JPS6387862U - - Google Patents
Info
- Publication number
- JPS6387862U JPS6387862U JP18275986U JP18275986U JPS6387862U JP S6387862 U JPS6387862 U JP S6387862U JP 18275986 U JP18275986 U JP 18275986U JP 18275986 U JP18275986 U JP 18275986U JP S6387862 U JPS6387862 U JP S6387862U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat dissipation
- heat
- board body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案によるプリント基板の一実施例
を示す平面図、第２図は第１図のＡ―Ａ線に沿つ
た断面図、第３図は他の実施例を示す平面図、第
４図は第３図のＡ―Ａ線に沿つた断面図を示して
いる。
１……プリント基板、２……電気部品、２ａ…
…端子、３……導電パターン、４……第１の放熱
パターン、５……第２の放熱パターン、６……ス
ルーホールパターン。
FIG. 1 is a plan view showing one embodiment of a printed circuit board according to the present invention, FIG. 2 is a sectional view taken along line A--A in FIG. 1, and FIG. FIG. 4 shows a sectional view taken along line AA in FIG. 3. 1... Printed circuit board, 2... Electrical component, 2a...
... terminal, 3 ... conductive pattern, 4 ... first heat radiation pattern, 5 ... second heat radiation pattern, 6 ... through hole pattern.
Claims (1)
部品配置位置に対応して第１の放熱パターンを設
けるとともに、該プリント基板本体の裏面に該第
１の放熱パターンに対応して第２の放熱パターン
を設け、双方の放熱パターンを該プリント基板本
体を貫通する伝熱部材により熱伝導可能に接続し
たことを特徴とするプリント基板。 A first heat dissipation pattern is provided on the component mounting surface side of the printed circuit board body corresponding to the heat generating electric component arrangement position, and a second heat dissipation pattern is provided on the back surface of the printed circuit board body corresponding to the first heat dissipation pattern. What is claimed is: 1. A printed circuit board, characterized in that the heat dissipation patterns are connected in a heat conductive manner by a heat transfer member penetrating the printed circuit board body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18275986U JPS6387862U (en) | 1986-11-27 | 1986-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18275986U JPS6387862U (en) | 1986-11-27 | 1986-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387862U true JPS6387862U (en) | 1988-06-08 |
Family
ID=31128859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18275986U Pending JPS6387862U (en) | 1986-11-27 | 1986-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387862U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012216642A (en) * | 2011-03-31 | 2012-11-08 | Toshiba Corp | Electronic apparatus and substrate assembly |
-
1986
- 1986-11-27 JP JP18275986U patent/JPS6387862U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012216642A (en) * | 2011-03-31 | 2012-11-08 | Toshiba Corp | Electronic apparatus and substrate assembly |