JPS5853890A - Method of soldering electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to printed circuit boards and methods for soldering electronic components in hybrid ICs.

Normally, it is desired that the actual mother board of an electronic component be soldered uniformly without any residual solder.

FIG. 1 shows a schematic diagram of electronic components soldered onto a copper-clad machine resin laminate 1. As shown in FIG. The conventional soldering method for this method is to form the copper foil into the desired wiring pattern 2 by etching, and then to form a solder resist (not shown in the figure) on the parts where soldering is unnecessary. In the schematic diagram, the electronic component 3 with leads is connected to the round electrode part 4, and the leadless electronic component 5 is connected to the square electrode part 6.
are attached to each.

In such a configuration, the object of the present invention is a method of forming a solder resist, and a conventional method thereof will be described below.

2 and 3 are enlarged views of the round electrode portion 4, which is an integral electrode portion shown in FIG. 1. FIG.

The round electrode part 4 has two lead insertion holes 7, and in order to prevent solder from adhering to unnecessary parts, solder resist 9 (shaded areas) is used for soldering except for the area 8. FIG. 4 is an enlarged view of the rectangular electrode portion 6, and FIG. 5 shows a state in which electronic components are mounted. In any of the electrode parts, since the lead, electronic part, and component are soldered against each other, they are separated by a solder resist 9 near the center of the electrode part.

In such a conventional configuration, in the case of soldering by the molten Ushida bathing method, (l) the size of the electronic component shape, (2)
There is a drawback that some areas may not be soldered due to slight differences in the mounting direction of each electronic component during solder dipping, (3) substrate dipping angle and speed, temperature, etc. during solder dipping. Particularly in the square electrode part 6, when a small leadless electronic component is placed near a large leadless electronic component, solder is applied to a small area, and when the area is small, no solder is attached. This often results in an increase in the number of operations or an increase in corrections in post-processes, which not only complicates the process but also poses a major problem in obtaining stable quality.

Incidentally, as shown in Fig. 6, it is possible to not divide the rectangular electrode portion 6 by the solder resist 9, but this method inevitably results in an excessive amount of solder and a deterioration in quality. .

It is an object of the present invention to provide a soldering method that eliminates these drawbacks and can easily achieve more reliable and reliable soldering.

The present invention is realized by slightly modifying the pattern of the solder resist 9 used in the conventional process.

That is, according to the present invention, when two or more electronic components are soldered in close proximity to a single electrode part, each soldering area is not completely separated by solder resist, but is performed using a band-shaped connection part with a small width. By communicating with each other, the purpose can be achieved in either the solder dip method or the solder pass method.

Hereinafter, the present invention will be described in detail with reference to the drawings.

FIGS. 7 and 8 are examples of solder resist patterns according to the present invention for soldering electronic components having leads. As in the conventional case, there is a round electrode part 4 having two lead insertion holes 7, and only the parts that do not require soldering are covered with a solder resist 9.

This configuration ζ is different from the conventional one in that the soldering area 8 ζ is provided with a band-shaped connection part 1G, and the solder resist 9 is not spread here so that the solder will adhere. be.

FIG. 9 shows an embodiment of the present invention in the square electrode section 6#, the first
Figure 0 shows a state in which electronic components are mounted on the embodiment (Figure 9). Figure 11 shows an embodiment of the present invention in which a round electrode part 4 and a square electrode part 6 are formed. In each of the embodiments, the strip-shaped connecting portion 10, which is a feature of the present invention, is provided in the soldering region 8.

In this way, according to the present invention 1141, the soldering of the integral electrode portions in close proximity to each other results in a band-shaped connecting portion lO with a small width between the regions.
- From this, when soldering on one side, when the solder sticks to the area, when soldering on the other side, the solder extends to the area, so both sides are reliably soldered. The problem of electronic components interfering with soldering is also eliminated, and the amount of solder is appropriately controlled.

Note that the present invention is not limited to the copper plate/fat laminate described in the embodiments, but also applies to circuit boards in which a suitable metal layer is provided on a metal plate via an insulating layer, and a circuit pattern is printed on an insulating material such as a ceramic. It can also be applied to thick film circuits.

[Brief explanation of the drawing]

Figure 1 is a schematic diagram showing the mounting state of electronic components, Figures 2 and 3 are partially enlarged views of the conventional method for round electrodes, and Figures 4, 5, and 6 are square electrodes. FIGS. 7 and 8 are partially enlarged views for explaining an embodiment of the present invention using a round electrode, and FIGS. 9 and 1θ are partially enlarged views of the conventional method using a square electrode. FIG. 11 is a partially enlarged view for explaining another embodiment of the present invention in which a round electrode and a square electrode are combined. . 1: Copper plate resin laminate, 2: Wiring pattern, 3: Electronic component with leads, 4: Round electrode section, 5: Leadless electronic component, 6: Square electrode section, 7:! J-card insertion hole, 8: Soldering area, 9: Solder resist, 10: Band-shaped connection part.

Claims (1)

[Claims] A method of soldering two or more electronic components in close proximity to one another on a single electrode on a circuit board. A method for soldering electronic components, which comprises covering the board with a solder resist and temporarily fixing the electronic component in a predetermined position, and then immersing the board in a solder bath or moving the board over the surface of the solder bath.