JPH0270451U - - Google Patents
Info
- Publication number
- JPH0270451U JPH0270451U JP15061488U JP15061488U JPH0270451U JP H0270451 U JPH0270451 U JP H0270451U JP 15061488 U JP15061488 U JP 15061488U JP 15061488 U JP15061488 U JP 15061488U JP H0270451 U JPH0270451 U JP H0270451U
- Authority
- JP
- Japan
- Prior art keywords
- fixing plates
- heat conductive
- conductive fixing
- semiconductor elements
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案の原理構造図、第2図は本考案
の一実施例を示す斜視図、第3図は側面図、第4
図は第1図の―線矢視断面図、第5図は押さ
え板4aの要部断面図、第6図はトランジスタの
構造図、第7図は要部平面図、第8図は本考案の
他の実施例の要部断面図、第9図は本考案の回路
パターン図、第10図は従来例の回路パターン図
、第11図は本考案のトランジスタ配置図、第1
2図は従来例のトランジスタ配置図、第13図は
半導体トランジスタの取付け方法の説明図、第1
4図は従来例の断面図、第15図は他の従来例の
断面図である。
第1図乃至第8図において、1は放熱器、11
は基部、2はプリント基板、1b,1cは伝熱性
固定板、3a,3bは半導体素子(パワートラン
ジスタ)、9は配線パターン部である。
Fig. 1 is a structural diagram of the principle of the present invention, Fig. 2 is a perspective view showing an embodiment of the invention, Fig. 3 is a side view, and Fig. 4 is a diagram showing the principle structure of the present invention.
The figure is a cross-sectional view taken along the line -- in Figure 1, Figure 5 is a cross-sectional view of the main part of the holding plate 4a, Figure 6 is a structural diagram of the transistor, Figure 7 is a plan view of the main part, and Figure 8 is the present invention. 9 is a circuit pattern diagram of the present invention, FIG. 10 is a circuit pattern diagram of a conventional example, and FIG. 11 is a transistor layout diagram of the present invention.
Figure 2 is a layout diagram of a conventional transistor, Figure 13 is an explanatory diagram of how to attach a semiconductor transistor, Figure 1
FIG. 4 is a sectional view of a conventional example, and FIG. 15 is a sectional view of another conventional example. 1 to 8, 1 is a heat sink, 1 1
2 is a base, 2 is a printed circuit board, 1b and 1c are heat conductive fixing plates, 3a and 3b are semiconductor elements (power transistors), and 9 is a wiring pattern portion.
Claims (1)
ら互いに離間して同一方向に延設された伝熱性固
定板1b,1cを設け、 その伝熱性固定板1b,1cの同一側板面に同
一配列のリード端子を有する半導体素子3a,3
bを装着し、各伝熱性固定板1b,1cへの装着
位置を同一とする半導体素子3a,3bの各対応
リード端子をプリント基板2上の対応回路パター
ン部9へ接続したことを特徴とする半導体素子取
付け構造。[Claims for Utility Model Registration] Heat conductive fixing plates 1b and 1c are provided extending in the same direction at a distance from each other from a base 11 of a radiator 1 having heat dissipation fins 1a, and the heat conductive fixing plates 1b and 1c are provided. Semiconductor elements 3a, 3 having lead terminals arranged in the same manner on the same side plate surface of
b, and the corresponding lead terminals of the semiconductor elements 3a, 3b, which are mounted at the same position on the heat conductive fixing plates 1b, 1c, are connected to the corresponding circuit pattern part 9 on the printed circuit board 2. Semiconductor element mounting structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988150614U JPH0638429Y2 (en) | 1988-11-18 | 1988-11-18 | Semiconductor element mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988150614U JPH0638429Y2 (en) | 1988-11-18 | 1988-11-18 | Semiconductor element mounting structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0270451U true JPH0270451U (en) | 1990-05-29 |
JPH0638429Y2 JPH0638429Y2 (en) | 1994-10-05 |
Family
ID=31423918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988150614U Expired - Lifetime JPH0638429Y2 (en) | 1988-11-18 | 1988-11-18 | Semiconductor element mounting structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0638429Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57950U (en) * | 1980-05-30 | 1982-01-06 | ||
JPS61171258U (en) * | 1985-04-10 | 1986-10-24 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57950B2 (en) * | 1973-12-12 | 1982-01-08 |
-
1988
- 1988-11-18 JP JP1988150614U patent/JPH0638429Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57950U (en) * | 1980-05-30 | 1982-01-06 | ||
JPS61171258U (en) * | 1985-04-10 | 1986-10-24 |
Also Published As
Publication number | Publication date |
---|---|
JPH0638429Y2 (en) | 1994-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01105971U (en) | ||
JPH0270451U (en) | ||
JPH0442930Y2 (en) | ||
JPS605143U (en) | heat sink structure | |
JPS6146745U (en) | Centralized heat dissipation mechanism for integrated circuit devices | |
JPS59121892U (en) | heat dissipation device | |
JPS63128742U (en) | ||
JPH0375594U (en) | ||
JPH031498U (en) | ||
JPH0160545U (en) | ||
JPH01140871U (en) | ||
JPS6022841U (en) | radiator | |
JPS60167395U (en) | printed wiring board equipment | |
JPH01118494U (en) | ||
JPH0192140U (en) | ||
JPS6365294U (en) | ||
JPS61127693U (en) | ||
JPS6127270U (en) | printed wiring device | |
JPS63149544U (en) | ||
JPS6230397U (en) | ||
JPS587337U (en) | Hybrid integrated circuit device | |
JPH01174940U (en) | ||
JPH0263597U (en) | ||
JPH0361371U (en) | ||
JPH01104027U (en) |