JPH0265352U - - Google Patents
Info
- Publication number
- JPH0265352U JPH0265352U JP14407488U JP14407488U JPH0265352U JP H0265352 U JPH0265352 U JP H0265352U JP 14407488 U JP14407488 U JP 14407488U JP 14407488 U JP14407488 U JP 14407488U JP H0265352 U JPH0265352 U JP H0265352U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- attached
- lead frame
- meltable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例を示す平面図およびその基板取付け後の斜視図
、第３図は従来のリード・フレームの平面図であ
る。
１……基板取付け部分、２……リード、３……
ハンダ部、４……集積回路基板。
FIGS. 1 and 2 are a plan view and a perspective view of an embodiment of the present invention, respectively, after the board is attached, and FIG. 3 is a plan view of a conventional lead frame. 1... Board mounting part, 2... Lead, 3...
Solder part, 4... integrated circuit board.
Claims (1)
間を規定のピツチ間隔に固定する溶融可能な物体
片を設けることを特徴とするリード・フレーム。 1. A lead frame characterized in that a meltable piece of material is provided at a portion where it is attached to a hybrid integrated circuit board to fix the leads at a specified pitch interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407488U JPH0265352U (en) | 1988-11-02 | 1988-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407488U JPH0265352U (en) | 1988-11-02 | 1988-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265352U true JPH0265352U (en) | 1990-05-16 |
Family
ID=31411459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14407488U Pending JPH0265352U (en) | 1988-11-02 | 1988-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265352U (en) |
-
1988
- 1988-11-02 JP JP14407488U patent/JPH0265352U/ja active Pending