789A (en) * 1997-04-16 1999-09-21 International Business Machines Corporation Ball grid array module
EP1094547A3 (en) * 1999-10-19 2001-10-04 Berg Electronics Manufacturing B.V. Electrical connector with strain relief
US6544046B1 (en) 1999-10-19 2003-04-08 Fci Americas Technology, Inc. Electrical connector with strain relief
US6805278B1 (en) 1999-10-19 2004-10-19 Fci America Technology, Inc. Self-centering connector with hold down
US6791845B2 (en) 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components
US7249411B2 (en) 2002-09-26 2007-07-31 Fci Americas Technology, Inc. Methods for mounting surface-mounted electrical components
US7535723B2 (en) 2002-09-26 2009-05-19 Fci Americas Technology, Inc. Surface mounted electrical components and method for mounting and retaining same
US6900389B2 (en) 2003-01-10 2005-05-31 Fci Americas Technology, Inc. Cover for ball-grid array connector
US7320426B2 (en) 2003-01-10 2008-01-22 Fci Americas Technology, Inc. Cover for ball-grid array connector
US9461410B2 (en) 2009-03-19 2016-10-04 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US9048583B2 (en) 2009-03-19 2015-06-02 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US8905651B2 (en) 2012-01-31 2014-12-09 Fci Dismountable optical coupling device
USD750025S1 (en) 2012-04-13 2016-02-23 Fci Americas Technology Llc Vertical electrical connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US9831605B2 (en) 2012-04-13 2017-11-28 Fci Americas Technology Llc High speed electrical connector
USD790471S1 (en) 2012-04-13 2017-06-27 Fci Americas Technology Llc Vertical electrical connector
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
USD748063S1 (en) 2012-04-13 2016-01-26 Fci Americas Technology Llc Electrical ground shield
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD750030S1 (en) 2012-04-13 2016-02-23 Fci Americas Technology Llc Electrical cable connector
USD816044S1 (en) 2012-04-13 2018-04-24 Fci Americas Technology Llc Electrical cable connector
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
USD746236S1 (en) 2012-07-11 2015-12-29 Fci Americas Technology Llc Electrical connector housing
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD766832S1 (en) 2013-01-25 2016-09-20 Fci Americas Technology Llc Electrical connector
USD772168S1 (en) 2013-01-25 2016-11-22 Fci Americas Technology Llc Connector housing for electrical connector
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD733662S1 (en) 2013-01-25 2015-07-07 Fci Americas Technology Llc Connector housing for electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector

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