JPH0442930Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor device that generates heat, such as a power amplifier, and relates to an insulating film between a radiator for heat dissipation and a semiconductor.

[Prior art] Conventionally, this type of heatsink has been processed by attaching a heat-generating semiconductor to the heatsink via an insulating film, and soldering the semiconductor leads to a laminated printed wiring board or wiring conductor (relay wire). .

[Problems to be solved] In the conventional semiconductor and circuit interconnection described above, the shape and mounting direction of the heat dissipation radiator are restricted, and the degree of freedom in the product shape is lost.In particular, the structure of the radiator and the laminated wiring board is There was a problem that it became complicated and went against the trend of compactness and weight reduction. Furthermore, the method using a relay wire has problems in that the connection workability between the semiconductor lead and the relay wire material is poor and the reliability is lowered.

[Means for solving the problem] This invention was made in view of the above circumstances, and includes a conductor pattern buried inside an insulating film laid between a semiconductor element and a substrate, and a method for exposing the conductor pattern. It is characterized by comprising a lead attachment part.

[Example] Hereinafter, an example of this invention will be described with reference to the drawings.

FIGS. 1a and 1b are a plan view showing an insulating film according to a first embodiment of the invention, and FIG.
It is a sectional view taken along line A. In these figures, 1 is a film, which has excellent insulation and thermal conductivity. Three conductor patterns 2, 3, and 4 are buried in the center of the film 1 in the thickness direction. Note that 1a is a semiconductor mounting hole, and the conductor patterns 3 and 4 are buried around the semiconductor mounting hole 1a so as not to interfere with the semiconductor mounting hole 1a.

Further, 5, 5... are lead mounting holes that expose the conductor patterns 2, 3, 4, and 6, 6, 6...
is a lead through-attachment hole that exposes the conductive patterns 2, 3, and 4, and that penetrates through the conductive patterns 2, 3, and 4 to open on the back surface of the film 1.

FIG. 3 shows how the insulating film having the above structure is attached.

Figures 3a and 3b are a plan view and a cross-sectional view, respectively, showing how the insulating film is attached. In these figures, 10 is a semiconductor and 11 is a heat sink. A film 1 is inserted between the semiconductor 10 and the heat sink 11. And these semiconductors 1
0, the film 1 and the heat sink 11 are integrated by a screw 12 passing through the semiconductor mounting hole 1a. Note that 13 is an insulating bushing that insulates the screw 12 and the semiconductor 10.

Also, the three leads 14, 14, 1 of the semiconductor 10
4 are soldered to the corresponding conductor patterns 2, 3, 4 in the lead attachment holes 5, 5, 5, respectively.

Therefore, there are no restrictions on the shape and mounting direction of the heat sink 11, and the degree of freedom in design is improved, resulting in a reduction in size and weight.

Next, Figures 2a and b are respectively the second part of this invention.
A plan view showing an insulating film according to an example and A
- It is a sectional view taken along the A line. In these figures, the conductor patterns 21, 22, 23, 24, 25 are each 2
Laminated in tiers. That is, conductor pattern 2
1...25 are two conductor patterns 21a and 21 stacked vertically at a predetermined interval, respectively.
b, 22a and 22b, 23a and 23b,
It consists of 24a and 24b, 25a and 25b. This allows mounting of semiconductors with multiple leads. In addition, 26 in the figure is
This is a lead through mounting hole.

[Effects of the invention] As explained above, according to this invention, in the insulating film laid between the semiconductor element and the substrate, the conductor pattern buried inside and the lead attachment part exposing the conductor pattern can be separated. With this, there are no restrictions on the shape and mounting direction of the radiator, and the degree of freedom in design is improved, resulting in the effect of achieving smaller size and lighter weight.

[Brief explanation of the drawing]

FIGS. 1a and 1b are a plan view showing an insulating film according to a first embodiment of the invention, and FIG.
A sectional view taken along line A, FIGS. 2a and b are respectively a plan view and a sectional view taken along line AA of the insulating film according to the second embodiment of this invention, and FIGS. FIG. 3 is a plan view and a cross-sectional view showing how an insulating film is attached according to an example. 2, 3, 4, 21, 22, 23, 24, 25...
...Conductor pattern, 5...Lead mounting hole, 6...Lead through mounting hole (5 and 6 above are lead mounting parts),
10...Semiconductor, 11...Radiator, 12...Screw, 13...Insulating bushing, 14...Lead.

Claims (1)

[Claims for Utility Model Registration] (1) An insulating film laid between a semiconductor element and a substrate, characterized by comprising a conductor pattern buried inside and a lead attachment part exposing the conductor pattern. Insulating film. (2) The insulating film according to claim 1, which is characterized in that a plurality of the conductor patterns are laminated.