JPS6375067U - - Google Patents
Info
- Publication number
- JPS6375067U JPS6375067U JP16963186U JP16963186U JPS6375067U JP S6375067 U JPS6375067 U JP S6375067U JP 16963186 U JP16963186 U JP 16963186U JP 16963186 U JP16963186 U JP 16963186U JP S6375067 U JPS6375067 U JP S6375067U
- Authority
- JP
- Japan
- Prior art keywords
- power amplifying
- amplifying element
- heat sink
- soldering
- outer frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 230000003321 amplification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に係る電力増幅素子の配線構
造の上面図であり、第２図は側面図である。
１１……ヒートシンク、１２……電力増幅用ト
ランジスタ、１３……片面プリント配線基板。
FIG. 1 is a top view of the wiring structure of a power amplification element according to this invention, and FIG. 2 is a side view. 11...Heat sink, 12...Power amplification transistor, 13...Single-sided printed wiring board.
Claims (1)
基板に半田付け接続し外枠をヒートシンクに接触
させるように固定したことを特徴とする電力増幅
素子の配線構造。 A wiring structure for a power amplifying element, characterized in that a lead wire of the power amplifying element is connected to a single-sided printed wiring board by soldering, and an outer frame is fixed in contact with a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16963186U JPS6375067U (en) | 1986-11-04 | 1986-11-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16963186U JPS6375067U (en) | 1986-11-04 | 1986-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375067U true JPS6375067U (en) | 1988-05-19 |
Family
ID=31103618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16963186U Pending JPS6375067U (en) | 1986-11-04 | 1986-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375067U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218531A (en) * | 2008-03-13 | 2009-09-24 | Panasonic Corp | Inductor and method of manufacturing the same, and circuit module using inductor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944051B2 (en) * | 1979-03-27 | 1984-10-26 | 株式会社 日立メデイコ | ultrasonic probe |
| JPS5952664B2 (en) * | 1975-07-09 | 1984-12-20 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | A rubbery composition containing a polymer or copolymer of a conjugated diene or a blend of a copolymer of a conjugated diene and an aromatic vinyl compound |
| JPS6157532B2 (en) * | 1981-05-15 | 1986-12-08 | Matsushita Electric Ind Co Ltd |
-
1986
- 1986-11-04 JP JP16963186U patent/JPS6375067U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952664B2 (en) * | 1975-07-09 | 1984-12-20 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | A rubbery composition containing a polymer or copolymer of a conjugated diene or a blend of a copolymer of a conjugated diene and an aromatic vinyl compound |
| JPS5944051B2 (en) * | 1979-03-27 | 1984-10-26 | 株式会社 日立メデイコ | ultrasonic probe |
| JPS6157532B2 (en) * | 1981-05-15 | 1986-12-08 | Matsushita Electric Ind Co Ltd |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218531A (en) * | 2008-03-13 | 2009-09-24 | Panasonic Corp | Inductor and method of manufacturing the same, and circuit module using inductor |