JPH09352U - Electronic component cooler - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a small electronic component cooler that efficiently cools a power transistor or an IC, and that does not easily transmit vibrations generated in a chassis to electronic components. SOLUTION: A large number of thin flat interposing plates 2 and a large number of thin corrugated fins 3 are alternately laminated to form a core 4, and a thick mounting plate 1 is provided at one end of the core in the laminating direction. Along with the connection, a thick base plate 5 is attached to the other end. Electronic components are attached to the surface of the attachment plate 1, and the attachment plate 1 is elastically supported by the base plate 5 via the corrugated fins 3.

Description

[Detailed description of the device] [Industrial applications]   This invention is a small electronic component cooling that efficiently cools power transistors and ICs. And the mounting plate on which electronic parts are mounted is connected via corrugated fins. And elastically supported. [Prior art]   Cools power transistors, ICs and other semiconductor components with large power capacity Corrugated fins and flat plates as electronic component coolers (heat sinks) Those with and were used. For example, in Japanese Utility Model Publication No. 57-124153, "half "Heat sinks for conductor devices" are composed of U-shaped frames of different sizes. It consists of a multi-assembly of several fin bodies whose side walls are straight and corrugated. It is composed of a tote wall and straight walls and corrugated walls are alternately arranged in parallel, They are sequentially stacked. Then, the electronic parts are mounted on the outer surface of the stacked U-shaped frames on the non-opening side. The attachment plate is joined.   In addition, the "electronic equipment chassis" of Japanese Utility Model Publication No. 61-183590 is an electronic device that generates heat. An inner plate that contacts the board on which the components are mounted and receives heat from the board, and this inner plate at one end Block that comes into contact with a part of the block and the outer plate that contacts the other end of this block and transfers heat to the outside And a corrugated fin provided at a position where there is no block between the outer plate and the inner plate. It is equipped with and. [Problems to be solved]   In all of these conventional techniques, corrugated fins and flat plates are alternately stacked. The heat radiation area is relatively large. But what are these coolers? Also in this case, the corrugated fins and the plate are integrated, and vibrations occur in the chassis etc. Then, the vibration is directly transmitted to the electronic components, which causes the electronic components to malfunction. There was a risk of rubbing.   Therefore, the present invention makes it difficult to transmit the vibration generated in the chassis to the electronic parts, An object is to provide an electronic component cooler having high performance. [Means for solving the problem]   The electronic component cooler of the present invention includes a large number of thin flat interposing plates 2 and a large number of thin flat plates. The corrugated fins 3 and are alternately laminated, and each wave of the corrugated fins 3 is laminated. The outer surfaces of the top and valley of the plate are connected and fixed to the plane of the interposition plate 2 so that heat can be transferred. A4 is configured,   The back surface of the thick mounting plate 1 can transfer heat to one end of the core 4 in the stacking direction. Is fixed and connected to   A thick base plate 5 is attached to the other end of the core 4 in the stacking direction. ,   The electronic component is attached to the surface of the attachment plate 1, and , The mounting plate 1 is attached to the base plate 5 and the corrugated fins are attached to the base plate 5. 3 so that they are elastically supported by the interposition plates 2 between them. Only the gate fins 3 are connected. [Function and effect of device]   In the electronic component cooler of the present invention, the mounting plate 1 is attached to the base plate 5, It is elastically supported via the corrugated fins 3. And each interposition plate 2 The spaces are connected only by the corrugated fins 3.   Therefore, even if the base plate 5 is vibrated, a large number of corrugated fins 3 are interposed. The vibration is absorbed and the vibration applied to the electronic components on the surface of the base plate 5 is maximized. The electronic malfunction can be prevented. 〔Example〕   Next, an embodiment of the present invention will be described with reference to the drawings.   The drawing is a front view showing an example of the present invention. Between the base plate 5 and many interposition plates 2 and corrugated fins 3 ... They are arranged on top of each other. The interposer plates are arranged parallel to each other and at equal intervals. Placed between the interposing plates 2 and 2, and the interposing plate 2 and the mounting plate. 1 and the corrugated fins 3 are arranged between the base plate 5 and the base plate 5. This Each of these parts is made of good heat-transfer material such as aluminum or its alloy material. . And as an example, the mounting plate 1 and the base having a plate thickness of about 2 mm to 10 mm A plate 5 is provided on the surface of which a plurality of electronic mounting or cooler supporting balls are mounted. Hole is provided.   Next, the interposition plate 2 is a flat elongated plate having a plate thickness of about 0.5 mm to 1.5 mm. The shape and size are the same.   Next, the corrugated fin 3 has a plate thickness of 0.05 mm to 0.2 mm. And bend a thin strip of material and cut and raise a number of louvers 7 on its surface. It is a thing. In addition, when the louver 7 blows air to the cooler, it is the boundary of the air flow. This is for dividing the layers to further enhance heat dissipation. In addition, this louver 7 is installed. You don't have to.   In order to bond each of these parts together, the surface of either Cover the slag or solder material and insert it into a vacuum furnace etc. with the whole assembled. By melting the brazing material on the surface of each component and solidifying it, The space may be fixed by brazing.   In addition, only the corrugated fins 3 are joined between the respective interposition plates 2. . Moreover, since the corrugated fin 3 is made of an extremely thin bent material, And it has the ability to absorb vibration vertically and horizontally. That is, the corrugated fin 3 It has a kind of spring effect.   As shown in the figure, the electronic component cooler thus configured is mounted on the mounting plate 1. The flange 11 of the electronic component 8 is placed on the surface, and it is attached via the attachment screw 9. It is fastened and fixed to the case plate 1. Then, the base plate 5 is attached to the casing 12. By being fixed, the electronic component 8 is inserted into the casing 1 via the corrugated fins 3. If the electronic component 8 is a component that can be elastically supported with respect to 2, and the electronic component 8 dislikes vibration. It is especially effective when   When sending air to this cooler, air will flow in the direction perpendicular to the paper surface in the figure. Become so.

BRIEF DESCRIPTION OF THE DRAWINGS The drawing is a front view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ... Mounting plate 2 ... Interposition plate 3 ... Corrugated fin 4 ... Core 5 ... Base plate 8 ... Electronic component 9 ... Mounting screw 11 ... Flange 12 ... Casing 13 ... Cooler

Claims (1)

[Claims for utility model registration] A large number of thin flat interposer plates 2 and a large number of thin corrugated fins 3 are alternately laminated, and the corrugated fins 3 have the wave crests and trough outer surfaces, respectively. The core 4 is constructed by connecting and fixing to the plane of the mounting plate 2 so as to be able to transfer heat. A base plate 5 having a large plate thickness is attached to the other end in the stacking direction, electronic components are attached to the surface of the attachment plate 1, and the attachment plate 1 is attached to the base plate 5 with the corrugated fins. An electronic component cooler in which the respective interposition plates 2 are connected only by the corrugated fins 3 so as to be elastically supported via 3.