JP2009218531A - Inductor and method of manufacturing the same, and circuit module using inductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein a conventional inductor has lacked reliability, such as mountability and vibration resistance. <P>SOLUTION: In an inductor, its manufacturing method, and a circuit module using the inductor, a choke coil 11 comprises a core set 12, a winding coil 15 that is provided in the core set 12 and has connection terminal sections 17 at both the ends, and a mold section 18 for covering them. On at least one side of the mold section 18, a mount section 19 made of a packaging resin having a mounting hole 20 in a thickness direction is provided, and the mountability and vibration resistance are improved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inductor which is one of electronic components used in various electronic devices, a manufacturing method thereof, and a circuit module using the inductor.

  With the miniaturization of various electronic devices, further miniaturization, weight reduction, and cost reduction have been demanded for inductor components (particularly choke coils).

  Furthermore, in recent years, inductors such as choke coils have been frequently used for in-vehicle applications such as hybrid cars. In particular, when using inductor parts for in-vehicle use, etc., because it handles large power compared to conventional consumer products such as televisions, it is used in severe environments such as temperature and vibration in addition to large heavy parts. High reliability (including heat resistance, vibration resistance, and high strength of the main body and its mounting portion) is required.

  For example, an inductor as disclosed in Patent Document 1 has been proposed for mounting a conventional choke.

  FIG. 10 is a perspective view of a conventional resin-molded inductor, which is proposed in Patent Document 1. FIG. 10 is a cross-section showing the internal structure, and a sealing molding resin inlet (not shown) formed between the core 1 and the core 2 is used to The gap between the coil 2 and the coil 4, and also the exterior portion thereof, is resin-molded using the sealing molding resin 5.

As such a resin mold, mold transformers as described in Patent Documents 2 to 4 are also known. In addition, as a method of attaching an inductor component used in a vehicle or the like, a method in which stress applied to a core is relaxed using a spring or the like as in Patent Document 5, and a mounting seat is provided on a base as in Patent Document 6. A method of mounting and attaching using a presser spring is also disclosed.
JP-A-6-29123 JP-A-60-21118 JP 2003-173917 A JP 2004-39888 A JP 2000-182847 A JP 2006-339230 A

  However, since the conventional molded inductor proposed in FIG. 10 and the like is fixed to a circuit board or the like by using the terminal electrode plate 3, it has been difficult to use it for applications requiring vibration resistance such as in-vehicle use. Also, Patent Documents 2 to 4 do not provide a configuration for supporting and fixing the weight of the main body, and thus have left problems in vibration resistance. Furthermore, in the configuration of mounting using a leaf spring or the like as in Patent Documents 5 and 6, it is necessary to design a spring that satisfies the conflicting requirements of suppressing the core while relaxing the stress on the exposed core. It was difficult.

  The present invention provides an inductor with improved safety and vibration resistance that can be used for in-vehicle applications and the like, and a circuit module (power supply unit) on which the inductor is mounted.

  In order to solve the above problems, the present invention provides an inductor comprising a core, a coil having connection terminal portions at both ends, and a mold portion that covers the core and a part of the coil. The inductor is provided with a mounting portion having a hole on one or more side surfaces of the core covered with.

  The inductor includes a core, a coil having connection terminal portions at both ends, and a mold portion that covers the core and a part of the coil. The mounting portion is an inductor provided at a position different from the connection terminal portion.

  Furthermore, the inductor includes a core, a coil having connection terminal portions at both ends, and a mold portion that covers the core and a part of the coil, and is formed of the molding material at a position adjacent to the core. The inductor is provided with a mounting portion.

  With the above configuration, the core set and coil section are integrated, resulting in a strong structure, improved vibration resistance, insulation, thermal conductivity, reliability, and the need for a leaf spring for mounting, etc. Improves. Further, since the connection terminal portion is provided at a position different from the attachment portion, it can be prevented from receiving mechanical stress. Further, since the stress is not directly applied between the outer leg magnetic legs, the core crack is not generated, and the vibration resistance is further improved.

  The present invention can fix a choke coil to a circuit board or the like (here, the fixability is a multilayer circuit board in which glass fibers of a choke coil are hardened with an epoxy resin or a metal pattern with high heat dissipation such as a lead frame). A heat-dissipating substrate fixed to a metal plate with a heat transfer layer, and also includes attachment to a housing or chassis). Etc. are used to increase the fixing strength.

  Further, a plurality of substrates can be mounted substantially in parallel using the mounting portion, and the circuit module using the choke coil can be reduced in size and height.

(Embodiment 1)
Hereinafter, Embodiment 1 of the present invention will be specifically described with reference to FIGS.

  1A to 1C are perspective views of a choke coil described in the first embodiment. 1A to 1C, 11a and 11b are choke coils, 12 is a core set, 13 is a first core, 14 is a second core, 15 is a winding coil, 16 is an outer leg, and 17 is an outer leg. The connection terminal portion, 18 is a mold portion, 19 is a mounting portion, and 20a and 20b are holes.

  FIG. 1A shows a core set 12 composed of a first core 13 and a second core 14, and a winding coil 15 provided in the core set 12 and having connection terminal portions 17 at both ends. Are equivalent to the internal structure of the choke coil 11a described in FIG. 1 (B) and the choke coil 11b described in FIG. 1 (C).

  FIG. 1B is a perspective view for explaining a state where a part or more of the portion shown in FIG. In FIG. 1 (B), a core set 12 composed of a first core 13 and a second core 14, and a winding coil 15 provided in the core set 12 and having connection terminal portions 17 at both ends, A part or more thereof is covered with the mold part 18. Since the core part 12 and the coil part 22 are integrated by this mold part 18, it becomes a strong structure, and in addition to improving vibration resistance, insulation and thermal conductivity can be dramatically improved. And the attachment part 19 which has the hole 20a in the thickness direction is provided in one side or more of this mold part 18. As shown in FIG. The mounting portion 19 is made of the same material as that of the mold portion 18, so that when the molding portion 18 is molded (for example, molding), the mounting portion 19 is also formed as an integral body at the same time, so that the molding portion 18 and the mounting portion 19 are formed. In addition to improving reliability by filling with an insulating resin, it is possible to eliminate the need for a leaf spring for mounting and the like, and it can be easily mounted.

  As shown in FIG. 1 (B), the connection terminal portion 17 protrudes from the mold portion 18 and the hole 20b is further provided, so that the choke coil 11a can be easily attached and the fixing strength can be increased.

  In FIG. 1B, the connection terminal portion 17 and the attachment portion 19 are provided on different surfaces of the choke coil 11a, but the connection terminal portion 17 is for electrical connection and depends on the weight of the choke coil 11a main body. It is assumed that the mounting portion 19 is not subjected to mechanical stress, and serves as a portion that supports the weight of the main body of the choke coil 11a so as not to interfere with each other.

  FIG. 1C is a perspective view of the choke coil 11b when the thickness of the attachment portion 19 is the thickest portion of the choke coil 11b. As shown in FIG. 1C, the thickness (or height) of the mounting portion 19 is set to the thickness of the thickest portion (or the height of the highest portion) of the choke coil 11b. As described in FIG. 5, it is possible to support the upper and lower substrates by using the mounting portion 19 provided on the choke coil 11b.

  Also in FIG. 1 (B), as shown in FIG. 1 (C), not only the winding coil 15 but also a part of the connection terminal portion 17 is protected by the mold portion 18 so that the root of the winding lead terminal is obtained. The vibration resistance strength of the portion is improved, and the reliability can be improved. In addition, by making it as shown in FIG. 1C, the biting property of the exterior resin (so-called mold resin) constituting the mold portion 18 in the vicinity of the connection terminal portion 17 can be improved. 18 has the effect of increasing the processing accuracy.

(Embodiment 2)
Next, an example of a method for manufacturing the chokes 11a and 11b described in the first embodiment will be described with reference to FIG.

  FIG. 2 is a perspective view illustrating the internal structure of the choke coils 11a and 11b described with reference to FIGS. In FIG. 2, 21a and 21b are insulating spacers, 22 is a coil portion, 23a and 23b are connecting portions of the insulating spacer, 24 is a middle leg portion, and 25 is an arrow.

  First, a copper wire for the coil is prepared. As the coil copper wire, a flat copper wire should be used. It is desirable from the viewpoints of downsizing (particularly low profile) and reduction of coil resistance. Insulation is secured in the coil portion 22 by using a copper wire that has been subjected to an insulation coating process. Then, as shown in the winding coil 15 in FIG. 2, the coil copper wire is wound by a method such as edgewise winding. Thus, if a flat copper wire is formed by edgewise winding, a connection terminal portion 17 described later can be easily formed on the extension of the winding. In addition, since the cross-sectional area of the coil portion is also used effectively, the winding resistance is low, which is optimal as a large current inductor.

  Connection terminal portions 17 are formed at both ends of the winding coil 15. The connection terminal portion 17 is a portion where the insulation coating of the copper wire for the coil is peeled off, but in order to prevent mountability and copper oxidation, a nickel base for the purpose of plating treatment with solder, tin, etc. and whisker generation In some cases, processing is performed. Also, a hole 20b for fixing the screw 26 may be provided. When the hole 20b is provided, plating can be formed on the inner wall of the hole 20b by performing a plating process after the hole 20b is processed. Also, the fixing strength of the choke coils 11a and 11b shown in FIGS. 1B and 1C to the circuit board or the like by the screws 26 or the like is increased by using the holes 20b. As shown in FIG. 2, a plurality of holes 20b are provided adjacent to each other as necessary to increase the fixing strength of the choke coils 11a and 11b, as well as a circuit board and a lead frame (both not shown). Can reduce the contact resistance. This can be fixed only by the vicinity of the hole 20b with only one hole 20b. However, by forming a plurality of holes 20b adjacent to each other (not shown), a portion between the plurality of holes 20b is also a circuit. This is because it can adhere to the substrate and the lead frame. Further, by providing this hole 20b, the positional accuracy between the first core 13, the second core 14 and the like and the winding coil 15 can be increased also in the manufacturing process of the choke coils 11a and 11b. Further, the hole 20b can be used as a reference for positioning the coil during molding.

  Next, a first core 13 and a second core 14 are prepared. The first core 13 and the second core 14 can have substantially the same shape (or the cost can be reduced by using the same core separately from the first core 13 and the second core 14). In addition, the curve (or smooth unevenness | corrugation) according to the shape of the coil part 22 is formed in the inner surface of the outer leg 16, and the efficiency of the closed magnetic circuit in a limited area is improved. Further, the moldability (for example, moldability) of the first core 13 and the second core 14 is improved. In addition, although ferrite material may be used as these core materials, the magnetic characteristic (DC superimposition characteristic) of the choke coil 11 can be enhanced by using a dust core (a dust core). In addition, it is possible to prevent deterioration of magnetic characteristics in molding. Here, the dust core is, for example, a temperature at which metal powder or other mixed material does not dissolve after compression molding metal powder such as iron or an alloy obtained by adding at least one material such as iron, silicon, nickel, and aluminum. 1000 [deg.] C. or less), and an insulating film is formed on the surface of the metal powder and has a magnetic gap between the metal powders. Compared to a ferrite core in which metal powder is sintered at a high temperature (1200 ° C or higher) to form a ceramic body, the dust core is originally a metal and has a plurality of magnetic gaps inside, so resin molding When mechanical stress is sometimes applied to the core, the magnetostriction phenomenon is slow and the permeability and loss are less deteriorated. If a small crack is generated inside, the magnetic gap is only slightly increased. It is a core suitable for resin molding with little deterioration of properties. Further, since the magnetic flux saturation density is twice or more that of ferrite as a magnetic characteristic, the magnetic saturation does not occur even for a large current, and it is suitable for miniaturization. The dust core examined this time is a relatively large weight core having a size of approximately 20 mm square, a height of about 15 mm (20 mm × 20 mm × height 15 mm), and a weight of 20 g or more. This is particularly effective for large-sized heavy inductors using a core. As a guideline, a size of 15 mm square or more and a weight of 15 g or more are empirically reasonable numbers.

  Next, a set of insulating spacers 21a and 21b is prepared. The insulating spacers 21a and 21b are formed by injection molding using an insulating resin. Needless to say, a resin material satisfying heat resistance such as soldering is selected. Connecting portions 23a and 23b are formed around the hole 20 formed in the central portion of the insulating spacers 21a and 21b. Then, the winding coil 15 is sandwiched and fixed between the pair of insulating spacers 21a and 21b as shown in FIG. At this time, the connecting portions 23a and 23b may be fitted to each other to fix the pair of insulating spacers 21a and 21b. The insulating spacers 21a and 21b serve to prevent contact between the coil portion 22 and the first and second cores 13 and 14, and are not necessarily formed by injection molding. A shaped insulator may be formed by thermoforming or the like. Further, the shape may be changed according to the design.

  As described above, as shown by the arrow 25 in FIG. 2, these are integrated, and finally the insulating resin is positioned while positioning the outer surfaces of the cores 13 and 14 and the connection terminal portion 17 of the coil 15 as a reference in the mold. Thus, the mold part 18 and the attachment part 19 are formed to complete the choke coils 11a and 11b shown in FIG. The hole 20a formed in the attachment portion 19 may be formed simultaneously with resin molding, or may be formed with a drill or the like after resin molding. In addition, from the viewpoint of productivity, this resin mold is preferably injection molding (injection molding), but other methods such as casting and transfer molding may be used.

  In the first and second embodiments, the winding coil 15 has been described by subjecting a flat copper wire to edgewise winding. However, regarding the method of forming the coil, a concentric winding coil using a general round electric wire is used. Alternatively, other methods such as a non-winding coil such as a copper plate bending coil may be used.

(Embodiment 3)
Hereinafter, as a third embodiment of the present invention, a method of fixing the choke coils 11a and 11b described in the first embodiment to a substrate will be specifically described with reference to FIGS.

  FIG. 3 is a cross-sectional view for explaining a state in which the choke coil 11a described in FIG. In FIG. 3, reference numeral 26 denotes a screw, and 27 denotes a substrate for fixing the choke coil 11. Here, the substrate 27 is a printed wiring board (including a multilayer board) made of glass epoxy resin, a metal board in which a wiring pattern is formed on a metal plate, a high heat in which a lead frame is fixed to the metal plate with a heat conductive resin. Also includes a conductive resin substrate. Moreover, the heat sink for heat radiation which consists of metals etc. may be sufficient. That is, as long as it is a base for attaching the choke coil, resin may be used and the material is not limited to the material.

  As shown in FIG. 3, a part of the core set 12 and the coil part 22 is covered with the mold part 18. In addition, since the core set 12 and the coil portion 22 are integrated by filling the gap between the core set 12 and the coil portion 22 with the mold portion 18, the structure is strong and the vibration resistance is improved and the insulation is improved. And thermal conductivity can be dramatically improved.

  A mounting portion 19 is provided using a part of the mold portion 18. In addition, by providing a curved surface portion (or R portion) at the base of the mounting portion 19 (for example, a portion close to the core set 12), the wraparound property of the resin at the time of molding is improved. By providing this curved surface portion at the base portion of the attachment portion 19, the strength of the attachment portion 19 is also improved.

  3 is provided with a hole 20a provided in the attachment portion 19 to fix the choke coil 11 to the substrate 27.

  As shown in FIG. 3, the choke coil 11 is mounted on the substrate 27 using a hole 20a provided on one or more side surfaces of the choke coil 11, and a screw 26 or a fixing tool (the fixing tool is not shown. The fixing tool is fixed). Mounting pins, posts, pillars, bars, etc.) to increase the mounting strength.

  FIG. 4 is a cross-sectional view illustrating a state in which the choke coil 11b described in FIG. 1C according to the first embodiment is fixed to the substrate 27 with screws 26. In FIG. 4, the thickest part (or tall part) of the choke coil 11 is an attachment part 19 provided with a hole 20a. As described above, by increasing the thickness (or height) of the attachment portion 19, the choke coil 11 can be used as a stacking jig (or spacer) for stacking a plurality of substrates 27.

  In addition, by providing a step of 0.5 mm or more between the mounting portion 19 and other portions, the copper foil pattern formed on the surface of the circuit board is affected when the choke coil is fixed to the circuit board. Don't give.

  FIG. 5 is a cross-sectional view illustrating a state in which a plurality of substrates 27 are stacked using the choke coil 11 shown in FIG.

  In FIG. 5, 28 is an electronic component such as a chip component or a semiconductor, 29 is an insulating heat transfer layer, 30 is a metal plate, 31 is a heat dissipation substrate, and 32 is a circuit module.

  In FIG. 5, the heat dissipation substrate 31 is obtained by laminating an insulating heat transfer layer 29 on a metal plate 30 such as aluminum or copper. A wiring pattern made of a copper foil, a lead frame (including a copper plate), or the like may be formed on the surface of the insulating heat transfer layer 29 or the like.

  The insulating heat transfer layer 29 may be a sheet-like material in which ceramic powder such as alumina is dispersed in a thermosetting resin such as an epoxy resin.

  The screw 26 in FIG. 5 is a cross-sectional view for explaining a state in which the substrate 27 on which the electronic component 28 is mounted and the heat dissipation substrate 31 are stacked by the choke coil 11 set therebetween.

  In FIG. 5, the choke coil 11 is mounted on the surface of the heat dissipation board 31 (in FIG. 5, the connection terminal portion 17 of the choke coil 11 and the wiring pattern formed on the surface of the heat dissipation board 31 are not shown). .

  Then, as shown in FIG. 5, the choke coil 11 is mounted on the heat dissipation board 31 in advance. After that, as shown in FIG. 5, the board 27 on which the electronic component 28 has been mounted in advance is fixed using screws 26 to form a circuit module 32.

  As described above, as shown in FIG. 5, by increasing the thickness (or height) of the mounting portion 19 of the choke coil 11 in FIG. 4, it is possible to support the upper and lower substrates using the mounting portion 19. If the machine is fixed by, for example, the deflection of the upper and lower substrates can be reduced. In addition, since there are gaps between the upper and lower surfaces of the cores 13 and 14, the weight of the upper and lower substrates is not received by the core surface, and core cracks can be prevented.

  The heat dissipation board 31 may be a heatsink for heat dissipation made of metal or the like, as in FIG. 3 showing the third embodiment. That is, as long as it is a base for attaching the choke coil, resin may be used and the material is not limited to the material. In this case, it goes without saying that the choke coil may be connected by other means such as a bus bar.

  Next, another circuit module 32 will be described with reference to FIGS. 6 and 7 both show a mounting part 19 provided on the side surface of the choke coil 11 and a step in the other part.

  6A and 6B are cross-sectional views of the circuit module 32 having the choke coil 11 fixed so as to penetrate a part of one of the substrates 27. 6A and 6B, the side surface of the choke coil 11 has a mounting portion 19. Then, as shown in FIG. 6A, the substrate 27 is set above and below the choke coil 11 and fixed in the direction indicated by the arrow 25 with the screw 26. Here, a hole 20e is formed in one substrate 27 so that a part of the choke coil 11 is exposed. FIG. 6B is a cross section of the circuit module 32 thus formed. 6A and 6B, a copper foil pattern, a through hole, a solder resist, etc. formed on the surface or inside of the substrate 27 are not shown. Also, the electronic component 28 mounted on the surface of the substrate 27 is not shown.

  As shown in FIG. 6B, a plurality of substrates 27 can be fixed adjacently in parallel. By using a plurality of choke coils 11 (especially, it is desirable that the mounting portions 19 have substantially the same height or thickness), the fixing strength between the plurality of substrates 27 can be increased.

  FIGS. 7A and 7B are cross-sectional views of the circuit module 32 having the choke coil 11 fixed so as to penetrate a part of the plurality of substrates 27. 7A and 7B, a mounting portion 19 is provided on the side surface of the choke coil 11. Then, as shown in FIG. 7A, the substrate 27 is set above and below the choke coil 11 and fixed in the direction indicated by the arrow 25 with a screw 26. Here, a hollow 20e is formed in both substrates 27 so that a part of the choke coil 11 is exposed. FIG. 7B is a cross section of the circuit module 32 thus formed. 7A and 7B, a copper foil pattern, a through hole, a solder resist, etc. formed on the surface or inside of the substrate 27 are not shown. Also, the electronic component 28 mounted on the surface of the substrate 27 is not shown. 6B and 7B, the distance between the substrates 27 can be further narrowed, and various devices can be made thinner and shorter.

  Although the description of the circuit module is used in the description of FIGS. 5 to 7 above, the effect is the same even if the expression is replaced with the circuit unit or the power supply unit.

  Next, the formation position of the attachment portion 19 provided on the side surface of the choke coil 11 will be described with reference to FIGS.

  FIG. 8 is a perspective view showing the positional relationship between the first core 13 and the second core 14 built in the choke coil 11 and the mounting portion 19. In FIG. 8, the choke coil 11 is not shown (the mold portion 18 and the winding coil 15 are not shown). In FIG. 8, the attachment portion 19 is not shown (screws 26 a and 26 b and arrows 25 a and 25 b indicate the position of the attachment portion 19 instead of the attachment portion 19.

  8 and 9, the mounting portion 19a indicated by the screw 26a and the arrow 25a (the mounting portion 19a is not shown in FIG. 8, but is shown in FIG. 9 described later) is the first core 13 or The second core 14 is provided away from the outer leg 16.

  8 and 9, the mounting portion 19b indicated by the screw 26b and the arrow 25b (the mounting portion 19b is not shown in FIG. 8, but is shown in FIG. 9 described later) is the first core 13 or The second core 14 is provided adjacent to the outer leg 16.

  As shown in FIG. 9, the mounting portion for fixing the choke coil 11 is desirably a position 19b provided adjacent to the core set 12 such as the outer leg 16 as indicated by a screw 26b or an arrow 25b. When the mounting portion 19a is provided at a position away from the core set 12 as shown by the screw 26a or the arrow 25a, a part of the core set 12 (for example, a portion connecting the middle leg 24 and the outer leg 16) depending on the application. There is a possibility that stress is generated in the surface, and in some cases, it may trigger generation of cracks or the like.

  Next, it will be described in more detail with reference to FIG. FIG. 9 is a cross-sectional view of the choke coil 11a shown in FIG. In FIG. 9, the winding coil 15, the connection terminal portion 17, and the mold portion 18 (or mold resin) filled in the first core 13 are also not shown.

  In FIG. 9, the mounting portion 19 a is located at a portion away from the first core 13 and the second core 14 (particularly the outer leg 16) described in FIG. 8, that is, between the outer legs 16 on both outer sides. When a load is applied to the mounting portion 19, a force is applied between the outer legs 16, and a core crack or the like is likely to occur.

  9, the attachment portion 19b is provided at a position adjacent to the outer leg 16, that is, on the outer side surface of the butting surface of the outer leg magnetic leg 16 of the core. This corresponds to the screw 26b or the arrow 25b adjacent to the second core 14 (especially the outer leg 16). As shown in the attachment portion 19b of FIG. 9, by providing the attachment portion 19 at a position adjacent to the outer leg 16, the first core 13 can be applied even when a load is applied to the attachment portion 19 or vibration is applied in the market. Since the stress is applied only to the outer peripheral portion from the abutting portion of the outer leg magnetic leg 16 of the second core 14 and no stress is directly applied between the outer legs 16, the core crack or the like is not generated. The vibration resistance is further improved.

  Although a plurality of attachment portions 19a and 19b are shown in FIG. 9, one or more (preferably two or more) may be provided. The mounting portions 19a and 19b are preferably formed with holes on one side or more of the core covered with the mold portion 18. The mounting strength can be increased by providing a plurality at the opposing positions (or on the opposing side surfaces) of the outer peripheral portion of the mold portion 18, and the vibration resistance can be improved.

  In the above description, the core is an EE type combination, but UU (a combination of U type core and U type core), UI (a combination of U type core and I type core), EI (E type core). Even in other shapes such as a combination of the I-type core and the I-type core, if the position of the mounting portion is provided in a portion adjacent to the magnetic leg (that is, the outer side surface of the outer leg butting portion), the effect is It is obtained in the same way.

  As described above, the core (including the first core 13, the second core 14, or the core set 12), the winding coil 15 having the connection terminal portions 17 at both ends, the core and the winding coil. A choke coil 11 comprising a mold portion 18 covering at least a part of the choke coil 11, wherein the choke coil 11 is provided with a mounting portion 19 having a hole 20 on one side surface or more of the core covered with the mold portion 18. As a result, a strong structure is obtained, and in addition to improving vibration resistance, insulation, thermal conductivity, and reliability, a leaf spring for mounting and the like can be eliminated, and the choke coil having excellent mounting properties to the substrate 27 and the like. 11 is provided.

  Also, a core (including the first core 13, the second core 14, or the core set 12), a winding coil 15 having connection terminal portions 17 at both ends, and a part of the core and the winding coil 15. A choke coil 11 comprising a mold part 18 covering the above, and a mounting part 19 comprising the mold part 18 is provided at a position different from the connection terminal part 17 on the opposite side surface of the mold part 18. By making the choke coil 11 into a strong structure, vibration resistance, insulation, thermal conductivity, reliability are improved, and a leaf spring for mounting can be made unnecessary. It can be made not to receive mechanical stress.

  A core (including the first core 13, the second core 14, or the core set 12), a winding coil 15 having connection terminal portions 17 at both ends, and a part of the core and the winding coil 15. A choke coil 11 comprising a mold portion 18 to be coated, wherein the choke coil 11 is provided with a mounting portion 19 made of the molding material at a position adjacent to the core, thereby providing a strong structure, vibration resistance, Insulation, thermal conductivity, and reliability are improved, and a leaf spring for mounting can be eliminated. In addition, since no stress is directly applied between the outer leg magnetic legs 16, core cracking or the like occurs. Disappear. This further improves vibration resistance.

  By making the mounting portion 19 the choke coil 11 which is the thickest part of the choke coil 11, it becomes possible to support the upper and lower substrates and to reduce the deflection of the upper and lower substrates. Further, the weight of the upper and lower substrates is not received by the core surface, and core breakage or the like can be prevented.

  Further, by providing a curved surface at a part or more of the connecting portion between the mold portion 18 and the mounting portion 19, it is possible to increase the strength of the mounting portion of the choke coil, and further, the stress to the connecting portion between the mold portion 18 and the mounting portion 19 is increased. Concentration can be prevented, and the mechanical strength of the choke coil 11 by the screw 26 or the fixture to the substrate 27 or the like is increased.

  By using the choke coil 11 having a step between the mounting portion 19 and other portions, the circuit module 32 as shown in FIGS. Realize turning.

  In the choke coil 11 described above, the magnetic characteristics (DC superposition characteristics) can be improved by using the cores 13 and 14 as dust cores. In addition, it is possible to prevent the deterioration of magnetic characteristics in molding and to achieve miniaturization.

  A step of forming a winding coil 15 having connection terminal portions 17 at both ends; a step of sandwiching the upper and lower sides of the winding coil 15 by a core set 12 comprising a first core 13 and a second core 14; The winding coil 15 and a part of the core set 12 are covered with a mold part 18 so as to have a hole 20 in the thickness direction on one or more side surfaces. The choke coil 11 corresponding to fixing by a tool (not shown) or the like or fixing of the plurality of substrates 27 can be stably provided.

  A circuit module 32 comprising a plurality of substrates 27 and one or more choke coils 11 mounted on one or more of the substrates 27, wherein the choke coil 11 includes a first core 13, a second core 14, A core set 12 comprising: a winding coil 15 provided in the core set 12 having connection terminal portions 17 at both ends; and a part of the core set 12 and the winding coil 15 are covered; A mold part 18 having a mounting part 19 having a thickness direction hole 20 on the side surface or more, and a plurality of the substrates 27 are laminated with screws 26 or fixtures inserted into the holes 20; By doing so, the plurality of substrates 27 can be firmly fixed in a state where they are separated by a certain distance, so that the substrate 27 can be prevented from being bent and a circuit module having excellent vibration resistance can be provided. . The separated distance can be positively air-cooled (for example, when the circuit module 32 is set up vertically, this gap can cause a chimney caused by the rising air current generated by the choke coil 11 that generates heat, or a chimney effect). Can also be used for thermal insulation.

  The winding coil 15 is preferably wound in the edgewise direction as shown in FIG. By winding in the edgewise direction, the choke coil 11 can be made thin (including low profile) and low in resistance.

  In the present invention, all the choke coils have been described. However, the effect is the same even with an inductor including a transformer having a plurality of windings.

  As described above, the multiple choke coil of the present invention and the manufacturing method thereof can reduce the height of the choke coil, facilitate the mounting (increase the installation area), and make it earthquake resistant (preventing peeling during vibration). Realize downsizing and high performance of equipment.

(A)-(C) is a perspective view of the choke coil described in the first embodiment 1 is an internal configuration diagram of the choke coil of FIG. 1 described in the second embodiment. Sectional drawing which attaches the choke coil of FIG. 1 (B) which shows Embodiment 3 to a board | substrate Sectional drawing which attaches the choke coil of FIG.1 (C) which shows Embodiment 3 to a board | substrate Sectional drawing explaining a mode that the choke coil of FIG. 4 demonstrated in Embodiment 3 and a several board | substrate are laminated | stacked Sectional drawing of the circuit module which mounted the other choke coil demonstrated in Embodiment 3 Sectional drawing of the circuit module which mounted the other choke coil demonstrated in Embodiment 3 The perspective view which shows the positional relationship of the core incorporated in the choke coil demonstrated in Embodiment 3, and an attachment part. Sectional drawing from the top which shows the attachment part of the choke coil demonstrated in Embodiment 3 Perspective view of a conventional inductor

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Choke coil 12 Core set 13 1st core 14 2nd core 15 Winding coil 16 Outer leg 17 Connection terminal part 18 Mold part 19 Mounting part 20 Hole 21 Insulating spacer 22 Coil part 23 Connection part 24 Middle leg part 25 Arrow 26 Screw 27 Board 28 Electronic component 29 Insulating heat transfer layer 30 Metal plate 31 Heat dissipation board 32 Circuit module

Claims (9)

A core and a coil having connection terminal portions at both ends;
An inductor comprising the core and a mold part covering at least a part of the coil,
An inductor provided with a mounting portion having a hole on one side or more of the core covered with the mold portion. A core and a coil having connection terminal portions at both ends;
An inductor comprising the core and a mold part covering at least a part of the coil,
The inductor which provided the attaching part which consists of the said mold part in the position different from the said connection terminal part in the side surface which the said mold part opposes. A core and a coil having connection terminal portions at both ends;
An inductor comprising the core and a mold part covering at least a part of the coil,
An inductor provided with an attachment portion made of the molding material at a position adjacent to the core. The inductor according to any one of claims 1 to 3, wherein the attachment portion is the thickest portion of the inductor. The inductor according to any one of claims 1 to 3, wherein a curved surface is provided on a part or more of a connection portion between the mold part and the attachment part. The inductor as described in any one of Claims 1-3 which provided the level | step difference between the attaching part and the other part. The inductor according to any one of claims 1 to 6, wherein the core is a dust core. Forming a coil having connection terminals at both ends;
Sandwiching the top and bottom of the coil with a core set consisting of a first core and a second core;
Covering a part or more of the coil and the core set with a mold part so as to have a hole in the thickness direction on one or more side surfaces;
A method of manufacturing an inductor. A circuit module comprising a plurality of circuit boards and one or more choke coil inductors mounted on the one or more circuit boards,
The inductor includes a core set,
A coil provided on the core and having connection terminal portions at both ends;
And a part of the core and the coil that covers a part of the coil, and has a mounting part having a hole in the thickness direction on one side or more, and
The circuit module in which the plurality of circuit boards are stacked by screws or fixing tools inserted into the holes.

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