JPS6346899U - - Google Patents
Info
- Publication number
- JPS6346899U JPS6346899U JP13899686U JP13899686U JPS6346899U JP S6346899 U JPS6346899 U JP S6346899U JP 13899686 U JP13899686 U JP 13899686U JP 13899686 U JP13899686 U JP 13899686U JP S6346899 U JPS6346899 U JP S6346899U
- Authority
- JP
- Japan
- Prior art keywords
- sub
- transistor
- power
- board
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第1図はこの考案の放熱器―基板取付構造の一
実施例の斜視図、第2図は同上放熱器―基板取付
構造の側面図、第3図ないし第5図はそれぞれこ
の考案の放熱器―基板取付構造におけるサブプリ
ント基板のパワープリント基板の固定手段の異な
る実施例の斜視図、第6図は従来の放熱器―基板
取付構造の側面図である。
1……ヒートシンク、1a……折曲部、2……
パワートランジスタ、3……サブトランジスタ、
4……パワープリント基板、5……サブプリント
基板、6……コネクタ、7……シヤーシ、8……
ビス。
Fig. 1 is a perspective view of an embodiment of the heatsink-board mounting structure of this invention, Fig. 2 is a side view of the same heatsink-board mounting structure, and Figs. 3 to 5 respectively show the heatsink of this invention. FIG. 6 is a side view of a conventional heat sink-board mounting structure. 1... Heat sink, 1a... Bent part, 2...
Power transistor, 3...sub transistor,
4...Power printed circuit board, 5...Sub printed circuit board, 6...Connector, 7...Chassis, 8...
Screw.
Claims (1)
を折り曲げて折曲部を形成し、この折曲部にサブ
トランジスタを取り付け、パワートランジスタを
パワープリント基板に接続し、サブトランジスタ
をサブプリント基板に接続し、サブプリント基板
をパワープリント基板に垂直状に固定してなる放
熱器―基板取付構造。 Bend the top side of the heatsink with the power transistor attached to form a bent part, attach the sub-transistor to this bent part, connect the power transistor to the power printed circuit board, connect the sub-transistor to the sub-printed board, and connect the sub-transistor to the sub-printed board. A heatsink-board mounting structure in which a printed circuit board is fixed vertically to a power printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13899686U JPS6346899U (en) | 1986-09-10 | 1986-09-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13899686U JPS6346899U (en) | 1986-09-10 | 1986-09-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6346899U true JPS6346899U (en) | 1988-03-30 |
Family
ID=31044492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13899686U Pending JPS6346899U (en) | 1986-09-10 | 1986-09-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6346899U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01174990U (en) * | 1988-05-31 | 1989-12-13 | ||
JPWO2014020806A1 (en) * | 2012-08-03 | 2016-07-21 | 富士電機株式会社 | Cooling structure and power conversion device |
-
1986
- 1986-09-10 JP JP13899686U patent/JPS6346899U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01174990U (en) * | 1988-05-31 | 1989-12-13 | ||
JPWO2014020806A1 (en) * | 2012-08-03 | 2016-07-21 | 富士電機株式会社 | Cooling structure and power conversion device |