JPS6234437U - - Google Patents
Info
- Publication number
- JPS6234437U JPS6234437U JP12524885U JP12524885U JPS6234437U JP S6234437 U JPS6234437 U JP S6234437U JP 12524885 U JP12524885 U JP 12524885U JP 12524885 U JP12524885 U JP 12524885U JP S6234437 U JPS6234437 U JP S6234437U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting
- hole
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第２図は本考案の一実施例を示すもの
であり、第１図ａは本考案によりプリント基板に
固定された半導体素子の保持状態を示す部分正面
図、第１図ｂは、同図ａの部分平面図、第２図ａ
は本考案の半導体素子保持金具の斜視図、第１図
ｂは、半導体素子保持金具の取付脚とプリント基
板との嵌合状態を説明するための部分断面図であ
る。第３図ａ，ｂ，ｃは従来例を示す断面図であ
る。
１……半導体素子、２……取り付穴、３……リ
ード端子、４……プリント基板、５……ビス、６
……放熱器、７……放熱面、８……半導体素子保
持金具、９……取付脚、１０……保持面、１１…
…ナツト、１２……切り込み、１３……取付脚挿
入穴、１４……モールド部、１５……ネジ孔、１
６……半田付け部。
1 and 2 show an embodiment of the present invention, FIG. 1a is a partial front view showing the holding state of a semiconductor element fixed to a printed circuit board according to the present invention, and FIG. 1b is a , Partial plan view of Figure 2a, Figure 2a
1 is a perspective view of the semiconductor element holding metal fitting of the present invention, and FIG. FIGS. 3a, 3b, and 3c are sectional views showing a conventional example. 1... Semiconductor element, 2... Mounting hole, 3... Lead terminal, 4... Printed circuit board, 5... Screw, 6
... Heat sink, 7 ... Heat radiation surface, 8 ... Semiconductor element holding fitting, 9 ... Mounting leg, 10 ... Holding surface, 11 ...
... Nut, 12 ... Notch, 13 ... Mounting leg insertion hole, 14 ... Mold part, 15 ... Screw hole, 1
6...Soldering part.
Claims (1)
リード端子をプリント基板の導電パターンの穴に
挿入し、半田付け固定するものにおいて、ネジ孔
１５を有する保持面１０、該保持面１０から延設
された一対の取付脚９及び該取付脚９に形成した
切り込み１２からなる半導体素子保持金具８を、
半導体素子１のモールド部１４と接触させ、上記
半導体素子取付金具８の切り込み１２を、プリン
ト基板４に設けた取付脚挿入穴１３に挿通係合し
、ビス５を放熱器６の取り付け穴２と半導体素子
１の取り付け穴とを介して、半導体素子保持金具
８のネジ孔１５に螺着固定したことを特徴とする
半導体素子の固定装置。 In a device in which a semiconductor element is attached to a heat sink, the lead terminals of the semiconductor element are inserted into holes in a conductive pattern of a printed circuit board, and fixed by soldering, a holding surface 10 having a screw hole 15 and extending from the holding surface 10 is used. A semiconductor element holding fitting 8 consisting of a pair of mounting legs 9 and a notch 12 formed in the mounting legs 9,
The notch 12 of the semiconductor element mounting bracket 8 is inserted into the mounting leg insertion hole 13 provided on the printed circuit board 4, and the screw 5 is inserted into the mounting hole 2 of the heat sink 6. A device for fixing a semiconductor device, characterized in that it is screwed into a screw hole 15 of a semiconductor device holding fitting 8 through a mounting hole of a semiconductor device 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524885U JPS6234437U (en) | 1985-08-15 | 1985-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524885U JPS6234437U (en) | 1985-08-15 | 1985-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6234437U true JPS6234437U (en) | 1987-02-28 |
Family
ID=31017983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12524885U Pending JPS6234437U (en) | 1985-08-15 | 1985-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234437U (en) |
-
1985
- 1985-08-15 JP JP12524885U patent/JPS6234437U/ja active Pending
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