JPS6318851U - - Google Patents
Info
- Publication number
- JPS6318851U JPS6318851U JP11114186U JP11114186U JPS6318851U JP S6318851 U JPS6318851 U JP S6318851U JP 11114186 U JP11114186 U JP 11114186U JP 11114186 U JP11114186 U JP 11114186U JP S6318851 U JPS6318851 U JP S6318851U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- external heat
- protrusions
- heat sink
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
Description
第１図は本考案の一実施例の電力用半導体装置
の取付け構造を示す斜視図、第２図は本考案の応
用例を示す断面図、第３図は従来の電力用半導体
装置の取付け構造を示す斜視図である。
１：電力用半導体素子、２：放熱フイン、３：
凸部、４：外部放熱板、５：庇状突出部。
FIG. 1 is a perspective view showing a mounting structure for a power semiconductor device according to an embodiment of the present invention, FIG. 2 is a sectional view showing an application example of the present invention, and FIG. 3 is a conventional mounting structure for a power semiconductor device. FIG. 1: Power semiconductor element, 2: Heat dissipation fin, 3:
Convex portion, 4: External heat sink, 5: Eave-like protrusion.
Claims (1)
熱板に取付けてなるものにおいて、前記放熱フイ
ン上面に凸部を設けかつ前記外部放熱板の一主面
側に少なくとも前記放熱フインの厚み以上間隔を
あけて相対向する位置より夫々内方へ突出する庇
状突出部を設け、前記外部放熱板の一主面と庇状
突出部で囲まれた空間に前記凸部を含む放熱フイ
ンが挿入され前記電力用半導体素子が前記外部放
熱板に固定されてなることを特徴とする電力用半
導体装置。 A power semiconductor element having heat dissipation fins is attached to an external heat sink, wherein a convex portion is provided on the upper surface of the heat dissipation fin, and a convex portion is provided on one main surface side of the external heat dissipation plate at an interval equal to or greater than the thickness of the heat dissipation fin. Eave-like protrusions projecting inward from opposing positions are provided, and a heat dissipation fin including the protrusions is inserted into a space surrounded by one main surface of the external heat sink and the eave-like protrusions. A power semiconductor device, characterized in that a semiconductor element is fixed to the external heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11114186U JPS6318851U (en) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11114186U JPS6318851U (en) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6318851U true JPS6318851U (en) | 1988-02-08 |
Family
ID=30990788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11114186U Pending JPS6318851U (en) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6318851U (en) |
-
1986
- 1986-07-18 JP JP11114186U patent/JPS6318851U/ja active Pending
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