JPH0321871U - - Google Patents
Info
- Publication number
- JPH0321871U JPH0321871U JP8235689U JP8235689U JPH0321871U JP H0321871 U JPH0321871 U JP H0321871U JP 8235689 U JP8235689 U JP 8235689U JP 8235689 U JP8235689 U JP 8235689U JP H0321871 U JPH0321871 U JP H0321871U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- circuit pattern
- lead
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例のプリント基板を示
す断面図、第２図は第１図のプリント基板に表面
実装用電気部品を実装した状態を示す断面図であ
る。
１……基材、２……回路パターン、３……導電
性フイルム、４……表面実装用電気部品、５……
電極。
FIG. 1 is a cross-sectional view showing a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a state in which electrical components for surface mounting are mounted on the printed circuit board of FIG. 1. 1...Base material, 2...Circuit pattern, 3...Conductive film, 4...Electric component for surface mounting, 5...
electrode.
Claims (1)
において、前記回路パターンのうち少なくとも電
気部品のリード部が接続されるリード接続部の表
面に、加圧及び加熱により接着性が生ずる導電性
フイルムを披着してあることを特徴とするプリン
ト基板。 In a printed circuit board having a circuit pattern formed on its surface, a conductive film that becomes adhesive when pressurized and heated is applied to the surface of at least a lead connection portion of the circuit pattern to which a lead portion of an electrical component is connected. A printed circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8235689U JPH0321871U (en) | 1989-07-13 | 1989-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8235689U JPH0321871U (en) | 1989-07-13 | 1989-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321871U true JPH0321871U (en) | 1991-03-05 |
Family
ID=31629093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8235689U Pending JPH0321871U (en) | 1989-07-13 | 1989-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190799A (en) * | 2005-01-06 | 2006-07-20 | Sony Chem Corp | Manufacturing method for substrate with electrical component |
-
1989
- 1989-07-13 JP JP8235689U patent/JPH0321871U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190799A (en) * | 2005-01-06 | 2006-07-20 | Sony Chem Corp | Manufacturing method for substrate with electrical component |