JPS5983088U - Insulation mechanism for printed wiring boards - Google Patents
Insulation mechanism for printed wiring boardsInfo
- Publication number
- JPS5983088U JPS5983088U JP17775882U JP17775882U JPS5983088U JP S5983088 U JPS5983088 U JP S5983088U JP 17775882 U JP17775882 U JP 17775882U JP 17775882 U JP17775882 U JP 17775882U JP S5983088 U JPS5983088 U JP S5983088U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- insulation mechanism
- wiring boards
- wiring board
- case body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案の技術的内容を示すものであって、第１図
は従来のプリント配線基板に関する絶縁機構の断面図と
その外圧を受けた場合における作用関係を示した断面図
を併せて示し、第２図は本考案によるものの断面図と外
圧作用時の関係を示し、第３図はその外圧が太き（作用
したときの作用関係を部分的に拡大して示したものであ
る。
然じてこれらの図面において、１．３はケース部体、２
はプリント配線基板、５、は本考案に韮る絶縁板、５ａ
はその屈曲成形、６．７は電子部品、＄ａ、７ａはその
取付脚、Ｐは外圧を示すものである。 −The drawings show the technical contents of the present invention, and FIG. 1 shows a cross-sectional view of the insulation mechanism of a conventional printed wiring board and a cross-sectional view showing the working relationship when receiving external pressure. Figure 2 shows a cross-sectional view of the device according to the present invention and its relationship when external pressure is applied, and Figure 3 shows a partially enlarged view of the relationship when external pressure is applied. In these drawings, 1.3 is the case body, 2 is
5 is a printed wiring board, 5 is an insulating board similar to the present invention, 5a
6.7 is the electronic component, $a, 7a is the mounting leg, and P is the external pressure. −
Claims (1)
て取付けたプリント配線基板を設けたものにおいて、前
記ケース部体の内面とプリント配線基板との間に屈曲加
工された絶縁板を介装したことを特徴とするプリント配
線基板に対する絶縁機構。A printed wiring board with electronic components attached to the mounting legs along the inner surface of the case body, wherein a bent insulating plate is interposed between the inner surface of the case body and the printed wiring board. An insulation mechanism for a printed wiring board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17775882U JPS5983088U (en) | 1982-11-26 | 1982-11-26 | Insulation mechanism for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17775882U JPS5983088U (en) | 1982-11-26 | 1982-11-26 | Insulation mechanism for printed wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5983088U true JPS5983088U (en) | 1984-06-05 |
Family
ID=30386102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17775882U Pending JPS5983088U (en) | 1982-11-26 | 1982-11-26 | Insulation mechanism for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5983088U (en) |
-
1982
- 1982-11-26 JP JP17775882U patent/JPS5983088U/en active Pending
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