JPH0263572U - - Google Patents
Info
- Publication number
- JPH0263572U JPH0263572U JP14318288U JP14318288U JPH0263572U JP H0263572 U JPH0263572 U JP H0263572U JP 14318288 U JP14318288 U JP 14318288U JP 14318288 U JP14318288 U JP 14318288U JP H0263572 U JPH0263572 U JP H0263572U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- soldered
- wiring body
- printed wiring
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に係るプリント配線体の平面
図、第２図は第１図のＡ―Ａ線に沿う部分断面図
、及び第３図は従来のプリント配線体の断面図で
ある。
１０……プリント配線体、１１……プリント基
板、１２……半田付け用パターン、１３……スル
ーホール、１４……メツキ、１５……熱伝導用パ
ターン、１８……部品、２０……ヒータブロツク
。
FIG. 1 is a plan view of a printed wiring body according to this invention, FIG. 2 is a partial sectional view taken along line AA in FIG. 1, and FIG. 3 is a sectional view of a conventional printed wiring body. 10... Printed wiring body, 11... Printed circuit board, 12... Soldering pattern, 13... Through hole, 14... Plating, 15... Heat conduction pattern, 18... Parts, 20... Heater block .
Claims (1)
付けされる多数の導出リードを有する回路部品を
表面実装し、他方の面に、前記半田付けされた一
方の面の導電パターンとスルーホールメツキを介
して接続する導電パターンを形成したことを特徴
とするプリント配線体。 A circuit component having a large number of leads soldered to a conductive pattern on one side of a printed circuit board is surface-mounted, and is mounted on the other side via the soldered conductive pattern on one side and through-hole plating. A printed wiring body characterized by forming a conductive pattern for connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14318288U JPH0263572U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14318288U JPH0263572U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263572U true JPH0263572U (en) | 1990-05-11 |
Family
ID=31409773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14318288U Pending JPH0263572U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263572U (en) |
-
1988
- 1988-10-31 JP JP14318288U patent/JPH0263572U/ja active Pending