JP2575055Y2 - Electronic component cooler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application field] The present invention relates to a small electronic component cooler that efficiently cools a power transistor and an IC, and in particular, a mounting plate on which the electronic component is mounted has elasticity through a corrugated fin. It is related to those that have been endorsed. [Prior art] Electronic component cooler (heat sink) for cooling power transistors, ICs, and other semiconductor components with large power capacity
The one having a corrugated fin and a flat plate has been used. For example, 57-124
No. 153, "Heat sinks for semiconductor devices"
It consists of a multi-assembly of a plurality of fins of different sizes formed in the shape of a frame, the side walls of which are composed of straight walls and corrugated walls. Have been.
The electronic component mounting plate is joined to the outer surface of the superposed U-shaped frame on the non-opening side. Also,
No. 183590 discloses an "electronic device chassis" that includes an inner plate that contacts a substrate on which electronic components that generate heat are mounted and receives heat from the substrate, a block that contacts one part of the inner plate at one end, and a block that is connected to the other end of the block. It has an outer plate that contacts and transmits heat to the outside, and a corrugated fin provided between the outer plate and the inner plate at a position where there is no block. [Problem to be Solved] In each of these prior arts, corrugated fins and flat plates are alternately overlapped, and have a relatively large heat radiation area. However, in each of these coolers, the corrugated fin and the plate are integrated, and when vibration occurs in the chassis etc., the vibration is directly transmitted to the electronic components,
As a result, there is a possibility that the electronic components may malfunction. Accordingly, it is an object of the present invention to provide an electronic component cooler that is difficult to transmit vibration generated in a chassis to electronic components and has high heat dissipation. [Means for Solving the Problems] In the electronic component cooler of the present invention, a large number of thin flat interposed plates 2 and a large number of thin corrugated fins 3 are alternately stacked, and each of the corrugated fins 3 is provided. A core 4 is formed by connecting and fixing the tops and valleys outer surfaces of the waves to the plane of the interposition plate 2 so as to be able to conduct heat, and the back surface of the thick mounting plate 1 is transferred to one end of the core 4 in the laminating direction. A thick base plate 5 is attached to the other end of the core 4 in the laminating direction so that electronic components can be attached to the surface of the attachment plate 1. On the other hand, each of the interposed plates 2 is connected only by the corrugated fins 3 so that the mounting plate 1 is elastically supported via the corrugated fins 3. is there. [Operation and Effect of the Invention] In the electronic component cooler of the invention, the mounting plate 1 is elastically supported via the corrugated fins 3 with respect to the base plate 5. The respective intervening plates 2 are connected only by the corrugated fins 3. Therefore, even if vibration is applied to the base plate 5, the vibration is absorbed through the large number of corrugated fins 3, and the vibration applied to the electronic components on the surface of the base plate 5 is reduced as much as possible, so that the electronic malfunction can be prevented. [Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.
The drawing is a front view showing an example of the present invention, in which a large number of interposed plates 2 and corrugated fins 3 are alternately arranged between a mounting plate 1 and a base plate 5 while being vertically separated. The interposition plates are arranged in parallel with each other and at equal intervals, and the interposition plates 2, 2
Corrugated fins 3 are arranged between the interposition plate 2 and the mounting plate 1 and the base plate 5. Each of these components is made of a good heat conductive material such as aluminum or an alloy thereof. And as an example,
A mounting plate 1 and a base plate 5 having a plate thickness of about 2 mm to 10 mm are provided, and a plurality of electronic mounting or cooler supporting bolt holes are formed on the surface thereof. Next, the interposition plate 2 is formed of a flat and slender plate having a thickness of about 0.5 mm to 1.5 mm, and has the same shape and size. Next, the corrugated fin 3 is formed by bending an extremely thin strip having a thickness of about 0.05 mm to 0.2 mm and cutting and raising a large number of louvers 7 on the surface thereof. The louver 7 is used to separate the boundary layer of the air flow when blowing air to the cooler to further enhance heat radiation. The louver 7 may not be provided. In order to join such components to each other, one of the surfaces of the components is previously coated with a brazing material or a solder material, and the entire assembly is inserted into a vacuum furnace or the like, and the surface of each component is brazed. While melting materials,
By solidifying it, the components may be integrally brazed and fixed. In addition, only the corrugated fins 3 are joined between the respective interposed plates 2. Moreover, since the corrugated fin 3 is made of a bent material of an extremely thin strip, the corrugated fin 3 has a vibration absorbing ability in the vertical and horizontal directions in the figure. That is, the corrugated fin 3 has a kind of spring effect. In the electronic component cooler thus constructed, as shown in the figure, the flange portion 11 of the electronic component 8 is placed on the upper surface of the mounting plate 1 and fastened and fixed to the mounting plate 1 via the mounting screw 9. . When the base plate 5 is fixed to the casing 12, the electronic component 8 can be elastically supported on the casing 12 via the corrugated fins 3. When the electronic component 8 is a component that dislikes vibration, Especially effective. When air is blown through the cooler, air flows in a direction perpendicular to the plane of the drawing.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ... Mounting plate 2 ... Intermediate plate 3 ... Corrugated fin 4 ... Core 5 ... Base plate 8 ... Electronic components 9 ... Mounting screws 11 ... Flange part 12 ... Casing 13 ... Cooler

────────────────────────────────────────────────── ─── Continued on the front page (56) References Japanese Utility Model Showa 61-183590 (JP, U) Japanese Utility Model Showa 57-124153 (JP, U) Registered Utility Model 2528726 (JP, Y2) (58) Fields surveyed ( Int.Cl. ⁶ , DB name) H05K 7/20 F28F 3/08 301

Claims (1)

(57) [Claims for registration of utility model] A large number of thin and flat interposition plates 2 and a large number of thin corrugated fins 3 are alternately stacked, and the corrugated fins 3 have respective wave tops and valley outer surfaces. Is connected and fixed to the plane of the interposition plate 2 so as to be able to conduct heat, so that a core 4 is formed. A thick base plate 5 is attached to the other end of the core 4 in the stacking direction, and an electronic component is attached to the surface of the attachment plate 1. The attachment plate 1 is attached to the base plate 5. An electronic component cooler in which the interposed plates 2 are connected only by the corrugated fins 3 so as to be elastically supported via the corrugated fins 3.