JPS63174494U - - Google Patents

Info

Publication number
JPS63174494U
JPS63174494U JP17278186U JP17278186U JPS63174494U JP S63174494 U JPS63174494 U JP S63174494U JP 17278186 U JP17278186 U JP 17278186U JP 17278186 U JP17278186 U JP 17278186U JP S63174494 U JPS63174494 U JP S63174494U
Authority
JP
Japan
Prior art keywords
electronic component
heat sink
supported
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17278186U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17278186U priority Critical patent/JPS63174494U/ja
Publication of JPS63174494U publication Critical patent/JPS63174494U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は考案の一実施例に係る電子部品の取付
け装置を示す分解斜視図、第2図は第1図の印刷
配線基板の取付け前の状態を示す平面図、第3図
は第1図の組立て状態を示す断面図である。 10……放熱板、11……支持板、12……フ
レーム、12a……透孔、13,15,20……
螺子、14……印刷配線基板、14a……第1の
スリツト、14b……透孔、14c……第2のス
リツト、14d……部品挿通孔、16……電子部
品、16a……端子、17……ジヤンパー線、1
8……他の電子部品、19……絶縁板。
Fig. 1 is an exploded perspective view showing an electronic component mounting device according to an embodiment of the invention, Fig. 2 is a plan view showing the state before mounting the printed wiring board of Fig. 1, and Fig. 3 is the same as Fig. 1. FIG. 3 is a sectional view showing an assembled state. 10... Heat sink, 11... Support plate, 12... Frame, 12a... Through hole, 13, 15, 20...
Screw, 14...Printed wiring board, 14a...First slit, 14b...Through hole, 14c...Second slit, 14d...Component insertion hole, 16...Electronic component, 16a...Terminal, 17 ... jumper wire, 1
8...Other electronic parts, 19...Insulating board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板に対して熱的に結合されて支持された電
子部品と、前記放熱板に所定の間隔を有して支持
され、前記電子部品の端子の係止される係止部が
回路パターンの接続端に対応して設けられた部品
挿通孔を有した印刷配線基板とを具備したことを
特徴とする電子部品の取付け装置。
An electronic component that is thermally coupled and supported by a heat sink, and a locking portion that is supported by the heat sink at a predetermined distance and in which a terminal of the electronic component is locked is a circuit pattern connection. 1. An electronic component mounting device comprising: a printed wiring board having a component insertion hole provided corresponding to an end thereof.
JP17278186U 1986-11-11 1986-11-11 Pending JPS63174494U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17278186U JPS63174494U (en) 1986-11-11 1986-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17278186U JPS63174494U (en) 1986-11-11 1986-11-11

Publications (1)

Publication Number Publication Date
JPS63174494U true JPS63174494U (en) 1988-11-11

Family

ID=31109630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17278186U Pending JPS63174494U (en) 1986-11-11 1986-11-11

Country Status (1)

Country Link
JP (1) JPS63174494U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018078687A1 (en) * 2016-10-24 2018-10-25 新電元工業株式会社 Electronic device arrangement structure and electronic circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018078687A1 (en) * 2016-10-24 2018-10-25 新電元工業株式会社 Electronic device arrangement structure and electronic circuit device

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