JPS6398644U - - Google Patents

Info

Publication number
JPS6398644U
JPS6398644U JP19482886U JP19482886U JPS6398644U JP S6398644 U JPS6398644 U JP S6398644U JP 19482886 U JP19482886 U JP 19482886U JP 19482886 U JP19482886 U JP 19482886U JP S6398644 U JPS6398644 U JP S6398644U
Authority
JP
Japan
Prior art keywords
heat dissipation
recessed part
cap
escapes
communicates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19482886U
Other languages
Japanese (ja)
Other versions
JPH0445248Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19482886U priority Critical patent/JPH0445248Y2/ja
Publication of JPS6398644U publication Critical patent/JPS6398644U/ja
Application granted granted Critical
Publication of JPH0445248Y2 publication Critical patent/JPH0445248Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による一実施例の一部断面を含
む斜視図、第2図は本考案による一実施例の空冷
実装状態を示す斜視図、第3図は従来技術による
側面図である。 図において、1は放熱ブロツク、1aは通気部
(通気孔)、1bは凹み部、2はLSI、2aは
パツケージ頭部、2bはキヤツプ、3は熱伝導板
、4はプリント配線板、5は外部放熱フインを示
す。
FIG. 1 is a perspective view including a partial cross section of an embodiment of the present invention, FIG. 2 is a perspective view showing an air-cooled mounting state of the embodiment of the present invention, and FIG. 3 is a side view of the prior art. In the figure, 1 is a heat dissipation block, 1a is a ventilation part (ventilation hole), 1b is a recessed part, 2 is an LSI, 2a is a package head, 2b is a cap, 3 is a heat conduction board, 4 is a printed wiring board, and 5 is a External heat dissipation fins are shown.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージ頭部2aを覆い、キヤツプ2bを逃
げる凹み部1bを備え、且つ該凹み部1bと外部
とを連通する通気部1aを備え、外部放熱構造を
接続可能なる平坦な上面を有した高熱伝導性放熱
ブロツク1を固着してなることを特徴とするLS
Iの熱伝導構造。
It has a recessed part 1b that covers the package head 2a and escapes the cap 2b, and also has a ventilation part 1a that communicates the recessed part 1b with the outside, and has a flat top surface that can be connected to an external heat dissipation structure. LS characterized by being formed by fixing the heat dissipation block 1
Thermal conduction structure of I.
JP19482886U 1986-12-17 1986-12-17 Expired JPH0445248Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19482886U JPH0445248Y2 (en) 1986-12-17 1986-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19482886U JPH0445248Y2 (en) 1986-12-17 1986-12-17

Publications (2)

Publication Number Publication Date
JPS6398644U true JPS6398644U (en) 1988-06-25
JPH0445248Y2 JPH0445248Y2 (en) 1992-10-23

Family

ID=31152163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19482886U Expired JPH0445248Y2 (en) 1986-12-17 1986-12-17

Country Status (1)

Country Link
JP (1) JPH0445248Y2 (en)

Also Published As

Publication number Publication date
JPH0445248Y2 (en) 1992-10-23

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