JPS6214794U - - Google Patents
Info
- Publication number
- JPS6214794U JPS6214794U JP10628685U JP10628685U JPS6214794U JP S6214794 U JPS6214794 U JP S6214794U JP 10628685 U JP10628685 U JP 10628685U JP 10628685 U JP10628685 U JP 10628685U JP S6214794 U JPS6214794 U JP S6214794U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- circuit board
- printed circuit
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Description
第１図Ａ，Ｂは本考案の発熱素子放熱構造の図
、第２図は従来の発熱素子放熱構造及びこの時の
回路の図である。
１，２，６，７……発熱素子、４……プリント
基板、８……発熱素子放熱部、９……発熱素子の
取付け用貫通孔。
1A and 1B are diagrams of a heat dissipating structure for a heat generating element according to the present invention, and FIG. 2 is a diagram of a conventional heat dissipating structure for a heat generating element and its circuit. 1, 2, 6, 7...Heating element, 4...Printed circuit board, 8...Heating element heat dissipation section, 9...Through hole for mounting the heating element.
Claims (1)
ある発熱素子にあつて、放熱効果のある面積を有
し前記発熱素子の取付け用貫通孔を有する頭頂部
と、該頭頂部に結合して設けられ頭頂部と前記プ
リント基板との間に前記発熱素子を挿入・配置可
能な高さを有する側面部と、該側面部の一端に設
けられ前記プリント基板へ取付可能な取付け部と
を具備して成ることを特徴とする発熱素子放熱構
造。 In the case of a heating element that needs to be mounted on a printed circuit board in consideration of heat dissipation, the top part has a heat dissipating area and has a through hole for mounting the heat generating element, and the head part is connected to the top part. A side surface having a height that allows the heating element to be inserted and arranged between the top and the printed circuit board, and a mounting section provided at one end of the side surface and attachable to the printed circuit board. A heating element heat dissipation structure featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10628685U JPS6214794U (en) | 1985-07-11 | 1985-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10628685U JPS6214794U (en) | 1985-07-11 | 1985-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214794U true JPS6214794U (en) | 1987-01-29 |
Family
ID=30981500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10628685U Pending JPS6214794U (en) | 1985-07-11 | 1985-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214794U (en) |
-
1985
- 1985-07-11 JP JP10628685U patent/JPS6214794U/ja active Pending