JPS61171258U - - Google Patents
Info
- Publication number
- JPS61171258U JPS61171258U JP5308885U JP5308885U JPS61171258U JP S61171258 U JPS61171258 U JP S61171258U JP 5308885 U JP5308885 U JP 5308885U JP 5308885 U JP5308885 U JP 5308885U JP S61171258 U JPS61171258 U JP S61171258U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- hole
- printed board
- heat sink
- screw hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の組立状態を示す斜
視図、第２図は第１図の装置の構成図、第３図、
第４図は従来装置の構成図である。
１…プリント板、２…電子部品、３…ヒートシ
ンク、６…ねじ、９…透孔、１０…ネジ孔、１１
…取付孔。
Fig. 1 is a perspective view showing an assembled state of an embodiment of the present invention, Fig. 2 is a configuration diagram of the device shown in Fig. 1, Fig. 3,
FIG. 4 is a block diagram of a conventional device. 1... Printed board, 2... Electronic component, 3... Heat sink, 6... Screw, 9... Through hole, 10... Screw hole, 11
...Mounting hole.
Claims (1)
を折り曲げて前記プリント板の導電パターンに半
田付けされる電子部品と、前記電子部品が取付け
られかつ前記プリント板に固定されるヒートシン
クとを備えた電子部品の取付装置において、前記
プリント板に透孔を設け、前記ヒートシンクの前
記電子部品が取付けられる面に前記透孔と対向す
る位置にネジ螺合用のネジ孔を設け、前記電子部
品に前記ネジ孔に対応する取付孔を形成し、前記
透孔から挿入して前記取付穴を介して前記ネジ孔
に螺合せしめるネジにより前記ヒートシンクに前
記電子部品を取付けたことを特徴とする電子部品
の取付装置。 An electronic component comprising a printed board having a conductive pattern, an electronic component whose lead wires are bent and soldered to the conductive pattern of the printed board, and a heat sink to which the electronic component is attached and fixed to the printed board. In the mounting device, a through hole is provided in the printed board, a screw hole for screwing is provided at a position opposite to the through hole on the surface of the heat sink where the electronic component is installed, and the screw hole corresponds to the screw hole in the electronic component. A mounting device for an electronic component, characterized in that the electronic component is mounted on the heat sink using a screw that is inserted through the through hole and screwed into the screw hole through the mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5308885U JPS61171258U (en) | 1985-04-10 | 1985-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5308885U JPS61171258U (en) | 1985-04-10 | 1985-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171258U true JPS61171258U (en) | 1986-10-24 |
Family
ID=30573620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5308885U Pending JPS61171258U (en) | 1985-04-10 | 1985-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171258U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0270451U (en) * | 1988-11-18 | 1990-05-29 |
-
1985
- 1985-04-10 JP JP5308885U patent/JPS61171258U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0270451U (en) * | 1988-11-18 | 1990-05-29 |
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