JPH01116606U - - Google Patents
Info
- Publication number
- JPH01116606U JPH01116606U JP1988013788U JP1378888U JPH01116606U JP H01116606 U JPH01116606 U JP H01116606U JP 1988013788 U JP1988013788 U JP 1988013788U JP 1378888 U JP1378888 U JP 1378888U JP H01116606 U JPH01116606 U JP H01116606U
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- stretchable
- adhesive
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Adhesive Tapes (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は本考案の一使用例を示す断面図、第３図は従
来の一例を示す斜視図、第４図は従来の一使用例
を示す断面図である。
１……シート、２……粘着部、３……シート、
４……チツプ、１１……シート、１２……粘着部
、１３……チツプ。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a cross-sectional view showing an example of use of the present invention, FIG. 3 is a perspective view of a conventional example, and FIG. 4 is a cross-sectional view of a conventional example of use. 1...Sheet, 2...Adhesive part, 3...Sheet,
4... Chip, 11... Sheet, 12... Adhesive part, 13... Chip.
Claims (1)
トの上表面の粘着部と、前記第１のシートの下面
に接合しかつ伸縮性のある第２のシートとを含む
ことを特徴とする粘着シート。 It is characterized by comprising a stretchable first sheet, an adhesive portion on the upper surface of the first sheet, and a stretchable second sheet bonded to the lower surface of the first sheet. adhesive sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988013788U JPH01116606U (en) | 1988-02-03 | 1988-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988013788U JPH01116606U (en) | 1988-02-03 | 1988-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116606U true JPH01116606U (en) | 1989-08-07 |
Family
ID=31517181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988013788U Pending JPH01116606U (en) | 1988-02-03 | 1988-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116606U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6056512A (en) * | 1983-09-07 | 1985-04-02 | 三洋電機株式会社 | Method of dividing compound semiconductor substrate |
-
1988
- 1988-02-03 JP JP1988013788U patent/JPH01116606U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6056512A (en) * | 1983-09-07 | 1985-04-02 | 三洋電機株式会社 | Method of dividing compound semiconductor substrate |