JPS63106132U - - Google Patents
Info
- Publication number
- JPS63106132U JPS63106132U JP20008086U JP20008086U JPS63106132U JP S63106132 U JPS63106132 U JP S63106132U JP 20008086 U JP20008086 U JP 20008086U JP 20008086 U JP20008086 U JP 20008086U JP S63106132 U JPS63106132 U JP S63106132U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- solder
- attached
- board
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案に係る素子取付用基板の半田
取付け状態を示す側面図、第２図は、従来の半田
取付け状態を示す側面図である。
１５…半田ワイヤ、１６…素子取付用基板、１
７…素子取付用の半田。
FIG. 1 is a side view showing a state in which an element mounting board according to the present invention is attached with solder, and FIG. 2 is a side view showing a state in which a conventional solder is attached. 15... Solder wire, 16... Element mounting board, 1
7...Solder for mounting the element.
Claims (1)
取付用の半田を取付けたことを特徴とする素子取
付用基板。 A board for mounting an element, characterized in that solder for mounting the element is attached by ultrasonic bonding of solder wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008086U JPS63106132U (en) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008086U JPS63106132U (en) | 1986-12-26 | 1986-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106132U true JPS63106132U (en) | 1988-07-08 |
Family
ID=31162260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20008086U Pending JPS63106132U (en) | 1986-12-26 | 1986-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106132U (en) |
-
1986
- 1986-12-26 JP JP20008086U patent/JPS63106132U/ja active Pending