JP3110329B2 - Electronic component soldering method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of soldering an electronic component such as a connector to a flexible printed wiring board (hereinafter referred to as "FPC"), and more specifically, to a method of soldering a mounted component to a board. In this case, the FPC and the electronic component are simultaneously soldered by using this.

[0002]

2. Description of the Related Art Inside a device such as a video camera, a substrate to which electronic components and the like are soldered is housed.
A conductive circuit pattern for electrically connecting these electronic components is printed and formed on the substrate, and predetermined control of the device is performed by the electronic components electrically connected by the conductive circuit pattern. The shape and size of the conductive circuit pattern formed on the substrate are different depending on the number of components to be mounted and the like, and accordingly, the shape and size of the substrate are different depending on the shape and size of the conductive circuit pattern. ing. When a conductive circuit pattern is formed on such a substrate, various conductive circuit patterns are combined and formed on a single substrate serving as a base having a certain size, and the substrate is later formed on a conductive circuit pattern. The substrate is divided according to the shape of the pattern, and the divided substrates are incorporated into the device and used for each purpose.

FIG. 9 shows this conventional substrate 101. As shown in FIG. One surface of the substrate 101 is a component mounting surface on which components such as an IC, a resistor, and a diode are mounted by an automatic machine, and the opposite surface is a conductive circuit pattern forming surface on which a conductive circuit pattern is printed. Further, a slit 102 is formed in the substrate 101. Slit 102
Accordingly, the substrate 101 is divided into a region P, a region Q, and a region R. Conductive circuit patterns having different shapes and sizes are formed on the conductive circuit pattern forming surfaces of the region P and the region Q, respectively. On the other hand, no conductive circuit pattern is formed in the region R.

[0004] After the soldering of the mounting parts such as ICs is completed, such a substrate 101 is provided as shown in FIG.
By the slit 102, the divided substrates 101a, 101b
And the unnecessary portions 101c.
1b was incorporated into the device according to each application, while the unnecessary portion 101c was discarded. in this way,
Since the desired size and shape of the conductive circuit pattern are different, the unnecessary portion 101c in which the conductive circuit pattern is not formed is more or less formed.

On the other hand, in the conventional method of soldering electronic parts to an FPC, since the FPC is flexible, in order to perform soldering by an automatic machine, first, a window hole through which a soldered portion of the FPC is exposed is used. Fix the FPC to the drilled reinforcing plate,
The FPC has a certain strength, and then the reinforcing plate is transferred to a solder tank and soldered.

[0006]

However, in the conventional method of soldering electronic parts, since the reinforcing plate is used many times, the FPC is fixed to the reinforcing plate and soldered, and the FPC is separated from the reinforcing plate. After that, it was necessary to carry the reinforcing plate again to the step of fixing the FPC, and the workability was poor.

On the other hand, the conventional substrate 101 has a problem that the unnecessary portion 101c is discarded as it is and the unnecessary portion 101c is not used at all, so that there is much waste.

An object of the present invention is to provide a method of soldering an electronic component, which can simultaneously solder an FPC and an electronic component to a board and a mounted component.

[0009]

According to the present invention, there are provided a plurality of main units.
The main board is connected to the base board in a state where the boards are connected.
Forming an in-substrate conductive circuit pattern; forming a soldering hole in a region of the main substrate where the main substrate conductive circuit pattern is not formed; Fixing a part to the main board as desired on the surface on which the main board conductive circuit pattern is formed from the soldering hole; mounting an electronic component on the flexible printed wiring board; and mounting the component on the main board. the base in a state in which the step of mounting the component, the surface is formed with the main board conductive circuit pattern into close contact with the solder of the solder bath
Transferring the scan board to the solder bath to solder the mounting component on the main substrate when the step of soldering the electronic components on the flexible printed wiring board at the same time, dividing the base substrate for each of the main board Process
And a step of separating the main board and the flexible printed wiring board.

Further, the main substrate conductive circuit pattern
Comprises a plurality of different pattern shapes,
It is characterized in that it is divided for each shape.

Further, the region where the soldering hole is formed is an unnecessary portion to be discarded.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIGS. 1 to 7 show a first embodiment of the present invention, and FIGS. 3 and 5 to 6 are partial cross-sectional views taken along line AA of FIG. Is illustrated. FIG. 1 is a plan view of a main board,
A conductive circuit pattern having two types of pattern shapes is combined on one surface to form a main substrate conductive circuit pattern (not shown) with a predetermined distance therebetween, and further a main substrate conductive circuit pattern is formed. This shows a first step of forming a window hole 4 which is a hole for soldering in a region R which is not present. A slit 5 is formed in the main substrate 1, and the slit 5 divides the main substrate 1 into regions P, Q, and R. One surface of the main substrate 1 is a main substrate conductive circuit pattern forming surface on which a conductive circuit pattern is formed by printing, and the other surface is a component mounting surface on which mounting components 9 such as ICs, resistors, and diodes are mounted. It is. On the main substrate conductive circuit pattern forming surfaces of the region P and the region Q, conductive circuit patterns having different shapes are formed by printing, while the region R and the region R are formed.
Is not formed with a conductive circuit pattern.

FIG. 2 shows a second step of fixing the FPC 2a to the main board 1, in which a transparent masking tape 8 is attached from above the FPC 2a,
The FPC 2a is fixed to the component mounting surface. When fixing, the surface of the FPC 2a on which a lead terminal 11 described later is formed and the main substrate conductive circuit pattern forming surface of the main substrate 1 face in the same direction, and the lead terminal 11 is connected to the window hole. 4 to fix it to the main substrate conductive circuit pattern formation surface as desired.

FIG. 3 shows a third step of mounting the connector 3a as an electronic component on the FPC 2a and mounting the mounted component 9 on the main board. The main board 1 has
A through hole (not shown) through which the terminal 10 of the mounting component 9 penetrates is formed in advance. The FPC 2a is formed of a flexible material, and has a lead terminal 11 formed on one surface (lower surface in FIG. 3) and an insulating surface on the other surface (upper surface in FIG. 3). Covered by sheet. A part of the lead terminal 11 is desired from the window hole 4 to the main substrate conductive circuit pattern forming surface of the main substrate 1, and the portion desired from the window hole 4 is the solder contact portion 12. Further, a through hole (not shown) through which the terminal 6 of the connector 3a penetrates is formed in the solder contact portion 12 of the lead terminal 11. Further, a reinforcing plate 13 is attached to the insulating surface with an adhesive to reinforce the strength of the FPC 2a. In a portion corresponding to the window hole 4 of the FPC 2a and the reinforcing plate 13, a through hole (not shown) through which the terminal 6 of the connector 3a passes is continuously formed. When the connector 3a is mounted on the FPC 2a, the terminals 6 protrude downward in FIG. 3 from the surface of the main board 1 on which the main board conductive circuit pattern is formed. Similarly, the terminals 10 of the mounted components 9 also protrude downward in FIG. 3 from the main substrate conductive circuit pattern forming surface of the main substrate 1.

FIG. 4 is a plan view of the main board 1 in a state where the mounting of the connector 3a and the mounted components 9 on the main board 1 is completed. The surface shown in FIG. 4 to which the FPC 2a is fixed is the component mounting surface, and the surface opposite to the surface shown in FIG.
The lower surface in the figure) is the main substrate conductive circuit pattern forming surface. However, in FIG. 4, the mounting components 9 are not shown.

FIG. 5 shows a fourth step in which the main board 1 on which the connector 3a and the mounted components 9 have been mounted is mounted on a transfer machine (not shown) for soldering and transferred to a solder tank. Things. At the time of transfer, the main board 1 is transferred in parallel with the solder bath at a height such that the main board conductive circuit pattern forming surface is sufficiently immersed in the solder 14. The solder 14 in the solder bath is heated by the heater, so that the solder 14 adheres well to a predetermined position of the main board conductive circuit pattern of the main board 1.

FIG. 6 shows the main board 1 and the FPC 2a showing a state in which they have passed through the solder bath. You. Similarly, the terminals 10 of the mounting component 9 and the main board conductive circuit pattern of the main board 1 are soldered by solder 15 and are electrically connected.

FIG. 7 shows a fifth step of peeling off the masking tape 8 fixing the FPC 2a to the main board 1 and separating the FPC 2a from the main board 1.
After the separation, the lead terminal 11 of the FPC 2a and the terminal 6 of the connector 3a are still electrically connected by the solder 15.

Through the above steps, the lead-out terminal 1 of the FPC 2a
The work of soldering the terminal 1 and the terminal 6 of the connector 3a is completed. After that, the main substrate 1 is divided by the slit 5 into divided substrates 101a and 101b and unnecessary parts 101c.
The divided substrates 101a and 101b are housed inside the device and used for a predetermined purpose, and the unnecessary portions 101c
Is discarded.

According to such an electronic component soldering method, the soldering of the main board 1 and the mounted component 9 is performed simultaneously with the soldering of the mounted component 9.
Since the FPC 2a and the connector 3a can be soldered,
Workability is good and manufacturing cost can be reduced. Further, a window hole 4 formed for soldering the FPC 2a is formed.
Is formed in the unnecessary portion 101c to be discarded, and thus has no effect on the divided substrates 101a and 101b.

FIG. 8 shows a method for soldering electronic components according to a second embodiment of the present invention, in which two main substrate conductive circuit patterns are formed on a base substrate 20. The base substrate 20 is in a state where two main substrates 1 shown in FIG. 1 are connected. According to the second embodiment, one window hole 4 is formed in each of the two regions R, and the FPCs 2b and 2c are respectively formed in the two window holes by the masking tape 8 on the base substrate 20. Fix it. Then, after the soldering is completed, the base substrate is divided at a portion along a line YY in FIG. The other parts are the same as the soldering method of the first embodiment, and the description is omitted.

As shown in FIG. 8, even when the lengths and sizes of the FPCs 2b and 2c are different from the sizes of the connectors 3b and 3c, the same base substrate 20 can be used for soldering.

According to this method for soldering electronic components, a plurality of main board conductive circuit patterns can be formed on the base board, so that a window hole can be formed in each of the regions R, and soldering can be performed continuously. And the manufacturing cost can be further reduced.

Also, the FPCs 2a, 2b,
2c and the connectors 3a, 3b, 3c can be continuously soldered, so that the workability is extremely good.

The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. For example, in the present invention, the soldering hole 4 is formed in a square shape. However, the soldering hole 4 does not need to be formed in a square shape, and may be any shape such as a round shape and a triangular shape. Further, the present invention relates to FPCs 2a, 2b,
Electronic components to be soldered to 2c are connected to connectors 3a, 3b, 3
Although described as c, it is not necessarily required to be a connector, and any electronic component such as a switch may be used. In addition, the present invention relates to F
The PCs 2a, 2b, and 2c are fixed to the base substrate 1 with the masking tape 8, but need not necessarily be fixed with the masking tape, and may be fixed with an adhesive or the like. or,
Three or more base substrates 1 may be formed continuously and soldered continuously.

[0026]

As described above, the electronic component soldering method of the present invention allows the FPC and the electronic component to be soldered simultaneously with the soldering of the main board and the mounted component.
Workability is good and manufacturing cost can be reduced.

A plurality of main substrate conductive circuit patterns having the same shape are formed on the base substrate, and FPCs are formed in each region where the main substrate conductive circuit patterns are not formed.
And electronic components can be soldered, so that soldering can be performed continuously, workability is further improved, and manufacturing costs can be further reduced.

In addition, since FPCs and electronic parts having different sizes can be continuously soldered, workability is good and manufacturing cost can be reduced.

The area for forming the window for soldering is as follows:
Since it is an unnecessary part to be discarded, the finished product is not affected at all and the substrate can be effectively used.

[0030]

[Brief description of the drawings]

FIG. 1 is a plan view of a main board 1 according to the present invention.

FIG. 2 is a plan view showing a state in which an FPC 2a is fixed to a main board 1 according to the present invention.

FIG. 3 is a sectional view of the main substrate 1 and the FPC 2a according to the present invention, taken along the line AA in FIG. 1;

FIG. 4 is a plan view showing a state where a connector 3a is mounted on a main board 1 according to the present invention.

FIG. 5 is a sectional view taken along the line AA of FIG. 1 in a state where the main board 1 according to the present invention is transferring the solder bath.

FIG. 6 shows a state where the soldering of the connector 3a and the mounting component 9 to the main board 1 and the FPC 2a according to the present invention is completed.
1 is a sectional view taken along line AA of FIG.

FIG. 7 is a side view of the FPC 2a in a state where the FPC 2a according to the present invention is separated from the main board 1.

FIG. 8 shows a base substrate 2 according to a second embodiment of the present invention.
0 plan view

FIG. 9 is a plan view of a conventional main board 101.

FIG. 10 is a plan view showing a state where a conventional main board 101 is divided.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main board 2a, 2b, 2c FPC 3a, 3b, 3c Connector 4 Window hole 5 Slit 6 Terminal 9 Mounting part 10 Terminal 11 Leader terminal 13 Reinforcement board 20 Base board 101c Unnecessary part

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-8-148822 (JP, A) JP-A-3-116889 (JP, A) JP-A-54-19178 (JP, A) (58) Survey Field (Int. Cl. ⁷ , DB name) H05K 3/34 506 H05K 3/34 511

Claims (3)

(57) [Claims] 1. A base in which a plurality of main boards are connected.
Forming a main board conductive circuit pattern for each main board on the board, and forming a soldering hole in an area of the main board where the main board conductive circuit pattern is not formed; Fixing a flexible printed wiring board to the main board so that a part of the flexible printed wiring board is desirably formed on the surface on which the main board conductive circuit pattern is formed from the soldering hole; A step of mounting the component, a step of mounting the mounted component on the main board, and transferring the base board to the solder tank in a state where the surface on which the main board conductive circuit pattern is formed is in close contact with the solder in the solder tank. And soldering the mounted component to the main board while simultaneously soldering the electronic component to the flexible printed circuit board. And Kesuru step, the main the base substrate
A method for soldering an electronic component , comprising: a step of dividing the main board and the flexible printed circuit board; and a step of separating the main board and the flexible printed wiring board. 2. The main board conductive circuit pattern according to claim 1, wherein
It consists of different numbers of pattern shapes.
2. The electronic component according to claim 1, wherein
Soldering method. 3. The area where the soldering hole is formed is an unnecessary part to be discarded.
An electronic component soldering method as described in the above.